-
- News
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current IssueInventing the Future with SEL
Two years after launching its state-of-the-art PCB facility, SEL shares lessons in vision, execution, and innovation, plus insights from industry icons and technology leaders shaping the future of PCB fabrication.
Sales: From Pitch to PO
From the first cold call to finally receiving that first purchase order, the July PCB007 Magazine breaks down some critical parts of the sales stack. To up your sales game, read on!
The Hole Truth: Via Integrity in an HDI World
From the drilled hole to registration across multiple sequential lamination cycles, to the quality of your copper plating, via reliability in an HDI world is becoming an ever-greater challenge. This month we look at “The Hole Truth,” from creating the “perfect” via to how you can assure via quality and reliability, the first time, every time.
- Articles
- Columns
- Links
- Media kit
||| MENU - pcb007 Magazine
Paige Fiet: Forging a New Path
March 15, 2023 | Patty Goldman, I-Connect007Estimated reading time: 3 minutes

As a young industry professional, Paige Fiet, a process engineer at TTM Logan, sees mentorship as a formative component of her success in IPC. Alongside the support and guidance of her mentors, Paige has distinguished herself as an emerging leader who brings a fresh perspective to the many topics currently of interest to the industry.
Patty Goldman: Paige, you’re now a Rising Star with IPC. Congratulations. Do you have any special mentors who have helped you through your journey with IPC and perhaps in your career, in general?
Fiet: Yes, I had a mentor in college, Dr. Chris Middlebrook. He was one of my college professors and we’re still pretty close, talking every other week. He started my involvement with IPC by helping me join the IPC student chapter at my college and then later recommending me for the student liaison position on the IPC Board of Directors. He’s been very pivotal in getting me started in my career. He’s been a voice of reason through everything, whenever I need him.
Goldman: Is there anyone at IPC meetings who helped you learn the ropes?
Fiet: Dr. Milea Kammer of Honeywell was the chair of a few of the larger committees, and she’s just a handful of years older than me; I really look up to her. I like to see what she’s done to know where I can go. She’s also mentoring me right now as a chair of the committee.
Goldman: What technologies in our industry have you most excited?
Fiet: I think that finer spaces and traces and getting into substrates is really fascinating and I can’t wait to see where that takes off.
Goldman: There’s been a lot of talk about advanced packaging. I’m sure that is of great interest to you.
Fiet: It is, yeah.
Goldman: You’ll be in the thick of it. How has IPC helped you with your career?
Fiet: I think it’s really helped me understand what I do every day. I work in manufacturing, and I use the standards every single day. I love being part of the groups that make them because I use them.
Goldman: Has it been a learning experience? This is probably an understatement.
Fiet: That’s a huge understatement. I feel like I was staring into the deep end of a pool and I’m learning how to swim again. There is so much to be involved with; I’m never bored.
Goldman: How would you like to see your involvement with IPC going forward?
Fiet: I’d love to continue being an active member in the committee meetings. I’m currently co-chairing a couple of committees and I hope to do more of that in the future. I also want to keep attending IPC APEX EXPO and SummerCom, and to keep networking.
Goldman: Which committees are you involved with?
Fiet: I am vice chair of the 5-33B Solder Mask Performance Task Group and co-chair of the 7-24A Printed Board Process Effects Handbook Task Group.
Goldman: I started out on the troubleshooting guide and chaired that myself for quite a long time. You learn so much working on documents.
Fiet: Full circle moment.
Goldman: Any other final thoughts and your fresh perspective?
Fiet: The industry has changed so much in the past 40 or 50 years, so I can’t imagine what I will see in my lifetime in my career—that’s exciting.
Goldman: Thank you so much for your time. Congratulations again and I think you’ll find that no matter where you work, you’ll probably always be involved with IPC.
Fiet: Yes, that’s the plan.
This interview originally appeared in the 2023 edition of Real Time with... IPC APEX EXPO Show & Tell Magazine.
Testimonial
"We’re proud to call I-Connect007 a trusted partner. Their innovative approach and industry insight made our podcast collaboration a success by connecting us with the right audience and delivering real results."
Julia McCaffrey - NCAB GroupSuggested Items
Koh Young, Fuji, and Kurtz ERSA Drive Smart Manufacturing Solutions for EV and Automotive Electronics at Kunshan, China Technical Seminar
09/11/2025 | Koh YoungKoh Young Technology, the global leader in True 3D measurement-based inspection solutions, partnered with Fuji Corporation and Kurtz ERSA to host an exclusive technical seminar for leading automotive manufacturers in East China. Held on September 4 at Fuji’s factory in Kunshan, the event gathered participants representing over 35 companies.
MacDermid Alpha Presents at SMTA New Delhi, Bangalore Chapter, on Flux–OSP Interaction
09/09/2025 | MacDermid Alpha Electronics SolutionsMacDermid Alpha contributes technical insights on OSP solderability at the Bangalore Chapter, SMTA reinforcing commitment to knowledge-sharing and industry collaboration.
Electra’s ElectraJet EMJ110 Inkjet Soldermask Now in Black & Blue at Sunrise Electronics
09/08/2025 | Electra Polymers LtdFollowing the successful deployment of Electra’s Green EMJ110 Inkjet Soldermask on KLA’s Orbotech Neos™ platform at Sunrise Electronics in Elk Grove Village, Illinois, production has now moved beyond green.
Absolute EMS: The Science of the Perfect Solder Joint
09/05/2025 | Absolute EMS, Inc.Absolute EMS, Inc., a six-time award-winning provider of fast turnaround, turnkey contract electronic manufacturing services (EMS), is drawing attention to the critical role of 3D Solder Paste Inspection (SPI) in ensuring the reliability of both FLEX and rigid printed circuit board assemblies (PCBAs).
Indium Corporation to Highlight High-Reliability Solder Solutions at SMTA Guadalajara Expo
09/04/2025 | Indium CorporationIndium Corporation, a leading materials refiner, smelter, manufacturer, and supplier to the global electronics, semiconductor, thin-film, and thermal management markets, will feature a range of innovative, high-reliability solder products for printed circuit board assembly (PCBA) at the SMTA Guadalajara Expo and Tech Forum, to be held September 17-18 in Guadalajara, Mexico.