New MLCCs from Murata Squeeze More Capacitance into Compact Format
May 18, 2023 | MurataEstimated reading time: 1 minute

Leading electronics manufacturer Murata continues to position itself at the forefront of passive technology. Through its latest multi-layer ceramic capacitor (MLCC) introduction, the company is addressing the growing need for components that have elevated capacitance levels combined with miniaturized form factors and enhanced temperature performance. Offering capacitance values of 10µF (and a ±20% tolerance), the GRM series of MLCCs are supplied in a 0201inch/0603M package size. They are currently the smallest MLCC products on the market to deliver such capacitance levels, representing a 65% size reduction on the 0402inch/1005M products that would normally need to be specified. Consequently, they enable use of substantially fewer components, leading to board space savings and bill-of-materials costs benefits.
The GRM series benefits from key Murata innovations, including the company's proprietary thin layer forming technology, plus a fully optimized high-precision lamination process. The 4.0VDC-rated GRM035R60G106M products have a -55°C to 85°C temperature range and are already in production. Also, the GRM035C80E106M with a rated voltage of 2.5VDC at -55°C to 105°C goes into mass production this September, and the GRM035R60J106M with a rated voltage of 6.3VDC at -55°C to 85°C in 2024.
These MLCCs are highly suited for integration into the decoupling and smoothing circuitry of smartphone handsets, portable equipment, wearables, domestic appliances, servers, and IoT hardware.
"There are numerous market sectors where there is a definite need for capacitor components that have strong capacitance figures and also take up very little PCB footprint," states Hidetoshi Nakagawa, General Manager of Ceramic Capacitor Marketing at Murata. "Furthermore, the miniaturization of capacitors will contribute to reducing the environmental impact of the electronics industry and help enable long-term sustainability, with the quantities of materials involved being lowered and the amount of electricity consumed during their production also being curbed."
Suggested Items
Raymond E. Pritchard IPC Hall of Fame Award: Peter Bigelow
04/04/2025 | Nolan Johnson, I-Connect007IPC’s most prestigious award honors an individual’s long-term distinguished service and contributions to IPC and the electronics manufacturing industry. Peter Bigelow is president of FTG Circuits in Haverhill, Mass., focusing on the military, RF/microwave, and aerospace markets. He also has extensive experience in general management, marketing, operations, and sales with large publicly traded and privately held manufacturing companies in the printed circuit, electronics, and instrumentation industries.
Meyer Burger, OGT Solar Sign Module Supply Agreement for Italy
04/02/2025 | Meyer BurgerMeyer Burger Technology AG and OGT Solar have signed a supply agreement. The high-performance modules “Made in Germany” were manufactured at the Freiberg plant in Germany and are intended for the Italian market.
Nortech Systems Reports Q4 Results
03/31/2025 | Nortech SystemsNortech Systems Incorporated, a leading provider of engineering and manufacturing solutions for complex electromedical and electromechanical products serving the medical, industrial and defense markets, reported financial results for the fourth quarter ended December 31, 2024.
Investment in High-Tech Manufacturing: Zollner Opens Cleanroom in Hungary
03/28/2025 | Zollner Elektronik AGIn a ceremonial event on March 13, 2025, representatives from ASML and Zollner inaugurated the new cleanroom at the Hungarian site in Vác. Among those present were Wayne Allan, Chief Strategic Sourcing & Procurement Officer, and Member of the Board of Management at ASML, Michiel Claessens.
MVTec, Pepperl+Fuchs Enter into Technology Partnership
03/27/2025 | MVTecMVTec Software GmbH and Pepperl+Fuchs are stepping up their technological collaboration in the field of machine vision. As part of this, Pepperl+Fuchs joined the MVTec Technology Partner program at the beginning of 2025.