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Advanced Electronics Packaging Digest

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Stay ahead of the technologies shaping the future of electronics with our latest newsletter, Advanced Electronics Packaging Digest. Get expert insights on advanced packaging, materials, and system-level innovation, delivered straight to your inbox.

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TCL CSOT’s IJP OLED to Enter Branded Monitor and Notebook Products in 2H26

06/18/2026 | TrendForce
TCL CSOT is aggressively promoting inkjet-printed OLED (IJP OLED) technology as a means of entering the OLED monitor and notebook panel supply chain, according to TrendForce’s findings.

TSMC Accelerates CoPoS Development; Taiwan Suppliers Leverage FOPLP for Glass Core Substrates

06/17/2026 | TrendForce
The rapid growth of demand for AI semiconductors is driving the evolution of advanced packaging technologies, with Fan-Out Panel-Level Packaging (FOPLP) emerging as a new battleground across the industry.

Smart Automation: When Traditional Depaneling Methods Reach Their Limits

06/16/2026 | Josh Casper -- Column: Smart Automation
PCB depaneling has traditionally been viewed as a relatively straightforward process in electronics manufacturing. Once the assembly process is complete, boards are separated from the panel and moved downstream for final assembly, test, or packaging. For years, manufacturers have relied on methods such as routing, V-score separation, and punch systems to handle this step efficiently and cost-effectively.

Beagle 2: Lost Mars Lander Finally Honored with Plaques Across the UK

06/09/2026 | UK Space Agency
Beagle 2 touched down on Mars on Christmas Day 2003 but fell silent and was presumed lost for over a decade. In January 2015, NASA imagery confirmed it had landed safely and precisely on target — its silence likely caused by a single solar panel failing to fully deploy.

The Chemical Connection: The Consequences of Additive Metallizing on Etching Steps

06/01/2026 | Don Ball -- Column: The Chemical Connection
This month, I’m taking another look at additive manufacturing. What does mSAP, SAP, and additive metallizing (plating) look like in today’s advanced PCB fabrication? I must confess I don’t have a lot of insight, as my whole career has been devoted to removing copper from panel surfaces in even and controlled ways, and not to putting copper back on the panel. However, at some point in the additive process, especially in additive plating, copper must be removed from between the conducting surfaces to complete the circuits. Here, I can address some of the consequences of additive metallizing on subsequent etching steps.
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