DARPA Awards Epirus Contract as Part of Massive Cross-Correlation (MAX) Program
May 8, 2023 | PRNewswireEstimated reading time: 1 minute

Epirus, a high-growth technology company developing breakthrough power management solutions, has been selected for the Defense Advanced Research Projects Agency's (DARPA) Massive Cross-Correlation (MAX) program. Epirus and the University of California Los Angeles (UCLA) will collaborate on up to four project phases, worth a total of $5.3 million.
Epirus and UCLA will work to develop highly scalable analog circuit techniques, resulting in paradigm shifting levels of power efficiency and speed. This power efficiency will, in turn, enable a reduction in form factor that will allow embedding of high-speed correlators in a range of platforms and applications that cannot support the power requirements of current state-of-the-art devices. The project's technology outcomes will also enable passive sensing, new radar modes such as real-time synthetic aperture radar, imaging and jam-resistant radar and communications applications in a cutting-edge form factor with low size, weight and power requirements.
"We're pleased to deepen our partnership with DARPA as we begin our efforts to develop the world's best general purpose analog correlator to enable new capabilities for U.S. and allied militaries," said Ken Bedingfield, Chief Executive Officer, Epirus. "Today's announcement will spur new opportunities for our intelligent power management architecture that holds the potential to reshape power management as we know it."
In December 2021, DARPA awarded Epirus a multi-million-dollar contract as part of the WARDEN RANGER program to accelerate the advancement of Electromagnetic and Radio Frequency capabilities. The company is also under contract with DARPA's Microsystems Technology Office (MTO) to develop distributed processing of phased arrays with the goal of significantly reducing computational complexity and required processing rates in order to deal with large and flexible phased array antenna systems.
The company's collaboration with DARPA on these three projects will propel the continued research, development and maturation of Epirus' waveform optimization and power efficiency technologies for high-power microwave systems.
By gating energy at the sub-microsecond level, Epirus' intelligent power management platform optimizes performance to achieve significantly greater efficiency or higher power output, depending on the application area. In addition to powering Epirus' Leonidas suite of high-power microwave systems, the platform holds significant opportunities to transform a spectrum of sectors – from power and energy to communications and security – by limiting energy waste and protecting our world's most critical resource.
Testimonial
"In a year when every marketing dollar mattered, I chose to keep I-Connect007 in our 2025 plan. Their commitment to high-quality, insightful content aligns with Koh Young’s values and helps readers navigate a changing industry. "
Brent Fischthal - Koh YoungSuggested Items
Indium Corporation Earns Mexico Technology Award for New Halogen-Free Flux-Cored Wire
09/18/2025 | Indium CorporationIndium Corporation recently earned a Mexico Technology Award for its new high-reliability, halide- and halogen-free flux-cored wire, CW-807RS, which improves wetting speeds and cycle times for electronics assembly and robot soldering applications.
Blaize, Technology Control Company Partner to Power Saudi Arabia’s Next-Generation AI Innovation Infrastructure
09/17/2025 | BUSINESS WIREBlaize Holdings, Inc., a leader in programmable, energy-efficient edge AI computing, and Technology Control Company (TCC), a leading technology solutions provider in the Kingdom of Saudi Arabia (KSA), announced a strategic partnership to advance Saudi Arabia’s AI innovation infrastructure and accelerate its digital transformation goals.
BLT Joins Microchip Partner Program as Design Partner
09/17/2025 | BUSINESS WIREBLT, a U.S.-owned and operated engineering design services firm announced it has joined the Microchip Design Partner Program.
Curing and Verification in PCB Shadow Areas
09/17/2025 | Doug Katze, DymaxDesign engineers know a simple truth that often complicates electronics manufacturing: Light doesn’t go around corners. In densely populated PCBs, adhesives and coatings often fail to fully cure in shadowed regions created by tall ICs, connectors, relays, and tight housings.
On the Line With… Podcast: UHDI and RF Performance
09/17/2025 | I-Connect007I-Connect007 is excited to announce the release of a new episode in its latest On the Line with... podcast series, which shines a spotlight on one of the most important emerging innovations in electronics manufacturing: Ultra-High-Density Interconnect (UHDI).