-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueIntelligent Test and Inspection
Are you ready to explore the cutting-edge advancements shaping the electronics manufacturing industry? The May 2025 issue of SMT007 Magazine is packed with insights, innovations, and expert perspectives that you won’t want to miss.
Do You Have X-ray Vision?
Has X-ray’s time finally come in electronics manufacturing? Join us in this issue of SMT007 Magazine, where we answer this question and others to bring more efficiency to your bottom line.
IPC APEX EXPO 2025: A Preview
It’s that time again. If you’re going to Anaheim for IPC APEX EXPO 2025, we’ll see you there. In the meantime, consider this issue of SMT007 Magazine to be your golden ticket to planning the show.
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - smt007 Magazine
Mek (Marantz Electronics) Launches New Entry-Level Inline AOI System
April 12, 2023 | Mek (Marantz Electronics)Estimated reading time: 1 minute

Marantz Electronics is proud to announce the launch of their latest generation Mek iSpector inline Automatic Optical Inspection system. This entry-level system is specifically designed to cater to customers with low volume, high mix production, who require high-quality AOI solutions without breaking the bank.
The iSpector system utilizes DOAL, main and side LED light sources from three different angles, creating a meniscus profiling light pattern that allows for the inspection of component bodies and solder joints. The system is equipped with Mek Colour Histogram analysis, which provides accurate and reliable inspection results with low false calls.
Offering a rapid and repeatable inspection process at an affordable cost, the iSpector is a lead screw and servo drive AOI system that combines high performance with the lowest cost of ownership. The system is easy to install, and the Mek iMentor online training program makes it exceptionally easy to program.
The iSpector utilizes software that has been continuously developed by Mek and proven in the market for almost 30 years. It has a clean and simple interface with powerful features, including full programming capabilities for solder inspection, component presence/absence, polarity, and value. The system's Z-axis allows for the inspection of taller components and hybrid PCBs, and users can import NC Data from their pick and place system or most popular CAD/CAM software.
To provide fast programming times and reliable results with low false fails, iSpector users can also take advantage of Mek's extensive custom libraries. Furthermore, the iSpector series is fully compatible with Mek's Catch System, which offers full traceability and industry 4.0 readiness. Catch comprises modules such as Database CS Center, CS Repair, CS Analyser, and CS Watch, and it is fully scalable from single AOI stations to multiple machines.
"We are excited to introduce the iSpector system to our customers," said Henk Biemans, Managing Director for Mek. "We understand the importance of providing high-quality AOI solutions that are affordable and easy to use, and the iSpector is the perfect solution for customers with low volume, high mix production. With its powerful features and compatibility with Mek's Catch System, we are confident that our customers will be able to take their production processes to the next level."
Suggested Items
Indium’s Karthik Vijay to Present on Dual Alloy Solder Paste Systems at SMTA’s Electronics in Harsh Environments Conference
05/06/2025 | Indium CorporationIndium Corporation Technical Manager, Europe, Africa, and the Middle East Karthik Vijay will deliver a technical presentation on dual alloy solder paste systems at SMTA’s Electronics in Harsh Environments Conference, May 20-22 in Amsterdam, Netherlands.
SolderKing Achieves the Prestigious King’s Award for Enterprise in International Trade
05/06/2025 | SolderKingSolderKing Assembly Materials Ltd, a leading British manufacturer of high-performance soldering materials and consumables, has been honoured with a King’s Award for Enterprise, one of the UK’s most respected business honours.
Knocking Down the Bone Pile: Gold Mitigation for Class 2 Electronics
05/07/2025 | Nash Bell -- Column: Knocking Down the Bone PileIn electronic assemblies, the integrity of connections between components is paramount for ensuring reliability and performance. Gold embrittlement and dissolution are two critical phenomena that can compromise this integrity. Gold embrittlement occurs when gold diffuses into solder joints or alloys, resulting in mechanical brittleness and an increased susceptibility to cracking. Conversely, gold dissolution involves the melting away of gold into solder or metal matrices, potentially altering the electrical and mechanical properties of the joint.
'Chill Out' with TopLine’s President Martin Hart to Discuss Cold Electronics at SPWG 2025
05/02/2025 | TopLineBraided Solder Columns can withstand the rigors of deep space cold and cryogenic environments, and represent a robust new solution to challenges facing next generation large packages in electronics assembly.
BEST Inc. Reports Record Demand for EZReball BGA Reballing Process
05/01/2025 | BEST Inc.BEST Inc., a leader in electronic component services, is pleased to announce they are experiencing record demand for their EZReball™ BGA reballing process which greatly simplifies the reballing of ball grid array (BGA) and chip scale package (CSP) devices.