Beyond the Board: Early Engagement Means Faster Prototyping for Defense Programs
Defense Speak Interpreted: The Autonomous Plane Battle—Skyborg Vs. Loyal Wingman
American Made Advocacy: Congress Back from Break With Work To Do
CAES Awarded Contract to Provide US Navy with AN/ALQ-99 Low Band Consolidation Transmitters
April 6, 2023 | Business WireEstimated reading time: 1 minute
CAES, a leading provider of mission-critical advanced RF technology, has been awarded a contract from the US Navy for the initial pre-production phase of the AN/ALQ-99 Low Band Consolidation (LBC) transmitter. The LBC is a modification to the AN/ALQ-99 Low Band Transmitter.
“We are proud to support the US Navy with our engineering and manufacturing expertise to deliver high-performance advanced RF technologies,” said Mike Kahn, president and CEO, CAES. “We have been investing to advance the system capabilities and SWaP for these applications and are excited to see it in use.”
Having delivered more than 850 jammers across the last several decades, CAES continues to deliver products at the forefront of US Navy and Royal Australian Air Forces’ (RAAF) EA-18G operations worldwide. CAES transmitters are designed, built and tested to provide high power across multiple octave bandwidths, which allows them to withstand the demanding and severe environment of maritime, Tactical Aviation (TACAIR) aircraft operating from US Navy Aircraft Carriers. They also provide high reliability with low maintenance costs.
CAES developed, produced and delivered LBT transmitters for the US Navy and RAAF EA-18G Growler Airborne Electronic Attack Fleets. These RF jamming transmitters played a critical role in protecting the lives of US and Coalition forces during Operation Iraqi Freedom, Operation Enduring Freedom and across the Global War on Terror.
Share on:
Testimonial
"We’re proud to call I-Connect007 a trusted partner. Their innovative approach and industry insight made our podcast collaboration a success by connecting us with the right audience and delivering real results."
Julia McCaffrey - NCAB GroupSuggested Items
Light-curable Solutions for Reliable Electronics in Space Applications
10/15/2025 | Virginia Hogan, DymaxDesigning electronics for space environments, particularly those in low Earth orbit (LEO), requires careful consideration of materials that can withstand extreme conditions while supporting long-term reliability. Engineers designing satellite systems, aerospace instrumentation, and high-altitude platforms face a familiar set of challenges: contamination control, mechanical stress, thermal cycling, and manufacturability.
Is Glass Finally Coming of Age?
10/13/2025 | Nolan Johnson, I-Connect007Substrates, by definition, form the base of all electronic devices. Whether discussing silicon wafers for semiconductors, glass-and-epoxy materials in printed circuits, or the base of choice for interposers, all these materials function as substrates. While other substrates have come and gone, silicon and FR-4 have remained the de facto standards for the industry.
Global PCB Connections: Understanding Your Fabricator’s Capabilities (or Niche)
10/08/2025 | Markus Voeltz -- Column: Global PCB ConnectionsNot every PCB fabricator is a good fit for every design. This is something many seasoned OEMs and greenhorn designers learn the hard way. The industry is full of talented board shops: global giants, regional specialists, niche fabricators, and everything in between. But even the best shop can fail a job if it's not the right fit for that specific board, volume, or customer requirement.
American Standard Circuits to Exhibit at SMTA International
10/06/2025 | American Standard CircuitsAnaya Vardya, President, and CEO of American Standard Circuits/ASC Sunstone Circuits has announced that his company will once again exhibit at SMTA International 2025 to be held at the Donald E Stephens Convention Center in Rosemont, Illinois on October 19th through the 23rd, 2025.
Highlights from the IMAPS Onshoring Advanced Packaging Workshop in Washington, D.C.
09/30/2025 | Marcy LaRont, I-Connect007IMAPS and the Global Electronics Association co-hosted the Onshoring Advanced Packaging and Assembly Workshop in Washington, D.C., in early September. Government leaders, including those from the Department of Defense, attended and were directly involved in organizing the content of the sessions. Jim Will, director of the U.S. Partnership for Assured Electronics, speaks about his role in the event.