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Advanced Electronics Packaging Digest

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Suggested Items

Faster BGA Warpage Processing Without Shearing or Painting

10/21/2026 | Chris Gastaldo and Neil Hubble, Akrometrix
The process of measuring BGA samples for thermal warpage is subject to industry standards from both JEDEC, in JESD22-B112C and JEITA ED7306. Additionally, these standards establish allowable warpage values based on ball size and ball pitch, for the JEDEC standard, pass/fail further established in JEDEC SPP-024.3 Standard practice in these standards for measuring BGA warpage is to remove the solder balls in order to measure only the substrate surface. However, as both ball size and package thickness decrease, the practicality of removing solder balls without altering the sample shape has become increasingly challenging.

GÖPEL electronic Introduces New Multi Line AXI 3D-CT X-Ray Inspection System

09/03/2026 | GÖPEL electronic
For years, GÖPEL electronic has been a leader in the field of inspection and non-destructive, comprehensive assembly testing at all levels.

Sony Semiconductor Solutions and TSMC Agreed to Establish Joint Venture for Next-Generation

08/11/2026 | TSMC
Sony Semiconductor Solutions Corporation and Taiwan Semiconductor Manufacturing Company Limited (TSMC) announced the execution of a legally binding definitive agreement for the establishment of Advanced Vision Semiconductor Manufacturing Corporation as a joint venture (JV) in Koshi City, Kumamoto Prefecture, Japan.

RTX's Raytheon Completes Design Review of Landsat Next Space Instruments

05/19/2026 | RTX
Raytheon, an RTX business, has successfully completed the preliminary design review for NASA's Landsat Next Instrument Suite (LandIS).

Sony Semiconductor Solutions, TSMC Enter Preliminary Agreement for Next-Generation Image Sensor Strategic Partnership

05/08/2026 | TSMC
Sony Semiconductor Solutions Corporation and TSMC announced the signing of a non-binding memorandum of understanding (MOU) to form a strategic partnership for the development and manufacturing of next-generation image sensors.
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