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Current IssueThe Path Ahead
What are you paying the most attention to as we enter 2025? Find out what we learned when we asked that question. Join us as we explore five main themes in the new year.
Soldering Technologies
Soldering is the heartbeat of assembly, and new developments are taking place to match the rest of the innovation in electronics. There are tried-and-true technologies for soldering. But new challenges in packaging, materials, and sustainability may be putting this key step in flux.
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Analytics is a given in this industry, but the threshold is changing. If you think you're too small to invest in analytics, you may need to reconsider. So how do you do analytics better? What are the new tools, and how do you get started?
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Learn about KIC’s Heat to Data Solutions at SMTconnect – Machine Tracking and Automatic Profiling
April 10, 2023 | KICEstimated reading time: 1 minute
KIC will exhibit in Hall 4, Booth #126 at SMTconnect, scheduled to take May 9-11, 2023, in Nuremburg, German. KIC provides the most accurate Heat to Data solutions including its award-winning support with onsite service and application knowledge from the thermal process experts.
KIC provides Heat to Data Solutions for all electronics assembly and semiconductor packaging Thermal Processes. Its solutions cover Machine Performance Tracking with Heat Transfer IndexTM - automated NPI recipe setup - Thermal Profile Optimization – Automation for Traceable Audit Data with Automatic Profiling and Profile Inspection. KIC is the inventor of automatic profiling and real-time process inspection with RPI and WPI for reflow/cure/wave. The company continues to innovate with a complete ecosystem of solutions for its customers’ manufacturing requirements.
Machine Performance Tracking
- Smart Reflow Analyzer - detecting oven performance to make maintenance more effective and precise. Easily identify changes: heat transfer with HTITM, temperature, and speed.
- Wave Surfer – Track preheat peak temperatures and ramp rates, and peak temperature and dwell time through the wave.
Profile Setup, Optimization, and Verification
- SPS Smart Profiler with AutoFocus and Navigator automated NPI oven setup and optimization tools. Used across all factory floor thermal processes (soldering, curing, rework, etc.)
Automation and Inspection
- An infinite number of automation possibilities across five different platforms for a customized solution specifically for your requirements. Something for every budget and every requirement.
- The most options available – always the most accurate and independent monitoring solutions.
- From simple automatic profiling to fully integrated real-time profile inspection traceability and process control, and everything in between.
- Always with our award-winning onsite service and application support in every region worldwide, with the experience and knowledge from the thermal process experts, KIC.
Suggested Items
SolderKing to Highlight Innovations in Soldering and Manufacturing Efficiency at Southern Manufacturing & Electronics 2025
01/08/2025 | SolderKing Assembly Materials Ltd,SolderKing, a leading UK manufacturer of advanced soldering materials and consumables, will be exhibiting at the Southern Manufacturing and Electronics Show from 4-6 February 2025 at the Farnborough International Exhibition Centre, Stand J90.
IPC Announces UK Regional Qualification for Hand Soldering Competition
01/02/2025 | IPCIPC invites skilled soldering experts to participate in the UK Regional Qualification for the IPC Hand Soldering Competition (HSC) on February 4-6, 2025, at the Farnborough International Exhibition Centre.
Book Excerpt: The Printed Circuit Assembler’s Guide to... Low-Temperature Soldering, Vol. 2, Chapter 5
12/23/2024 | I-Connect007 Editorial TeamChapter 5 introduces the advantages of using low-temperature soldering for through-hole components, including cost efficiency, reliability improvement, and reduced warpage. Also covered: the evaluation of different fluxes and the performance of HRL3 in wave soldering and selective soldering processes.
Overview of Soldering Systems With Vacuum
12/18/2024 | Dr. Paul Wild, Rehm Thermal Systems GmbHWhen soldering electronic assemblies, the focus of the vacuum application is on the removal of volatile substances from the solder joints and the associated reduction of pore formation. Particularly in the thermal management of power electronics components, pores can cause so-called hotspots with higher temperatures due to their poor heat conduction. These hotspots can lead to overheating of the components on the one hand and to thermally induced destruction of the solder structure on the other.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
12/13/2024 | Andy Shaughnessy, I-Connect007This week, Peter Tranitz discusses the upcoming Pan-European Electronics Design Conference, set for Jan. 29-30 in Vienna, Austria. Pete Starkey brings us a review of the most recent EIPC Technical Snapshot webinar, which featured a global PCB maker update by Dr. Hayao Nakahara. Don't miss our interview with Manfred Huschka, who explains how companies can begin their own China Plus One plan. Stan Farnsworth breaks down photonic soldering and discusses its use in soldering materials that are not typically compatible. I also enjoyed Dan Beaulieu’s discussion on the value of consistency, and why just showing up for work is half the battle, especially in an inconsistent, evolving industry like ours.