SIA Applauds House Introduction of Bipartisan Legislation to Restore Immediate Deductibility of R&D Investments
April 19, 2023 | SIAEstimated reading time: 2 minutes

The Semiconductor Industry Association (SIA) released the following statement from SIA President and CEO John Neuffer commending the introduction in the House of Representatives of bipartisan legislation to restore full tax deductibility of R&D investments. The legislation, the American Innovation and R&D Competitiveness Act, was introduced in the House today by Reps. Ron Estes (R-Kan.) and John Larson (D-Conn.), along with more than 60 bipartisan supporters. A similar bill to restore R&D expensing was introduced in the Senate on March 16 by Sens. Maggie Hassan (D-N.H.) and Todd Young (R-Ind.) and has garnered 20 bipartisan cosponsors.
“R&D is the driving force behind semiconductor innovations that have advanced modern technology and made the world smarter, more efficient, and better connected. U.S. semiconductor companies invest an average of one-fifth of their revenues in R&D annually, among the largest shares of any sector. Restoring the longstanding policy of allowing the immediate, full deduction of R&D investments would help expand U.S.-based R&D and innovation, spur economic growth and job creation, and strengthen America’s tech workforce.
“We commend Reps. Estes and Larson for introducing the American Innovation and R&D Competitiveness Act and look forward to working with bipartisan leaders in Congress to swiftly pass this critical legislation.”
Since 1954, R&D expenditures were treated as an immediate deduction. For decades, the immediate deduction for U.S. R&D expenditures provided a longstanding incentive for chip companies to make those investments, helping to maintain U.S. leadership in this vital technology. As of 2022, however, U.S. R&D expenses must now be amortized over five years, making it less attractive to perform R&D in the U.S. and harming competitiveness of the domestic semiconductor industry.
Even prior to the amortization requirement, the U.S. R&D incentive trailed those offered by global competitors, and without action to restore immediate deductibility of R&D expenses, the U.S. ranking for incentivizing research is projected to fall to the bottom quarter of OECD countries.
In addition, R&D costs are rising exponentially, with the most advanced semiconductor node costing more than $500 million to design, double the cost to design the previous leading-edge chips. Full and immediate expensing is necessary to spur R&D investments in the U.S. semiconductor industry and allow companies to further innovate and expand the domestic R&D workforce.
Testimonial
"In a year when every marketing dollar mattered, I chose to keep I-Connect007 in our 2025 plan. Their commitment to high-quality, insightful content aligns with Koh Young’s values and helps readers navigate a changing industry. "
Brent Fischthal - Koh YoungSuggested Items
Hon Hai Technology Group (Foxconn) and TECO Announce Strategic Alliance Targeting AI Data Center Capabilities
07/31/2025 | Hon Hai Technology GroupHon Hai Technology Group (“Foxconn”) and TECO Electric & Machinery Co Ltd (“TECO”) on Wednesday announced a share exchange, strategic alliance that will strengthen their AI infrastructure capabilities and propel the two Taiwanese tech majors into key markets in the global super-computing race.
Direct Metallization: A Sustainable Shift in PCB Fabrication
07/31/2025 | Jim Watkowski, Harry Yang, and Mark Edwards, MacDermid Alpha Electronics SolutionsThe global electronics industry is undergoing a significant transformation, driven by the need for more resilient supply chains and environmentally sustainable manufacturing practices. Printed circuit boards (PCBs), the backbone of interconnection for electronic devices, are at the center of this shift. Traditionally, PCB fabrication has relied heavily on electroless copper, a process that, while effective, is resource-intensive and environmentally hazardous. In response, many manufacturers are turning to direct metallization technologies as a cleaner, more efficient alternative.
Prague PEDC: Call for Abstracts Deadline July 31
07/16/2025 | Pan-European Electronics Design Conference (PEDC)The second Pan-European Electronics Design Conference (PEDC) will take place Jan. 21-22, 2026, in Prague, Czech Republic. The call for abstracts deadline is July 31. Organized jointly by the German Electronics Design and Manufacturing Association (FED) and the Global Electronics Association PEDC serves as a European platform for knowledge exchange, networking, and innovation in electronics design and development.
Seeing a Future in Mexico
07/09/2025 | Michelle Te, I-Connect007The Global Electronics Association (formerly known as IPC) has been instrumental in fostering a partnership with Guanajuato, a state north of Mexico City with 12 industrial clusters and close to 150 companies involved in electronics. This past spring, Alejandro Hernández, the undersecretary for investment promotion in Guanajuato, attended IPC APEX EXPO 2025 at the invitation of IPC Mexico Director Lorena Villanueva, where he met with several companies to discuss the opportunities available in Mexico. He is inviting electronics-related companies seeking long-term investment in a centrally located area with access to highways, railways, and ports.
China Plus One, Part 3: Inorsen Group, a Vietnam Success Story
07/03/2025 | Manfred Huschka, Manfred Huschka Management Consulting (Shenzhen) Ltd.In recent years, Western OEMs have continued to push for China Plus One factories and the advancement of China’s Belt and Road Initiative (BRI). At present, there are two main modes for PCB companies to go global: building greenfield factories or through mergers and acquisitions (M&A). Thailand is currently the primary geographic choice to build greenfield factories, whereas, increasingly, mergers and acquisitions in Vietnam and Malaysia provide opportunities for companies to expand markets and acquire resources.