Trouble in Your Tank: Organic Addition Agents in Electrolytic Copper Plating
Marcy’s Musings: Can You Hear the Voices?
Facing the Future: Successfully Navigating the Uncertain Path Ahead
Rogers' Power Electronic Solutions Group to Showcase curamik Ceramic Substrates & ROLINX Eco Busbars at the PCIM 2023
April 26, 2023 | Rogers CorporationEstimated reading time: 2 minutes
Rogers Corporation’s Power Electronics Solutions (PES) group will be exhibiting at PCIM Europe and showcasing the whole curamik® ceramic substrate portfolio and ROLINX® Eco — a new generation aluminum busbar with unique features.
The PCIM Europe (Power Conversion and Intelligent Motion) event is the world's leading exhibition and conference for power electronics, intelligent motion, renewable energy and energy management. It is the leading international platform showcasing current products, topics and trends in power electronics and applications, taking place at the Nuremberg Messe (exhibition hall) in Nuremberg, Germany from May 09 –11, 2023. Rogers will be exhibiting in Hall 9 at Booth 351.
Rogers will also be active on the E-Mobility Forum schedule. Manfred Goetz, Rogers Senior Manager of Product Management for curamik, will present on the topic, “Comparison of Ceramic Substrate Materials for Different Packaging Technologies for Power Electronics.” This presentation will show that with the growth of HEV/EV and increasing requirements for packaging materials, designers struggle to find new ways to ensure reliability and high efficiency of electronic systems, which are necessary to power these new, challenging technologies. Additionally, Goetz will explain why finding and selecting the proper substrate materials for these challenges is the key for success in power electronics.
E-Mobility Forum, Hall 6, Booth 6-220
Tuesday, May 09, 2023, 3:10 pm
Thursday, May 11, 2023, 1:25 pm
Rogers will also be active on the PCIM Europe technical conference schedule and present a paper titled “Development of Method for Thermal Diffusivity Measurement of Thin and High Conductive Ceramics” by Martina Schmirler, Stefan Britting and Karsten Schmidt in cooperation with the Fraunhofer Institute for Ceramic Technologies and Systems IKTS, Germany. This paper will show that reliable operation of power modules under all conditions that may occur during their lifetime must be achieved by design, and that thermal simulation is an important tool to optimize the thermal design with respect to chip temperature. This paper will elaborate that it has identified a reliable method for determining thermal diffusivity by comparing different coating methods for sample preparation and investigating the influence of the measurement device on the results.
Stage: Mailand
Thursday, May 11, 2023, 2:00 pm
Visitors to the Rogers booth can learn more about curamik ceramic substrates designed for high-demand applications. The basis of the substrate is a ceramic insulator to which pure copper is applied. The result is ceramic substrates with high thermal conductivity, high heat capacity and heat spreading provided by the thick copper layer. These high-performance substrates are well-suited for power electronics applications.
Visitors will also have the chance to discover the wide range of ROLINX customized busbar solutions and assemblies renowned for their reliability, safety and durability in the most demanding applications, including mass transit and electric propulsion, industrial drives, renewable energy and automotive systems. ROLINX busbar solutions offer low inductance, compact and highly customizable designs and, in combination with capacitors, extremely low inductance and high-power density capabilities.
Share on:
Suggested Items
DuPont Announces Additional Directors for the Planned Independent Electronics Company
04/18/2025 | DuPontDuPont announced that Karin De Bondt and Anne Noonan will become members of the future board of directors for the independent Electronics public company that will be created following its intended spin-off from DuPont, which is targeted for November 1, 2025.
Navigating Robotics Deployment Challenges with SINBON
04/18/2025 | PRNewswireIn spite of the potential for robotics technology to expand productivity, several implementation challenges continue to stand in the way of more widespread adoption.
Can the Electronics Industry Balance Tariffs With Investment?
04/18/2025 | I-Connect007 Editorial TeamTo better understand the U.S. administration’s recent actions on global trade policies, Barry Matties and Nolan Johnson met with Richard Cappetto, IPC’s senior director of North American government relations, who highlighted both the challenges and opportunities available to U.S. companies in the recent trade activity. This could include increased domestic manufacturing and supply chain diversification.
Indium Experts to Present on Power Electronics at PCIM Europe 2025
04/17/2025 | Indium CorporationAs one of the leading materials providers to the power electronics assembly and e-Mobility industries, Indium Corporation experts will share their technical insight and knowledge on a variety of industry-related topics throughout PCIM Europe, May 6-8, in Nuremberg, Germany.
Spirit Electronics Expands U.S. Semiconductor Capacity with Acquisition of SMART Microsystems
04/17/2025 | BUSINESS WIREAs part of its strategic commitment to strengthening domestic semiconductor manufacturing, Spirit Electronics has acquired SMART Microsystems, located at Lorain County Community College (LCCC) in Ohio.