-
- News
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current IssueThe Hole Truth: Via Integrity in an HDI World
From the drilled hole to registration across multiple sequential lamination cycles, to the quality of your copper plating, via reliability in an HDI world is becoming an ever-greater challenge. This month we look at “The Hole Truth,” from creating the “perfect” via to how you can assure via quality and reliability, the first time, every time.
In Pursuit of Perfection: Defect Reduction
For bare PCB board fabrication, defect reduction is a critical aspect of a company's bottom line profitability. In this issue, we examine how imaging, etching, and plating processes can provide information and insight into reducing defects and increasing yields.
Voices of the Industry
We take the pulse of the PCB industry by sharing insights from leading fabricators and suppliers in this month's issue. We've gathered their thoughts on the new U.S. administration, spending, the war in Ukraine, and their most pressing needs. It’s an eye-opening and enlightening look behind the curtain.
- Articles
- Columns
- Links
- Media kit
||| MENU - pcb007 Magazine
49ers, Cadence Team Up on Multi-Year Technology Partnership Focused on Sustainability
April 19, 2023 | Cadence Design Systems, Inc.Estimated reading time: 2 minutes

The San Francisco 49ers and Cadence Design Systems, Inc., announced a multi-year partnership, revolving around technology, sustainability and giving back to the Bay Area community. As two brands that prioritize innovation, Cadence and the 49ers will collaborate on future projects at Levi’s Stadium aimed at empowering the venue’s sustainable operations. As part of the deal and Cadence’s first American sports partnership, the company becomes An Official Technology Partner of the San Francisco 49ers.
Image: Nimish Modi, senior vice president and general manager, Strategy and New Ventures, Cadence, and Brent Schoeb, chief revenue officer, 49ers, pictured at Levi’s Stadium in Santa Clara, Calif. (Photo Credit: San Francisco 49ers)
Through the collaboration, the 49ers will consult with Cadence to identify stadium energy efficiencies, enabling the 49ers to continue their long-standing commitment to green business practices. Cadence will provide technology expertise based on its Future Facilities software technology. Future Facilities software supports the Cadence Intelligent System Design™ strategy, enabling system innovation.
Additionally, providing for the community is a cornerstone of the Cadence-49ers relationship. Locally, Cadence will support and volunteer with the 49ers Foundation’s 49ers EDU program presented by Chevron, which leverages the game of football and Levi’s Stadium as platforms to expose Bay Area youth to STEAM education concepts.
Cadence’s partnership with the 49ers comes with several marketing assets, including gameday in-stadium brand name visibility and naming rights to the 49ers official mobile app. The 49ers App Powered by Cadence allows fans to access team news, content, and tickets for 49ers games and all Levi’s Stadium events such as concerts and soccer matches. Cadence will also hold an annual Levi’s Stadium suite for 49ers games.
“As a fellow Bay Area brand that is committed to sustainability and STEAM education, Cadence is a perfect fit and great addition to our corporate partnership team,” said Kevin Hilton, 49ers VP, Corporate Partnerships. “As we approach 10 years at Levi’s Stadium, we look forward to collaborating with a like-minded, innovative partner for years to come and welcome Cadence to the 49ers family.”
“The 49ers and Cadence are very well-aligned in that we’re both making it a priority to do what’s best for the planet and make a positive impact on the community,” said KT Moore, Cadence VP, Corporate Marketing. “By collaborating with the 49ers to establish an energy efficiency strategy and implement our Future Facilities software, we’re on a path to enabling the football franchise to leverage our game-changing technology and expertise to improve its carbon footprint in the immediate geography and surrounding communities.”
Suggested Items
2025 ASEAN IT Spending Growth Slows to 5.9% as AI-Powered IT Expansion Encounters Post-Boom Normalization
06/26/2025 | IDCAccording to the IDC Worldwide Black Book: Live Edition, IT spending across ASEAN is projected to grow by 5.9% in 2025 — down from a robust 15.0% in 2024.
DownStream Acquisition Fits Siemens’ ‘Left-Shift’ Model
06/26/2025 | Andy Shaughnessy, I-Connect007I recently spoke to DownStream Technologies founder Joe Clark about the company’s acquisition by Siemens. We were later joined by A.J. Incorvaia, Siemens’ senior VP of electronic board systems. Joe discussed how he, Rick Almeida, and Ken Tepper launched the company in the months after 9/11 and how the acquisition came about. A.J. provides some background on the acquisition and explains why the companies’ tools are complementary.
United Electronics Corporation Advances Manufacturing Capabilities with Schmoll MDI-ST Imaging Equipment
06/24/2025 | United Electronics CorporationUnited Electronics Corporation has successfully installed the advanced Schmoll MDI-ST (XL) imaging equipment at their advanced printed circuit board facility. This significant technology investment represents a continued commitment to delivering superior products and maintaining their position as an industry leader in precision PCB manufacturing.
Insulectro & Dupont Host Technology Symposium at Silicon Valley Technology Center June 25
06/22/2025 | InsulectroInsulectro, the largest distributor of materials for use in the manufacture of PCBs and printed electronics, and DuPont, a major manufacturer of flex laminates and chemistry, invite fabricators, OEMS, designers, and engineers to attend an Innovation Symposium – Unlock the Power - this Wednesday, June 25, at DuPont’s Silicon Valley Technology Center in Sunnyvale, CA.
OKI, NTT Innovative Devices Establish Mass Production Technology for High-Power Terahertz Devices by Heterogeneous Material Bonding
06/21/2025 | BUSINESS WIREOKI, in collaboration with NTT Innovative Devices Corporation, has established mass production technology for high-power terahertz devices using crystal film bonding (CFB) technology for heterogeneous material bonding to bond indium phosphide (InP)-based uni-traveling carrier photodiodes (UTC-PD) onto silicon carbide (SiC) with excellent heat dissipation characteristics for improved bonding yields.