Altus Recommends Advanced Vapour Phase Soldering to Increase Manufacturers’ Production Capacity
May 15, 2023 | Altus GroupEstimated reading time: 1 minute
Having worked with Altus Group for several years, Axiom Manufacturing Services consulted with the equipment distributor and invested in a cutting-edge vapour phase soldering system from ASSCON. ‘VP6000’ will increase production capacity and ensure highly flexible soldering of complex PCBA assemblies can be achieved to support the company’s wider customer base and broad range of applications.
ASSCON VP6000 is the ideal process for modern soldering technology. Electronic assemblies can be soldered faultlessly in each configuration, with flexible and adjustable temperature gradients to ensure each product receives the optimal, reproducible temperature profile.
Rob Taylor, Operations Manager at Axiom said: “I am delighted that we will soon have the ASSCON VP6000 on site and are bringing in a brand-new process to support our customers. This will mean that we have yet another capability to meet production needs allowing us to compete strongly with other electronics manufacturing services going forward.
“We are seeing many more complicated and component dense applications coming through with a large focus on voiding percentages. The VP6000, which is considered the best batch vapour phase unit available today, will support us in meeting all of those needs.’’
VP6000 is capable of working on any design and size assembly, proficiently manufacturing small and large production quantities using workpiece carriers. With the patented Multi Vacuum technology, voids in solder joints are reduced, with
Joe Booth, Altus CEO, said: “Altus and Axiom have developed a lot of trust over time, and I am really pleased for us both on this project. Altus can support another process at their site, and Axiom has invested in a flagship, leading vapour phase system with vacuum providing them with a real competitive advantage. Axiom always has an eye to improve their offering and cement their market leading position. They can now offer even more value to their customers and future-proof their relationships.”
Suggested Items
Indium Experts to Present on High-Temperature, Lead-Free Solder Paste and High Reliability Liquid Metal Alloys Poster at ECTC
05/16/2024 | Indium CorporationIndium Corporation Research Associate Kyle Aserian will deliver a presentation at the 74th Electronic Components and Technology Conference (ECTC) on May 31, in Denver, Colorado.
Indium Experts to Present at Electronics in Harsh Environments SMTA Conference
05/13/2024 | Indium Corporationndium Corporation Technical Manager for Europe, Africa, and the Middle East, Karthik Vijay, will deliver a technical presentation and Indium Corporation Senior Technologist, Dr. Ronald Lasky, will deliver both a workshop and technical presentation at the Electronics in Harsh Environments SMTA Conference on May 14-16 in Copenhagen, Denmark.
Connect the Dots: Designing for Reality—The Pre-Manufacturing Process
05/08/2024 | Matt Stevenson -- Column: Connect the DotsI have been working with Nolan Johnson on a podcast series about designing PCBs for the reality of manufacturing. By sharing lessons learned over a long career in the PCB industry, we hope to shorten learning curves and help designers produce better boards with less hassle and rework. Episode 2 deals with the electronic pre-manufacturing process. Moving from CAD (computer-aided design) to CAM (computer-aided manufacturing) is a key step in PCB manufacturing. CAM turns digital designs into instructions that machines can use to actually build the PCB.
AIM Solder Signs Shinil Fl Ltd. as New Distributor for Korea
05/08/2024 | AIM SolderAIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce a new distribution partnership with Shinil Fl Ltd., a prominent supplier of technological solutions in the SMT and semiconductor sectors.
Indium Corporation to Showcase HIA Materials at ECTC
05/07/2024 | Indium CorporationAs an industry leader in innovative materials solutions for semiconductor packaging and assembly, Indium Corporation® will feature its advanced products designed to meet the evolving challenges of heterogeneous integration and assembly (HIA) and fine-pitch system-in-package (SiP) applications at the 74th Electronic Components and Technology Conference (ECTC), May 28‒31, in Denver, Colorado.