The Government Circuit: News on Defense Electronics, Europe, and Sustainability
American Made Advocacy: Taking the Fight to Capitol Hill
Defense Speak Interpreted: SWaPing Nanosatellites for Defense Systems
CAES Awarded Contract to Provide US Navy with AN/ALQ-99 Low Band Consolidation Transmitters
April 6, 2023 | Business WireEstimated reading time: 1 minute
CAES, a leading provider of mission-critical advanced RF technology, has been awarded a contract from the US Navy for the initial pre-production phase of the AN/ALQ-99 Low Band Consolidation (LBC) transmitter. The LBC is a modification to the AN/ALQ-99 Low Band Transmitter.
“We are proud to support the US Navy with our engineering and manufacturing expertise to deliver high-performance advanced RF technologies,” said Mike Kahn, president and CEO, CAES. “We have been investing to advance the system capabilities and SWaP for these applications and are excited to see it in use.”
Having delivered more than 850 jammers across the last several decades, CAES continues to deliver products at the forefront of US Navy and Royal Australian Air Forces’ (RAAF) EA-18G operations worldwide. CAES transmitters are designed, built and tested to provide high power across multiple octave bandwidths, which allows them to withstand the demanding and severe environment of maritime, Tactical Aviation (TACAIR) aircraft operating from US Navy Aircraft Carriers. They also provide high reliability with low maintenance costs.
CAES developed, produced and delivered LBT transmitters for the US Navy and RAAF EA-18G Growler Airborne Electronic Attack Fleets. These RF jamming transmitters played a critical role in protecting the lives of US and Coalition forces during Operation Iraqi Freedom, Operation Enduring Freedom and across the Global War on Terror.
Share on:
Suggested Items
Sluggish Telecom Market Growth Prompts Operators to Become Full-Stack Technology Suppliers
11/18/2024 | IDCWorldwide spending on telecommunications and pay TV services will reach $1,544 billion in 2024, representing an increase of 2.4% year-on-year, according to the Worldwide Semiannual Telecom Services Tracker published by International Data Corporation (IDC).
UHDI Fundamentals: UHDI Bleeding-edge Manufacturing Applications, Part 1
11/14/2024 | Anaya Vardya, American Standard CircuitsLast month, I talked about ultra high definition interconnect (UHDI) in relation to entertainment applications. This month, I will explain bleeding-edge UHDI applications in manufacturing, which are revolutionizing the industry by enabling ultra-precise visual data transmission, high-speed communication between devices, and real-time monitoring. These UHDI technologies help manufacturers achieve higher efficiency, better quality control, and greater automation. Following are some leading-edge manufacturing applications of UHDI in manufacturing.
Global PCB Connections: A Technical Overview of Long-flex Printed Circuit Boards
11/14/2024 | Jerome Larez -- Column: Global PCB ConnectionsFlex printed circuit boards are an essential advancement in the electronics industry, enabling the development of flexible, lightweight, and durable electronic designs. As technology has evolved, long-flex PCBs have emerged as a key component in applications requiring extended or intricate routing paths. Because of their use in automotive, commercial, and medical devices, designers are becoming more comfortable designing PCBs with this technology. This column will explore their attributes and role in modern products. I will also offer some essential tips for designing with manufacturability in mind.
Automating Test Processes in Modern PCBA Manufacturing
11/12/2024 | Josh Casper, Horizon SalesICT and functional test play critical roles in the electronics manufacturing process. In many cases, these processes are the final line of defense in identifying defects, preventing failures from reaching the end user, and safeguarding a manufacturer's reputation. A growing problem in this area has been the sheer increase in production output from the SMT line. As components get smaller, PCBs will continue shrinking, allowing engineers to design highly panelized products.
Exploring Innovation Through Alternate Metals and Sputtering
11/11/2024 | Marcy LaRont, I-Connect007Dr. Evelyne Parmentier has a PhD in physical chemistry from ETH Zurich. She was born in Luxembourg and is now a proud resident of Switzerland, where she has been part of Dyconex’s R&D engineering team for the past two years. Evelyne gave a presentation at the EIPC Summer Conference titled “Functionalization of Printed Circuit Boards Through Introducing Alternate Metals Through Sputtered Layers,” where she asked her audience, “If there are 93 metals in the periodic table, why are we not using more of them?”