-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueWhat's Your Sweet Spot?
Are you in a niche that’s growing or shrinking? Is it time to reassess and refocus? We spotlight companies thriving by redefining or reinforcing their niche. What are their insights?
Moving Forward With Confidence
In this issue, we focus on sales and quoting, workforce training, new IPC leadership in the U.S. and Canada, the effects of tariffs, CFX standards, and much more—all designed to provide perspective as you move through the cloud bank of today's shifting economic market.
Intelligent Test and Inspection
Are you ready to explore the cutting-edge advancements shaping the electronics manufacturing industry? The May 2025 issue of SMT007 Magazine is packed with insights, innovations, and expert perspectives that you won’t want to miss.
- Articles
- Columns
- Links
- Media kit
||| MENU - smt007 Magazine
Two Indium Corporation Experts to Present at APEC
March 8, 2023 | Indium CorporationEstimated reading time: 2 minutes

Two Indium Corporation experts are set to present at APEC 2023, March 19-23, in Orlando, FL. Senior Research Chemist Dr. Sihai Chen will present a technical poster titled Highly Reliable Silver Sintering Joints for Power Module Applications, while Product Manager Joe Hertline will deliver a presentation titled A Novel Material Technology that Reduces Tooling Dependency and Process Complexity in Power Module Soldering and Sintering Applications.
Dr. Chen’s poster presentation will address the development of silver sintering for high-reliability power modules necessitated by the large-scale production of EVs. Currently used high-lead solder bonding materials cannot meet the criteria for power module assembly, especially under high CTE mismatch conditions. However, silver sintering paste bonded between materials with different CTE mismatches achieved high reliability tested by TST (-65ºC–150ºC, 3min./3min., liquid-to-liquid).
Hertline will present on a novel material technology which, applied during assembly, provides robust tacking strength to reduce the dependency on customized fixturing. The technology reduces process time, energy input, and tooling complexity while minimizing up-front thermal stress applied to the device components, yielding an overall manufacturing cost of ownership reduction for high-reliability power modules. It provides a solution to the growing reliance on complex, costly alignment fixturing as power module designers seek repeatable manufacturing and to achieve high-reliability performance.
Dr. Chen specializes in silver sintering paste product development and has authored several of Indium Corporation’s patents for silver sintering paste, thermal interface materials, heat dissipating paint, and indium bump bonding. Dr. Chen has been published in many of the world’s leading scientific journals, including the Journal of the American Chemical Society, Nano Letters, Langmuir, and The Journal of Physical Chemistry. He has also been a reviewer for some of these publications. Dr. Chen obtained his doctorate in chemistry from the Chinese Academy of Sciences with a focus on metal and semiconductor nanomaterial synthesis. Prior to joining Indium Corporation, he conducted research at Clemson University and Duke University. Dr. Chen also has extensive research experience in nanomaterials in Germany (Max-Plank Gesellschaft scholarship recipient) and Japan (JSPS fellow), as well as in the U.S. He holds a Six Sigma Green Belt and is certified as an IPC Specialist for IPC-A-610.
Hertline is responsible for driving the growth of the power electronics product line through development and implementation of marketing strategies supported by customer experience, emerging technologies, and industry feedback. Hertline also collaborates with Indium Corporation's sales, technical support, R&D, production, and quality teams to serve existing customers and grow new business in his designated market. He earned a bachelor’s degree in mechanical engineering and an MBA from Clarkson University and is a Certified SMT Process Engineer (CSMTPE).
Suggested Items
Driving Innovation: Direct Imaging vs. Conventional Exposure
07/01/2025 | Simon Khesin -- Column: Driving InnovationMy first camera used Kodak film. I even experimented with developing photos in the bathroom, though I usually dropped the film off at a Kodak center and received the prints two weeks later, only to discover that some images were out of focus or poorly framed. Today, every smartphone contains a high-quality camera capable of producing stunning images instantly.
Hands-On Demos Now Available for Apollo Seiko’s EF and AF Selective Soldering Lines
06/30/2025 | Apollo SeikoApollo Seiko, a leading innovator in soldering technology, is excited to spotlight its expanded lineup of EF and AF Series Selective Soldering Systems, now available for live demonstrations in its newly dedicated demo room.
Indium Corporation Expert to Present on Automotive and Industrial Solder Bonding Solutions at Global Electronics Association Workshop
06/26/2025 | IndiumIndium Corporation Principal Engineer, Advanced Materials, Andy Mackie, Ph.D., MSc, will deliver a technical presentation on innovative solder bonding solutions for automotive and industrial applications at the Global Electronics A
Fresh PCB Concepts: Assembly Challenges with Micro Components and Standard Solder Mask Practices
06/26/2025 | Team NCAB -- Column: Fresh PCB ConceptsMicro components have redefined what is possible in PCB design. With package sizes like 01005 and 0201 becoming more common in high-density layouts, designers are now expected to pack more performance into smaller spaces than ever before. While these advancements support miniaturization and functionality, they introduce new assembly challenges, particularly with traditional solder mask and legend application processes.
Knocking Down the Bone Pile: Tin Whisker Mitigation in Aerospace Applications, Part 3
06/25/2025 | Nash Bell -- Column: Knocking Down the Bone PileTin whiskers are slender, hair-like metallic growths that can develop on the surface of tin-plated electronic components. Typically measuring a few micrometers in diameter and growing several millimeters in length, they form through an electrochemical process influenced by environmental factors such as temperature variations, mechanical or compressive stress, and the aging of solder alloys.