-
- News
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current IssueInventing the Future with SEL
Two years after launching its state-of-the-art PCB facility, SEL shares lessons in vision, execution, and innovation, plus insights from industry icons and technology leaders shaping the future of PCB fabrication.
Sales: From Pitch to PO
From the first cold call to finally receiving that first purchase order, the July PCB007 Magazine breaks down some critical parts of the sales stack. To up your sales game, read on!
The Hole Truth: Via Integrity in an HDI World
From the drilled hole to registration across multiple sequential lamination cycles, to the quality of your copper plating, via reliability in an HDI world is becoming an ever-greater challenge. This month we look at “The Hole Truth,” from creating the “perfect” via to how you can assure via quality and reliability, the first time, every time.
- Articles
- Columns
- Links
- Media kit
||| MENU - pcb007 Magazine
TPCA Released Taiwan PCB Industry's Sustainable Carbon Reduction Strategy
May 4, 2023 | TPCAEstimated reading time: 3 minutes

Taiwan Printed Circuit Association (TPCA) convened its 11th Member Conference and the Taiwan PCB Sustainable Carbon Reduction Strategy Press Conference at South Garden Hotels & Resorts in Taoyuan City. During the Conference, Taoyuan City Mayor San-cheng Chang, Ms. Pei-Li Chen, Deputy Director General, Industrial Development Bureau, Jwu-Sheng Hu, Senior Vice President, Industrial Technology Research Institute, Vice President Jen-Inn Chyi, National Central University, the Taiwan Electrical and Electronic Manufacturers' Association, and representatives from the government agencies, the industry, and universities met with more than 300 members and peers to witness the PCB industry's sustainability milestone. At the Press Conference, Chairman Maurice Lee unveiled the three major pillars of PCB low carbon transformation: Voluntary Energy Conservation, Renewable Energy, and Carbon Negative/Carbon Trade, and declared the Taiwan PCB industry's goal of reducing emissions by 30% by 2030 and achieving net-zero emission by 2050.
In response to global warming and extreme climate, each country's government has developed an essential objective of net-zero emissions. To help the industry thrive, TPCA kicked off an industry survey program in 2022 and established the "Taiwan PCB Sustainable Carbon Reduction Strategy" in nearly one year. TPCA's Chairman Lee shared this strategy at the conference and indicated that a net-zero emission path is planned in addition to the voluntary carbon survey and program analysis conducted by the Taiwan PCB industry. 2020 is selected as the base year, and based on the three principles Voluntary Energy Conservation, Renewable Energy, and Carbon Negative/Carbon Trade, we will gradually achieve the goal of reducing emissions by 30% by 2030 and attain net-zero emissions by 2050.
For the Taiwan PCB Sustainable Carbon Reduction Strategy, the industry will take thirty-nine (39) actions, achieve consensus, and provide 27 suggestions to the government. Critical plans will also be conducted this year. For example, the Low Carbon Building Alliance will start introduction of low-carbon equipment from the process hotspots (electroplating and factory facilities); in the Low Carbon Material R&D Platform, low-carbon materials are researched and developed for the copper clad laminate, resin, and dielectric materials. For waste resourcing, fiberglass resin, waste film scraps, and waste pads are selected for the pilot demonstration projects. Chairman Lee urged the industry to implement voluntary energy conversation, organization restructuring, as well as inventory mechanism, and set the reduction goal. We need every support to overcome many challenges. After the report is published, it is expected to facilitate cooperation and integrate resources to improve the carbon reduction effect of the overall industry chain.
Taoyuan City Mayor San-cheng Chang was invited to give a speech. Mayor Chang said that the Taoyuan City Government has issued the Taoyuan 2050 Net-Zero Emission Goal yesterday (29). Taoyuan is home to the Taiwan PCB industry, which is ranked No.1 in the world. 70% of the emissions in Taoyuan City come from the manufacturing industry. He appreciated that the PCB industry released the Sustainable Carbon Reduction Strategy first. The City Government will subsequently plan a low-carbon industry park. He hoped to achieve the metropolitan and industrial net-zero emission goal through industry-government cooperation.
