Defense Speak Interpreted: Is There Still a CHIPS Act?
Beyond the Board: Empowering the Next Generation of Tech Innovators in Electronics
The Government Circuit: Trump’s Trade War Disrupts the Electronics Ecosystem
Arlon Electronic Materials Awarded Requalification to IPC-4101 QPL for All Polyimide Specification Sheets
May 12, 2023 | IPCEstimated reading time: 1 minute
IPC's Validation Services Program has awarded an IPC-4101 Qualified Products Listing (QPL) requalification to Arlon Electronic Materials Division, an electronics material manufacturing company headquartered in Rancho Cucamonga, Calif.
Arlon produces and sells military-grade, copper-clad laminates, prepregs, and packaging substrates to the global electronics industry. The company continues to be listed as an IPC-4101E trusted source capable of manufacturing in accordance with industry best practices for IPC slash sheets 40, 41, and 42, the polyimide-based slash sheets covered in IPC-4101E. Arlon successfully requalified their product, 85N to slash sheets 40 and 41 of IPC-4101E, Specification for Base Materials for Rigid and Multilayer Printed Boards. Arlon successfully requalified their product, 37N to meet the requirements of slash sheet 42 from the same standard.
According to John Wright, Arlon’s director of quality, “Having our polyimide products listed on IPC’s Validation Services Qualified Products List gives our customers the assurance that our processes and products continue to meet or exceed IPC-4101 slash sheet specifications.” Wright commented further by saying, “As a supplier into the global aerospace, industrial, and military markets, we feel that IPC’s Validation Services program provides our customer base the confidence that Arlon’s products will consistently meet their design and performance requirements.”
IPC's Validations Services QPL/QML Program was developed to promote supply chain verification. It also provides auditing and certification of electronics companies' products and identifies processes that conform to IPC standards.
“Arlon has differentiated itself from the competition in the polyimide market by becoming part of IPC's global network of trusted industry sources,” said Randy Cherry, IPC director of Validation Services. “We are pleased to recognize Arlon for their requalification and being the first U.S. facility as a trusted supplier conforming to IPC-4101E as well as covering all three polyimide specification sheets.”
Share on:
Suggested Items
Preventing Surface Prep Defects and Ensuring Reliability
06/10/2025 | Marcy LaRont, PCB007 MagazineIn printed circuit board (PCB) fabrication, surface preparation is a critical process that ensures strong adhesion, reliable plating, and long-term product performance. Without proper surface treatment, manufacturers may encounter defects such as delamination, poor solder mask adhesion, and plating failures. This article examines key surface preparation techniques, common defects resulting from improper processes, and real-world case studies that illustrate best practices.
RF PCB Design Tips and Tricks
05/08/2025 | Cherie Litson, EPTAC MIT CID/CID+There are many great books, videos, and information online about designing PCBs for RF circuits. A few of my favorite RF sources are Hans Rosenberg, Stephen Chavez, and Rick Hartley, but there are many more. These PCB design engineers have a very good perspective on what it takes to take an RF design from schematic concept to PCB layout.
Trouble in Your Tank: Causes of Plating Voids, Pre-electroless Copper
05/09/2025 | Michael Carano -- Column: Trouble in Your TankIn the business of printed circuit fabrication, yield-reducing and costly defects can easily catch even the most seasoned engineers and production personnel off guard. In this month’s column, I’ll investigate copper plating voids with their genesis in the pre-plating process steps.
Elephantech: For a Greener Tomorrow
04/16/2025 | Marcy LaRont, PCB007 MagazineNobuhiko Okamoto is the global sales and marketing manager for Elephantech Inc., a Japanese startup with a vision to make electronics more sustainable. The company is developing a metal inkjet technology that can print directly on the substrate and then give it a copper thickness by plating. In this interview, he discusses this novel technology's environmental advantages, as well as its potential benefits for the PCB manufacturing and semiconductor packaging segments.
Trouble in Your Tank: Organic Addition Agents in Electrolytic Copper Plating
04/15/2025 | Michael Carano -- Column: Trouble in Your TankThere are numerous factors at play in the science of electroplating or, as most often called, electrolytic plating. One critical element is the use of organic addition agents and their role in copper plating. The function and use of these chemical compounds will be explored in more detail.