Standard of Excellence: Delivering Excellence—A Daily Goal
Knocking Down the Bone Pile: Tin Whisker Mitigation in Aerospace Applications, Part 3
The Knowledge Base: Building the Workforce of Tomorrow With EMAC
Mek (Marantz Electronics) Launches New Entry-Level Inline AOI System
April 12, 2023 | Mek (Marantz Electronics)Estimated reading time: 1 minute
Marantz Electronics is proud to announce the launch of their latest generation Mek iSpector inline Automatic Optical Inspection system. This entry-level system is specifically designed to cater to customers with low volume, high mix production, who require high-quality AOI solutions without breaking the bank.
The iSpector system utilizes DOAL, main and side LED light sources from three different angles, creating a meniscus profiling light pattern that allows for the inspection of component bodies and solder joints. The system is equipped with Mek Colour Histogram analysis, which provides accurate and reliable inspection results with low false calls.
Offering a rapid and repeatable inspection process at an affordable cost, the iSpector is a lead screw and servo drive AOI system that combines high performance with the lowest cost of ownership. The system is easy to install, and the Mek iMentor online training program makes it exceptionally easy to program.
The iSpector utilizes software that has been continuously developed by Mek and proven in the market for almost 30 years. It has a clean and simple interface with powerful features, including full programming capabilities for solder inspection, component presence/absence, polarity, and value. The system's Z-axis allows for the inspection of taller components and hybrid PCBs, and users can import NC Data from their pick and place system or most popular CAD/CAM software.
To provide fast programming times and reliable results with low false fails, iSpector users can also take advantage of Mek's extensive custom libraries. Furthermore, the iSpector series is fully compatible with Mek's Catch System, which offers full traceability and industry 4.0 readiness. Catch comprises modules such as Database CS Center, CS Repair, CS Analyser, and CS Watch, and it is fully scalable from single AOI stations to multiple machines.
"We are excited to introduce the iSpector system to our customers," said Henk Biemans, Managing Director for Mek. "We understand the importance of providing high-quality AOI solutions that are affordable and easy to use, and the iSpector is the perfect solution for customers with low volume, high mix production. With its powerful features and compatibility with Mek's Catch System, we are confident that our customers will be able to take their production processes to the next level."
Share on:
Suggested Items
Driving Innovation: Direct Imaging vs. Conventional Exposure
07/01/2025 | Simon Khesin -- Column: Driving InnovationMy first camera used Kodak film. I even experimented with developing photos in the bathroom, though I usually dropped the film off at a Kodak center and received the prints two weeks later, only to discover that some images were out of focus or poorly framed. Today, every smartphone contains a high-quality camera capable of producing stunning images instantly.
Hands-On Demos Now Available for Apollo Seiko’s EF and AF Selective Soldering Lines
06/30/2025 | Apollo SeikoApollo Seiko, a leading innovator in soldering technology, is excited to spotlight its expanded lineup of EF and AF Series Selective Soldering Systems, now available for live demonstrations in its newly dedicated demo room.
Indium Corporation Expert to Present on Automotive and Industrial Solder Bonding Solutions at Global Electronics Association Workshop
06/26/2025 | IndiumIndium Corporation Principal Engineer, Advanced Materials, Andy Mackie, Ph.D., MSc, will deliver a technical presentation on innovative solder bonding solutions for automotive and industrial applications at the Global Electronics A
Fresh PCB Concepts: Assembly Challenges with Micro Components and Standard Solder Mask Practices
06/26/2025 | Team NCAB -- Column: Fresh PCB ConceptsMicro components have redefined what is possible in PCB design. With package sizes like 01005 and 0201 becoming more common in high-density layouts, designers are now expected to pack more performance into smaller spaces than ever before. While these advancements support miniaturization and functionality, they introduce new assembly challenges, particularly with traditional solder mask and legend application processes.
Knocking Down the Bone Pile: Tin Whisker Mitigation in Aerospace Applications, Part 3
06/25/2025 | Nash Bell -- Column: Knocking Down the Bone PileTin whiskers are slender, hair-like metallic growths that can develop on the surface of tin-plated electronic components. Typically measuring a few micrometers in diameter and growing several millimeters in length, they form through an electrochemical process influenced by environmental factors such as temperature variations, mechanical or compressive stress, and the aging of solder alloys.