Ms. Pei-Li Chen, Deputy Director General, Industrial Development Bureau said that the government allocated particular budgets after the pandemic to guide industrial intelligentization and low-carbon transformation. She hoped that the PCB industry could take advantage of this resource and that iconic companies could help smaller ones and guide the supply chain to stay competitive.
At the Conference, Du-Wen Sun, Senior Manager of TSMC, shared the "TSMC's Net-Zero Sustainability Roadmap" to let the PCB industry understand how an iconic company performs its transformation strategy and take specific actions; Yenhaw CHEN, Director of Research Division I at Taiwan Institute of Economic Research, shared the "Global Net-Zero Transformation and New Type Green Trading Trend" and indicated that the government of each country are work together more closely for governance, while the international brands actively perform the supply chain management. For both reasons, the PCB industry should be more practical in the low carbon transformation goal setting and implementation.
The Taiwan PCB Industry Transformation Strategy specifies the current situation of the Taiwan PCB GHG emissions, power consumption hotspots, and emission reduction path as well as goal. The Report marks the starting point of the Taiwan PCB Low Carbon Transformation. It is expected to unite the government, industry, and universities to fulfill our sustainability vision and help the Taiwan PCB industry stay competitive in terms of low carbon.
Testimonial
"Advertising in PCB007 Magazine has been a great way to showcase our bare board testers to the right audience. The I-Connect007 team makes the process smooth and professional. We’re proud to be featured in such a trusted publication."
Klaus Koziol - atgSuggested Items
Global PCB Connections: Understanding the General Fabrication Process—A Designer’s Hidden Advantage
08/14/2025 | Markus Voeltz -- Column: Global PCB ConnectionsDesigners don’t need to become fabricators, but understanding the basics of PCB fabrication can save you time, money, and frustration. The more you understand what’s happening on the shop floor, the better you’ll be able to prevent downstream issues. As you move into more advanced designs like HDI, flex circuits, stacked vias, and embedded components, this foundational knowledge becomes even more critical. Remember: the fabricator is your partner.
MKS’ Atotech to Participate in IPCA Electronics Expo 2025
08/11/2025 | AtotechMKS Inc., a global provider of enabling technologies that transform our world, announced that its strategic brands ESI® (laser systems) and Atotech® (process chemicals, equipment, software, and services) will showcase their latest range of leading manufacturing solutions for printed circuit board (PCB) and package substrate manufacturing at the upcoming 17th IPCA Show to be held at Pragati Maidan, New Delhi from August 21-23, 2025.
MKS Showcases Next-generation PCB Manufacturing Solutions at the Thailand Electronics Circuit Asia 2025
08/06/2025 | MKS Instruments, Inc.MKS Inc, a global provider of enabling technologies that transform our world, today announced its participation in Thailand Electronics Circuit Asia 2025 (THECA 2025), taking place August 20–22 at BITEC in Bangkok.
Point2 Technology, Foxconn Interconnect Technology Partner to Revolutionize AI Cluster Scalability with Terabit-Speed Interconnect
08/06/2025 | BUSINESS WIREPoint2 Technology, a leading provider of ultra-low-power, low-latency mixed-signal SoC solutions for multi-terabit interconnect, and Foxconn Interconnect Technology (FIT), a global leader in precision interconnect solutions, have signed a Memorandum of Understanding (MOU) to accelerate the commercialization of next-generation Active RF Cable (ARC) and Near Pluggable e-Tube (NPE) solutions.
Advancing Electrolytic Copper Plating for AI-driven Package Substrates
08/05/2025 | Dirk Ruess and Mustafa Oezkoek, MKS’ AtotechThe rise of artificial intelligence (AI) applications has become a pivotal force driving growth in the server industry. Its challenging requirements for high-frequency and high-density computing are leading to an increasing demand for development of advanced manufacturing methods of package substrates with finer features, higher hole densities, and denser interconnects. These requirements are essential for modern multilayer board (MLB) designs, which play a critical role in AI hardware. However, these intricate designs introduce considerable manufacturing complexities.