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I-Connect007 Releases New Episode of Meet the Author Podcast: Spotlight on Complex PCB Design

12/10/2024 | I-Connect007
I-Connect007 is thrilled to announce the latest installment of its Meet the Author podcast series, hosted by Nolan Johnson. In this episode, Johnson interviews Scott Miller and Brian White of Freedom CAD, who share their expertise on complex PCB design.

Sondrel Now Shipping Chips as Part of a Complete Turnkey Project

12/09/2024 | Sondrel
Sondrel has announced that it is now shipping finished chips to a US customer as part of a full turnkey contract of concept to silicon. The chips are accelerators for AI, which is one of Sondrel’s speciality areas as it requires high performance, ultra-complex custom designs on leading edge nodes.

SMTA Announces Program for 2025 Ultra High Density Interconnect (UHDI) Symposium

11/26/2024 | SMTA
The SMTA is excited to announce the technical program for the second annual Ultra High Density Interconnect Symposium which takes place on January 23, 2025 in Peoria, Arizona, USA.

Siemens Extends Veloce with Innexis Shift-Left Software

11/07/2024 | Siemens
Siemens Digital Industries Software announced the Innexis product suite, a complement to its industry leading Veloce™ hardware-assisted verification and validation system.

Designers Notebook: Implementing HDI and UHDI Circuit Board Technology

10/23/2024 | Vern Solberg -- Column: Designer's Notebook
To accommodate new generations of high I/O semiconductor packaging, circuit board technology has undergone significant changes in both the fabrication process method and the criteria for base material selection. The reason behind these changes is the new high-function semiconductor package families that require more terminals than their predecessors and a significantly narrower terminal pitch.
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