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Looking Ahead to productronica, and a Stronger European Electronics Ecosystem

11/13/2025 | Marcy LaRont, I-Connect007
Next week at productronica, the Global Electronics Association Europe will be hosting a full program each day of the show at their booth in Hall A1. Philippe Leonard, head of the Association’s European office, recently shared what’s happening for our industry in Europe, details of the Hand Soldering World Championship at the show, a preview of a new Cable & Wire Harness competition kicking off in 2026, and information about the impressive lineup of speakers at the Electronics Industry Forum at the Association’s booth.

Mexico's Moment in Electronics Manufacturing

11/12/2025 | Lorena Villanueva, Global Electronics Association Mexico
On a weekday morning in the Bajío, Mexico, a training lab reviews accept/reject criteria before a line changeover. By mid-afternoon, a cross-border shipment clears in El Paso that left Ciudad Juárez at dawn. Farther south, a university team finalizes intake for a new electronics pathway blending online modules with factory practicums. These scenes—routine yet transformative—explain whyMexico is becoming the most strategic partner for the United States to ensure a resilient, innovative, and sovereign electronics supply chain in North America.

MacDermid Alpha Electronics Solutions to Feature an Integrated Materials Platform Engineered for Long-Term Reliability at Productronica

11/12/2025 | MacDermid Alpha Electronics Solutions
Every advancement in electronics raises expectations for enhanced performance and environmental stewardship. Meeting these challenges demands materials engineered for reliability and developed to support sustainable manufacturing. Industry momentum across connected devices, high-reliability automotive electronics, and rapidly increasing compute density is elevating the role of materials selection as a core driver of long-term system performance. 

Advanced Electronics Packaging Digest: Third Issue Arrives November 17

11/12/2025 | I-Connect007
The third issue of Advanced Electronics Packaging Digest launches Monday, November 17. This issue continues AEPD’s mission to deliver forward-looking analysis and insider perspectives on the technologies reshaping advanced electronics packaging. Among the highlights is a review of IMPACT 2025, where discussions on component-to-system-level integration took center stage as experts explored the challenges and breakthroughs driving advanced packaging technologies.

Questex Refocuses Fierce Electronics Brand to Fierce Sensors

11/12/2025 | Globe Newswire
Questex announces the rebranding of Fierce Electronics to Fierce Sensors, leveraging its content mission to become the definitive platform for sensors-focused news, insights, and community engagement.
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