Share on:

Share on LinkedIn Share on X Share on Facebook Share with email

Testimonial

"In a year when every marketing dollar mattered, I chose to keep I-Connect007 in our 2025 plan. Their commitment to high-quality, insightful content aligns with Koh Young’s values and helps readers navigate a changing industry. "

Brent Fischthal - Koh Young

Suggested Items

Technica Hosts In-House Visit from PCBAA

10/01/2025 | Technica USA
David Schild, Executive Director of PCBAA (Printed Circuit Board Association of America) visited Technica USA to discuss the activity in the market and the advocacy of the PCBAA. The organization was formed to work on Capitol Hill, educating, advocating and getting congressional support to legislate on behalf of building a stronger PCB and substrate manufacturing base in the U.S.A. 

Spiking Neural Networks – Fraunhofer IIS Researches AI Chip for Fiber Optic Networks

10/01/2025 | Fraunhofer
As the consortium leader of the EU-funded project SpikeHERO, Fraunhofer IIS is setting its sights on fiber optic networks over the next four years.

European Semiconductor Industry Endorses Semicon Coalition's Call for Revised EU Chips Act - Cloned

09/30/2025 | SEMI
SEMI Europe, along with over 75 semiconductor and microelectronics companies, research and technology organizations (RTOs) and trade associations, officially endorse the Declaration of the Semicon Coalition.

Cadence, TSMC Team on AI-Driven Flows and IP for Advanced Nodes, 3DFabric

09/25/2025 | BUSINESS WIRE
Cadence announced major advancements in chip design automation and IP, driven by its long-standing relationship with TSMC to develop advanced design infrastructure and accelerate time to market, for AI and HPC customer applications.

Empower Sets New Benchmark with 20x Faster Response and Breakthrough Sustainability Demonstrated at OCP Global Summit 2025

09/25/2025 | Empower Semiconductor
Empower Semiconductor, the world leader in powering AI-class processors, announced that its Crescendo chipset, an artificial intelligence (AI) and high-performance computing (HPC) processor true vertical power delivery platform, is available now for final sampling, with mass production slated for late 2025.
Copyright © I-Connect007 | IPC Publishing Group Inc. All rights reserved. Log in