It’s Only Common Sense: Be the Solution, Not the Problem
American Made Advocacy: Long-time Challenges Confront a New Administration
Marcy's Musings: It's Show Time!
Rogers Corporation to Highlight Next Generation Thin Materials for Millimeter Wave Multilayer Designs at Del Mar 2023
April 19, 2023 | Rogers CorporationEstimated reading time: 3 minutes
Rogers Corporation will exhibit at the Del Mar Electronics & Manufacturing Show April 26 and 27 at the Del Mar Fairgrounds in San Diego, CA (booth #622). High performance circuit materials used in multilayer structures which include a family of thin laminates and bonding materials are being highlighted along with Radix™ 3D Printable Dielectrics.
Highlighted Products:
Recently introduced Radix™ 3D Printable Dielectrics family of products, is the first available material featuring a dielectric constant of 2.8 and low loss characteristics at microwave frequencies. These printable dielectric materials give radio frequency (RF) designers unprecedented design freedom in creating new components, eliminating the need to consider typical manufacturing design constraints.
Radix3D Printable Dielectrics are proprietary composite materials designed for Digital Light Processing (DLP) 3D printing, enabling a scalable, high-resolution printing process for end-use RF dielectric component manufacturing. Rogers Corporation’s first Radix 3D Printable Dielectric material has a targeted dielectric constant of 2.8 and a dissipation factor of 0.0043 at 10 GHz when cured.
CLTE-MW™ laminates now include lower profile and thinner copper foil options to better serve the needs of designers and PCB fabricators producing millimeter wave PCB circuit designs. The new hyper very low profile (HVLP) ED copper cladding reduces insertion loss of transmission lines operating at 77 GHz by about 20% compared to standard ED copper foil. Additionally, the new HVLP copper cladding option is available in 9 µm, 18 µm and 35 µm thicknesses. These additional copper thickness options provide PCB fabricators more flexibility to achieve tight feature tolerances on signal layers, particularly with sequentially laminated designs.
These laminates are well suited for a range of applications including millimeter wave automotive and industrial radar antennas, 5G millimeter wave base stations and backhaul radios, and phased array radar systems.
SpeedWave® 300P Ultra-Low Loss Prepreg. With the increasing need for stackup flexibility in high layer count designs for 5G mmWave, high resolution 77 GHz automotive radar, aerospace & defense and high speed digital designs, SpeedWave 300P prepreg offers a broad range of competitively priced high performance options for the circuit designer. SpeedWave 300P prepreg can be used to bond a variety of Rogers’ materials including XtremeSpeed™ RO1200™, CLTE-MW™, and RO4000® series laminates.
This prepreg system offers a low dielectric constant of 3.0 – 3.3 and a low dissipation factor of 0.0019 – 0.0022 at 10 GHz with stable performance over a broad frequency range. This material is offered in multiple spread and open weave glass styles and resin content combinations to maximize stackup options.
RO4000® Products for Multilayer Structures:
Next generation products designed to meet the existing and emerging needs of advanced millimeter wave multilayer designs. RO4835T™ laminates, offered in a 2.5 mil, 3 mil and 4 mil core thickness, are 3.3 Dk, low loss, spread glass reinforced, ceramic filled thermoset materials designed for inner-layer use in multilayer board designs, and they complement RO4835™ laminates when thinner cores are needed.
RO4450T™ 3.2-3.3 Dk, low loss, spread glass reinforced, ceramic filled bonding materials were designed to complement RO4835T laminates and the existing RO4000 laminate family, and come in 2.5, 3, 3.5, 4, 4.5, 5 or 6 mil thicknesses.
RO4835T laminates and RO4450T bonding materials exhibit excellent Dk control for repeatable electrical performance, a low z-axis expansion for plated through-hole reliability, and are compatible with standard epoxy/glass (FR-4) processes. These materials are an excellent choice for multilayer designs requiring sequential laminations, as fully cured RO4000 products are capable of withstanding multiple lamination cycles. RO4835T laminates and RO4450T bondplys have the UL 94 V-0 flame retardant rating, and are compatible with lead-free processes.
RO3003G2™ high frequency laminates build on Rogers’ industry-leading RO3003™ platform to provide designers with improved insertion loss and reduced Dk variation. The combination of Rogers’ optimized resin and filler content along with the introduction of hyper very low-profile ED copper (HVLP) translates to Dk of 3.00 @ 10 GHz (clamped stripline method) and 3.07 @ 77 GHz (microstrip differential phase length method). RO3003G2 laminates also show very low insertion loss of 1.3dB/inch for 5 mil laminates as measured by the microstrip differential phase length method.
Share on:
Suggested Items
ICT Spring Seminar: Nickel Not Welcome Here
03/12/2025 | Pete Starkey, I-Connect007After a miserable, dull, and damp English winter, a really pleasant nearly spring day with the sun shining and daffodils in bloom greeted delegates to the Institute of Circuit Technology Spring Seminar at Puckrup Hall near Tewkesbury, March 5, in Gloucestershire, UK.
Multicircuits Expands Capabilities with State-of-the-Art Automated Copper Via Fill Process
03/10/2025 | MulticircuitsMike Thiel, president of Multicircuits, a leading provider of high-reliability printed circuit boards, has announced the addition of a state-of-the-art automated copper via fill process to their advanced manufacturing capabilities. This strategic investment enhances the company’s ability to deliver cutting-edge solutions for demanding industries, including aerospace, defense, medical, and high-speed telecommunications.
EIPC 2025 Winter Conference, Day 2: A Roadmap to Material Selection
02/20/2025 | Pete Starkey, I-Connect007The EIPC 2025 Winter Conference, Feb. 4-5, in Luxembourg City, featured keynotes and two days of conference proceedings. The keynote session and first-day conference proceedings are reported separately. Here is my review of the second day’s conference proceedings. Delegates dutifully assembled bright and early, well-rested and eager to participate in the second day’s proceedings of the EIPC Winter Conference in Luxembourg.
Designers Notebook: Addressing Future Challenges for Designers
02/06/2025 | Vern Solberg -- Column: Designer's NotebookThe printed circuit board is and will probably continue to be the base platform for most electronics. With the proliferation of new generations of high I/O, fine-pitch surface mount semiconductor package variations, circuit interconnect is an insignificant factor. Circuit board designers continually face challenges such as component quantity and complexity, limited surface area, and meeting the circuit board’s cost target. The printed circuit design engineer’s prominent position demands the development of efficiently manufacturable products that perform without compromise.
DesignCon 2025, Day 2: It’s All About AI
01/30/2025 | Marcy LaRont, I-Connect007It’s hard to get away from the topic of artificial intelligence, but why would you? It’s everywhere and in everything, and my time attending presentations about AI at DesignCon 2025 was well worth it. The conference’s agenda featured engaging presentations and discussions focused on the technological advancements in AI, big data centers, and memory innovations, emphasizing the critical relationship between processors and circuit boards.