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Indium Corporation Announces New High-Reliability, Low-Temperature Alloy
April 11, 2023 | Indium CorporationEstimated reading time: Less than a minute

Indium Corporation has released a new, bismuth-based low-temperature alloy developed for low-temperature reflow processes which require enhanced thermal cycling reliability.
Indalloy303, also known as Bi+, is an innovative alloy that retains the low reflow temperatures required for temperature-sensitive processes while enhancing the lifetime reliability of the solder joint beyond that of traditional low-temperature solders.
As a low-temperature, Pb-free solution, Indalloy 303 offers:
- A reflow temperature as low as 170?
- Excellent thermal cycling performance
- Resistance to hot tearing
- Compatibility with SAC in hybrid BGA joints
- Low voiding
Indalloy303’s flux vehicle, Indium5.7LT-1, is an air-reflow, halogen-free, no-clean solder paste designed for assembly processes using Bi-based and In-containing low-temperature alloys. It delivers:
- Superior print transfer efficiency
- Clear post-reflow flux residue
- Solder bead and solder ball minimization
- Exceptional wetting on OSP, Immersion Ag, Immersion Sn, and ENIG
- Excellent coalescence of small deposits
- Outstanding SIR performance under challenging low-temperature reflow conditions
Testimonial
"Our marketing partnership with I-Connect007 is already delivering. Just a day after our press release went live, we received a direct inquiry about our updated products!"
Rachael Temple - AlltematedSuggested Items
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Koh Young Appoints Tom Hattori as President of Koh Young Japan
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Silicon Mountain Contract Services Enhances SMT Capabilities with New HELLER Reflow Oven
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Knocking Down the Bone Pile: Addressing End-of-life Component Solderability Issues, Part 4
07/16/2025 | Nash Bell -- Column: Knocking Down the Bone PileIn 1983, the Department of Defense identified that over 40% of military electronic system failures in the field were electrical, with approximately 50% attributed to poor solder connections. Investigations revealed that plated finishes, typically nickel or tin, were porous and non-intermetallic.
SHENMAO Strengthens Semiconductor Capabilities with Acquisition of PMTC
07/10/2025 | SHENMAOSHENMAO America, Inc. has announced the acquisition of Profound Material Technology Co., Ltd. (PMTC), a premier Taiwan-based manufacturer of high-performance solder balls for semiconductor packaging.