The Knowledge Base: The Era of Advanced Packaging
Standard of Excellence: Finding and Developing Future Leaders in Manufacturing
Global Sourcing Spotlight: Navigating the Variables of Holiday Schedules in Global Sourcing
IPC Issues Call for Participation for High Reliability Forum
April 13, 2023 | IPCEstimated reading time: 2 minutes
IPC is now accepting abstracts for the High Reliability Forum, the international conference focusing on Class 3 and safety critical electronics for mil-aero, automotive, medical, and long-life applications that are subjected to harsh use environments. The High Reliability Forum will be held October 17-19, 2023, at the Hilton Baltimore BWI Airport in Linthicum (Baltimore), Md.
IPC invites innovators and technologists to submit an abstract for a technical presentation during the conference. The IPC High Reliability Technical Forum Program Committee seeks proposals for technical presentations on the following topics:
- High Reliable Materials: PCB Fabrication Materials, Interconnecting, Bonding, Thermal/Power Management, Conductivity/Resistivity, Use Conditions/Environment (A&D vs. Automotive vs. Medical/Implantable vs. High Perf Computing, etc.), Environmental Restrictions/Impact, Substrates for Advanced Packaging
- Design and Fabrication for High Reliability: Materials Compatibility, Flexible Printed Boards in RF/Microwave Applications, Design for Reliability/Determining Reliability Requirements, System of Systems Architecture, Levels of Redundancy, HDI/Microvia Reliability -- Test Methods and Design Rules, Micro HDI and Substrate Technologies, First Level Interconnect Methodologies; Use of Simulation in the Design Process, Automotive/High Voltage Applications
- Assembly for High Reliability: Next Generation Solder Alloys, Solder Paste and Coating Selection for High Reliability, Reliability of Cleaning, Testing and Coating Strategies, Assembly Materials -- Coating, Cleaning, Underfilling, Encapsulation, Effects of No-Clean Residues, Voiding in Solder Joints, 3D Package Level Reliability, Assembly for Automotive/High Voltage Applications
- Testing for High Reliability: Fatigue Behavior and Reliability Testing for Solder Joints using Next Generation Solder Alloys, Harsh Environment Reliability and Testing, Thermal Stress Test Methods, Connector Failure Modes and Reliability, Vibration and Shock Test Methods for Predicting Reliability, HDI/Microvia Reliability, Automotive/High Voltage Applications, Heterogeneous Integration/Advanced Packaging for High Reliability
- Issues around Quality, Standards for High Reliability: Supply Chain, Reshoring/Onshoring, Failure Modes Effects Analysis (FMEA), Reliability Assurance and Prediction Workflows, Selection of Appropriate Class of Electronics, Requirements for Specific Class of Electronics, Manufacturing Standards, Emerging Electronic Technologies
“We are thrilled to welcome attendees back to the first High Reliability Forum since 2019,” said David Bergman, IPC vice president of standards and technology. “We are eager to see the exciting new work from experts in all areas of the industry including PCB design, fabrication materials, emerging technologies, and other applications with specialized reliability requirements.”
Abstracts summarizing original and previously unpublished work must be submitted for consideration to present. Presentations should be non-commercial and describe significant results from experiments, emphasize new techniques, discuss trends of interest, and contain technical and/or appropriate test results.
Abstracts are due on Monday, June 5, 2023 and will be peer-reviewed by the Technical Program Committee. Accepted abstracts will be invited to deliver a podium presentation in person at the High Reliability Forum in Linthicum Heights, Maryland, October 17-19, 2023.
Share on:
Suggested Items
Book Excerpt: The Printed Circuit Assembler’s Guide to... Low-Temperature Soldering, Vol. 2, Chapter 5
12/23/2024 | I-Connect007 Editorial TeamChapter 5 introduces the advantages of using low-temperature soldering for through-hole components, including cost efficiency, reliability improvement, and reduced warpage. Also covered: the evaluation of different fluxes and the performance of HRL3 in wave soldering and selective soldering processes.
Overview of Soldering Systems With Vacuum
12/18/2024 | Dr. Paul Wild, Rehm Thermal Systems GmbHWhen soldering electronic assemblies, the focus of the vacuum application is on the removal of volatile substances from the solder joints and the associated reduction of pore formation. Particularly in the thermal management of power electronics components, pores can cause so-called hotspots with higher temperatures due to their poor heat conduction. These hotspots can lead to overheating of the components on the one hand and to thermally induced destruction of the solder structure on the other.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
12/13/2024 | Andy Shaughnessy, I-Connect007This week, Peter Tranitz discusses the upcoming Pan-European Electronics Design Conference, set for Jan. 29-30 in Vienna, Austria. Pete Starkey brings us a review of the most recent EIPC Technical Snapshot webinar, which featured a global PCB maker update by Dr. Hayao Nakahara. Don't miss our interview with Manfred Huschka, who explains how companies can begin their own China Plus One plan. Stan Farnsworth breaks down photonic soldering and discusses its use in soldering materials that are not typically compatible. I also enjoyed Dan Beaulieu’s discussion on the value of consistency, and why just showing up for work is half the battle, especially in an inconsistent, evolving industry like ours.
Advancing Photonic Soldering
12/11/2024 | Nolan Johnson, SMT007 MagazineStan Farnsworth, director of customer satisfaction at PulseForge, discusses the advancements in photonic soldering that highlight its energy efficiency and versatility. Over the past two years, the company has refined its applications for flexible substrates and energy reduction, finding that photonic soldering allows the processing of materials that typically aren’t thermally compatible and offers significant energy savings compared to traditional methods.
Indium Introduces New ROL0 and Halogen-free Flux-cored Wire
12/11/2024 | Indium CorporationIndium Corporation announced the global availability of CW-807RS, a new high-reliability, halide- and halogen-free flux-cored wire that improves wetting speeds and cycle times for electronics assembly and robot soldering applications.