-
-
News
News Highlights
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current IssueThe Hole Truth: Via Integrity in an HDI World
From the drilled hole to registration across multiple sequential lamination cycles, to the quality of your copper plating, via reliability in an HDI world is becoming an ever-greater challenge. This month we look at “The Hole Truth,” from creating the “perfect” via to how you can assure via quality and reliability, the first time, every time.
In Pursuit of Perfection: Defect Reduction
For bare PCB board fabrication, defect reduction is a critical aspect of a company's bottom line profitability. In this issue, we examine how imaging, etching, and plating processes can provide information and insight into reducing defects and increasing yields.
Voices of the Industry
We take the pulse of the PCB industry by sharing insights from leading fabricators and suppliers in this month's issue. We've gathered their thoughts on the new U.S. administration, spending, the war in Ukraine, and their most pressing needs. It’s an eye-opening and enlightening look behind the curtain.
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - pcb007 Magazine
Cadence’s Allegro X AI Offers 10X Reduction in Turnaround Time
April 6, 2023 | Cadence Design Systems, Inc.Estimated reading time: 1 minute

Cadence Design Systems has announced the Cadence Allegro X AI technology, a next-generation system design technology that offers revolutionary improvements in performance and automation. The new AI offering is built on and accessed through the Allegro X Design Platform and offers transformative time savings for PCB design, with placement and routing (P&R) tasks reduced from days to minutes and with equivalent or higher quality compared with manually designed boards.
P&R in PCB design is traditionally a manual time-intensive process that impacts time-to-market. The Allegro X AI technology leverages the scalability of the cloud for physical design automation, offering generative design of the PCB while ensuring the design is electrically correct and manufacturable. The new technology automates placement, metal pouring, and critical net routing, and is integrated with fast signal integrity and power integrity analysis. Using the generative AI capabilities, customers can streamline their system design process achieving a 10X or more reduction in PCB design turnaround time.
The Allegro X AI technology enables the following benefits:
- Improved Productivity: Dramatic reduction in design turnaround time by automating placement, leveraging a scalable architecture that uses compute infrastructure on the cloud.
- Better Quality of Results: Placement automation using generative AI enables feasibility analysis in the early phases of design. Exploring a much larger solution space than what is possible through manual methods, the technology drives optimization of metrics such as shorter wire lengths while adhering to the design constraints.
- Efficient Design Closure: Integrated tightly with system analysis technologies through the Allegro X Platform where the user can optimize the designs for electrical and thermal performance.
“Cadence is committed to delivering system design solutions that incorporate the power of AI and cloud technology to ensure the fastest turnaround times,” said Michael Jackson, corporate vice president of R&D at Cadence. “The new Allegro X AI technology extends Cadence’s technology leadership in PCB design and provides a transformative impact, offering customers greater productivity through AI-powered automation, improved engine performance and integration with Cadence’s system design and analysis product portfolio.”
The new Allegro X AI technology supports Cadence’s Intelligent System Design strategy, which enables customers to accelerate system innovation. Customers can learn more at www.cadence.com/go/AllegroXAI.
Suggested Items
Insulectro & Dupont Host Technology Symposium at Silicon Valley Technology Center June 25
06/22/2025 | InsulectroInsulectro, the largest distributor of materials for use in the manufacture of PCBs and printed electronics, and DuPont, a major manufacturer of flex laminates and chemistry, invite fabricators, OEMS, designers, and engineers to attend an Innovation Symposium – Unlock the Power - this Wednesday, June 25, at DuPont’s Silicon Valley Technology Center in Sunnyvale, CA.
OKI, NTT Innovative Devices Establish Mass Production Technology for High-Power Terahertz Devices by Heterogeneous Material Bonding
06/21/2025 | BUSINESS WIREOKI, in collaboration with NTT Innovative Devices Corporation, has established mass production technology for high-power terahertz devices using crystal film bonding (CFB) technology for heterogeneous material bonding to bond indium phosphide (InP)-based uni-traveling carrier photodiodes (UTC-PD) onto silicon carbide (SiC) with excellent heat dissipation characteristics for improved bonding yields.
The Evolution of Picosecond Laser Drilling
06/19/2025 | Marcy LaRont, PCB007 MagazineIs it hard to imagine a single laser pulse reduced not only from nanoseconds to picoseconds in its pulse duration, but even to femtoseconds? Well, buckle up because it seems we are there. In this interview, Dr. Stefan Rung, technical director of laser machines at Schmoll Maschinen GmbH, traces the technology trajectory of the laser drill from the CO2 laser to cutting-edge picosecond and hybrid laser drilling systems, highlighting the benefits and limitations of each method, and demonstrating how laser innovations are shaping the future of PCB fabrication.
Day 2: More Cutting-edge Insights at the EIPC Summer Conference
06/18/2025 | Pete Starkey, I-Connect007The European Institute for the PCB Community (EIPC) summer conference took place this year in Edinburgh, Scotland, June 3-4. This is the third of three articles on the conference. The other two cover Day 1’s sessions and the opening keynote speech. Below is a recap of the second day’s sessions.
Hon Hai Research Institute Achieves Breakthrough in Quantum Cryptography Recognized by Leading Global Conference
06/17/2025 | FoxconnHon Hai Research Institute (HHRI), the research arm of Hon Hai Technology Group (Foxconn), the world’s largest electronics manufacturer and technology service provider, has achieved a significant breakthrough in quantum computing.