Intel Contributes AI Acceleration to PyTorch 2.0
March 17, 2023 | IntelEstimated reading time: 1 minute

?In the release of Python 2.0, contributions from Intel using Intel® Extension for PyTorch , oneAPI Deep Neural Network Library (oneDNN) and additional support for Intel® CPUs enable developers to optimize inference and training performance for artificial intelligence (AI).
As part of the PyTorch 2.0 compilation stack, the TorchInductor CPU backend optimization by Intel Extension for PyTorch and PyTorch ATen CPU achieved up to 1.7 times faster FP32 inference performance when benchmarked with TorchBench, HuggingFace and timm.1 This update brings notable performance improvements to graph compilation over the PyTorch eager mode.
Other optimizations include:
- Improved message-passing between adjacent neural network nodes to support graph neural network in PyTorch Geometric (PyG) for enhanced inference and performance training on Intel CPUs.
- New x86 quantization backend – a combination of FBGEMM (Facebook General Matrix-Matrix Multiplication) and oneDNN backends – replaces FBGEMM as the default quantization backend for x86 CPU platforms to enable better end-to-end int8 inference performance.
- Extended use of oneDNN with oneDNN Graph API to maximize efficient code generation on AI hardware by automatically identifying the graph partitions to be accelerated through fusion. BFloat16 and Float32 data types are supported and only inference workloads can be optimized; BF16 is only optimized on machines with AVX512_BF16 ISA support.
Suggested Items
Hanon Systems Wins Third PACE Award for Visible-Light LED Photocatalyst Technology
04/18/2025 | PRNewswireHanon Systems, a leading global automotive thermal management supplier and subsidiary of Hankook & Company Group, has been named a winner of the 2025 PACE Awards. This marks the company's third win, making it the first Korean supplier to achieve this recognition.
Indium to Feature Materials Solutions Powering Sustainability at PCIM Europe
04/15/2025 | Indium CorporationIndium Corporation specializes in power device packaging, offering a portfolio of advanced material solutions encompassing the entire assembly, including die-attach, top-side die interconnect, substrate-attach, package-attach, and PCB assembly.
Worldwide Smartphone Market Grew 1.5% in Q1 2025, Amid On-going US-China Trade Tension
04/15/2025 | IDCAccording to preliminary data from the International Data Corporation (IDC) Worldwide Quarterly Mobile Phone Tracker , global smartphone shipments increased 1.5% year-over-year (YoY) to 304.9 million units in the first quarter of 2025 (1Q25).
Saki’s AXI Upgrade Enhances Image Noise Reduction for Power Modules, Enabling Sharper, More Accurate Inspections
04/11/2025 | Saki CorporationSaki Corporation, an innovator in the field of automated optical and X-ray inspection equipment, announces significant enhancements to the image processing capabilities of its 3Xi-M200 X-ray Automated Inspection (AXI) system.
DuPont Ikonic 9000 CMP Pads Win 2025 Edison Award
04/09/2025 | DuPontDuPont announced that its Ikonic™ 9000 series of polishing pads for chemical mechanical planarization (CMP) was awarded a 2025 Bronze Edison Award™ in the AI-driven advancements category.
Copyright © 2025 I-Connect007 | IPC Publishing Group Inc. All rights reserved.
Log in