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Rogers Expanding Power Substrate Capacity in China to Meet Growing EV and Renewable Energy Demand
May 10, 2023 | Rogers CorporationEstimated reading time: 1 minute
Rogers Corporation, announced its plan to build a new factory in China to manufacture its curamik AMB (Active Metal Brazed) and DBC (Direct Bonded Copper) substrates to meet significant demand growth. The first phase of the expansion is slated for completion in 2025. This follows last year’s investment in expanding the company’s curamik factory in Eschenbach, Germany.
“To better support our global customers and meet the growing demand for power substrates used in electric and hybrid electric vehicles (EV/HEV) and renewable energy applications, we are planning to build a new state-of-the-art factory in China. Upon completion, this new factory will help shorten lead times and deepen technical collaborations with customers in Asia,” said Jeff Tsao, Advanced Electronic Solutions (AES) Vice President and General Manager. “We have been a trusted partner to leading power module suppliers for decades, delivering efficient and reliable power semiconductor substrates, and today’s announcement further strengthens that position.”
This latest investment continues Rogers’ manufacturing strategy of positioning capacity to serve its global customer base. The company continues to focus on supporting growth opportunities across its markets with ongoing initiatives to drive capacity throughput improvements at existing facilities and make measured investments in new capacity. The expansion plan will be discussed in the company’s Q2 2023 earnings conference call, and any further developments will be communicated at that time. Rogers continues to expect capital expenditures for full-year 2023 to be in the range of $65 to $75 million.
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Julia McCaffrey - NCAB GroupSuggested Items
Episode 6 of Ultra HDI Podcast Series Explores Copper-filled Microvias in Advanced PCB Design and Fabrication
10/15/2025 | I-Connect007I-Connect007 has released Episode 6 of its acclaimed On the Line with... American Standard Circuits: Ultra High Density Interconnect (UHDI) podcast series. In this episode, “Copper Filling of Vias,” host Nolan Johnson once again welcomes John Johnson, Director of Quality and Advanced Technology at American Standard Circuits, for a deep dive into the pros and cons of copper plating microvias—from both the fabricator’s and designer’s perspectives.
Nolan’s Notes: Tariffs, Technologies, and Optimization
10/01/2025 | Nolan Johnson -- Column: Nolan's NotesLast month, SMT007 Magazine spotlighted India, and boy, did we pick a good time to do so. Tariff and trade news involving India was breaking like a storm surge. The U.S. tariffs shifted India from one of the most favorable trade agreements to the least favorable. Electronics continue to be exempt for the time being, but lest you think that we’re free and clear because we manufacture electronics, steel and aluminum are specifically called out at the 50% tariff levels.
MacDermid Alpha & Graphic PLC Lead UK’s First Horizontal Electroless Copper Installation
09/30/2025 | MacDermid Alpha & Graphic PLCMacDermid Alpha Electronics Solutions, a leading supplier of integrated materials and chemistries to the electronics industry, is proud to support Graphic PLC, a Somacis company, with the installation of the first horizontal electroless copper metallization process in the UK.
Electrodeposited Copper Foils Market to Grow by $11.7 Billion Over 2025-2032
09/18/2025 | Globe NewswireThe global electrodeposited copper foils market is poised for dynamic growth, driven by the rising adoption in advanced electronics and renewable energy storage solutions.
MacDermid Alpha Showcases Advanced Interconnect Solutions at PCIM Asia 2025
09/18/2025 | MacDermid Alpha Electronics SolutionsMacDermid Alpha Electronic Solutions, a global leader in materials for power electronics and semiconductor assembly, will showcase its latest interconnect innovations in electronic interconnect materials at PCIM Asia 2025, held from September 24 to 26 at the Shanghai New International Expo Centre, Booth N5-E30