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Suggested Items

TSMC Fast-Tracks Advanced Chip Technology at Arizona Plant Amid Rising AI Demand

10/27/2025 | I-Connect007 Editorial Team
TSMC said earlier this month that it’s speeding up the rollout of its most advanced chip technology in the US because of rising AI product demand and Intel’s growing competition, The Register reported.

NNME Debuts ChipPath as the Central Gateway for U.S. Semiconductor Careers, Featuring 90,000 Live Job Openings

10/24/2025 | SEMI
To help meet the growing demand for skilled workers in the U.S. semiconductor and microelectronics industry, the National Network for Microelectronics Education (NNME), operated by the SEMI Foundation, announced the launch of ChipPath, a first-of-its-kind, AI-enabled career platform that connects individuals directly to real opportunities across the industry.

eInfochips, NXP Announce Collaboration Focused on Global Distribution and Customer Services

10/23/2025 | PRNewswire
eInfochips, an Arrow Electronics company, and a leading provider of product engineering services, and NXP® Semiconductors, the trusted partner for innovative solutions in the automotive market, announced a multi-year collaboration focused on software distribution and customer services.

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

10/10/2025 | Nolan Johnson, I-Connect007
I-Connect007 has a new monthly digest newsletter, the Advanced Electronic Packaging Digest, and as I was scanning our advanced packaging newsfeeds this week, I came across a primer from tokenring.ai (republished through station WRAL, Raleigh, North Carolina), which I found quite useful. Whether you’re a designer, fabricator, or assembler, the package schemes being developed will change how you work, so be sure to keep your eye on the technological horizon and subscribe to the monthly Advanced Electronic Packaging Digest.

Mercedes-Benz Shapes Future of Autonomous Computing as Co-Creator of Next-Generation Chip Standards with Athos Silicon

10/09/2025 | Mercedes-Benz
Mercedes-Benz announced a reference design collaboration with Athos Silicon, a specialized semiconductor company established by former engineers at Mercedes-Benz Research & Development North America, Inc. (MBRDNA).
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