Alps Alpine Selects Siemens’ Symphony Platform to Verify its Newest Mixed-signal Capacitance Detection IC
April 26, 2023 | SiemensEstimated reading time: 1 minute
Siemens Digital Industries Software has announced that Alps Alpine, a leading manufacturer of electronic components and in-vehicle information devices, used Siemens’ Symphony platform for mixed-signal applications when developing and verifying its newest, functionally safe capacitance detection integrated circuit (IC). Alps Alpine’s new offering enables proximity, touch, and spatial gesture detection across a wide range of human-machine interface systems in demanding applications such as the automotive and smart device spaces.
Using Siemens’ Symphony platform, Alps Alpine quickly achieved silicon accurate simulation for its touch detection IC, increasing functional verification productivity by 5x. This reduction of verification cycles facilitated rapid attainment of time-to-market goals for the customer.
"A major feature of our latest IC is the use of absolute self-capacitance detection to achieve outstanding high sensitivity and noise resistance performance," said Akihisa Iikura, IC design manager for Alps Alpine. "As a manufacturer of in-vehicle electrical components, we are required to comply with the ISO26262 functional safety standard, and the semiconductors we use must additionally comply with aggressive Automotive Safety Integrity Level-B (ASIL-B) requirements. Siemens’ Symphony platform helped us to rapidly and successfully design and verify our design’s complex operations and functionality. The Symphony platform’s exceptional performance, together with its user-friendly interface, led to greater adoption among our verification teams, ultimately resulting in a 5x increase in productivity.“
Alps Alpine has a track record of more than 20 years in semiconductor design, and the company has mass-produced billions of units over that timeframe.
Powered by Siemens' Analog FastSPICE platform, the Symphony platform provides a seamless combination of foundry-certified circuit simulators and industry-standard HDL simulators for efficient and precise verification of complex nanometer-scale mixed-signal ICs. Its modular design leverages Siemens’ Analog FastSPICE platform for exceptional speed and accuracy in mixed-signal simulation and its compatibility with leading digital solvers, such as the functional verification engine of Siemens’ Questa™ platform, extends debug productivity.
"The need for high-sensitivity capacitive sensing technology is becoming critical in many human-machine interface applications, and mixed-signal innovations such as Alps Alpine’s capacitance detection solutions are critical to meet those requirements," said Amit Gupta, vice president and general manager for the Custom IC Verification Division at Siemens Digital Industries Software. “We are pleased that our Analog FastSPICE and Symphony platforms played a key role in Alps Alpine’s development of its latest mixed-signal, functional safety standard compliant capacitance detection IC design.”
Suggested Items
SP Manufacturing Expands with New Malaysia Plant, Acquires Ideal Jacobs
12/26/2024 | PRNewswireSP Manufacturing (SPM), a leader in Electronic Manufacturing Services (EMS), is strengthening its global presence with two major moves: opening a new manufacturing facility in Senai, Malaysia, and successfully acquiring Ideal Jacobs Corporation.
Robosys, ACUA Ocean + OREC Secure Funding For Collaborative Autonomy Project
12/25/2024 | RobosysAdvanced maritime autonomy developer, Robosys Automation, supported by USV manufacturer, ACUA Ocean, and Offshore Renewable Energy Catapult (OREC), have jointly secured grant funding through Innovate UK.
IPC Announces New Training Course: PCB Design for Military & Aerospace Applications
12/23/2024 | IPCIPC announced the launch of a new training course: PCB Design for Military & Aerospace Applications.
Effects of Advanced Packaging and Stackup Design
12/26/2024 | I-Connect007 Editorial TeamKris Moyer teaches several PCB design classes for IPC and Sacramento State, including advanced PCB design. His advanced design classes take on some really interesting topics, including the impact of a designer’s choice of advanced packaging upon the design of the layer stackup. Kris shares his thoughts on the relationship between packaging and stackup, what PCB designers need to know, and why he believes, “The rules we used to live by are no longer valid.”
Beyond Design: AI-driven Inverse Stackup Optimization
12/26/2024 | Barry Olney -- Column: Beyond DesignArtificial intelligence (AI) is transforming how we conceptualize and design everything from satellites to PCBs. Traditionally, stackup planning is a manual process that can be multifaceted and relies heavily on the designer's expertise. Despite having best practices and various field solvers to optimize parameters, stackup planning remains challenging for complex designs with advanced packaging, several layers, multiple power pours, and controlled impedance requirements.