-
- News
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current IssueVoices of the Industry
We take the pulse of the PCB industry by sharing insights from leading fabricators and suppliers in this month's issue. We've gathered their thoughts on the new U.S. administration, spending, the war in Ukraine, and their most pressing needs. It’s an eye-opening and enlightening look behind the curtain.
The Essential Guide to Surface Finishes
We go back to basics this month with a recount of a little history, and look forward to addressing the many challenges that high density, high frequency, adhesion, SI, and corrosion concerns for harsh environments bring to the fore. We compare and contrast surface finishes by type and application, take a hard look at the many iterations of gold plating, and address palladium as a surface finish.
It's Show Time!
In this month’s issue of PCB007 Magazine we reimagine the possibilities featuring stories all about IPC APEX EXPO 2025—covering what to look forward to, and what you don’t want to miss.
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - pcb007 Magazine
MKS’ Atotech to Participate in JPCA Show
May 22, 2023 | AtotechEstimated reading time: 1 minute

MKS Instruments is excited to join the upcoming JPCA Show at Tokyo Big Sight held from May 31 to June 2, 2023. The team will represent our strategic brands, Atotech and ESI, and will introduce our latest products and manufacturing solutions for PCB and package substrate manufacturing.
MKS Atotech and ESI teams are represented by a select group of industry and technology experts from across various business sectors and can be found at booth 6B-11. We are looking forward to learn about your latest requirements and explain what we can do for you with our new combined product offering.
MKS is highly committed to driving next-level technological developments within its industries and key installations at our local TechCenter in Yokohama to support next generation package substrate development working towards meeting 5/5µm L/S targets. By combining leading capabilities in lasers, optics, motion, process chemistry and equipment, we are positioned to Optimize the InterconnectSM, a significant enabling point of next-generation advanced electronics that represents the next frontier for miniaturization and complexity.
Our show highlights include:
G-Plate: Vertical desmear and electroless HVM plating tool for next-generation high-end package substrates with well-organized particle control
Cuprapulse XP7-IN: Vertical pulse plating with inert process to improve thickness distribution, especially high and low TH density area and very suitable for inner layer of next-generation package substrates
NovaBond® EX-S2: Adhesion Promoter for the latest ABFs with zero-line width reduction and minimized surface nano-roughness. Very suitable for ultra-fine lines and high frequency applications due to its nearly impeccable signal integrity
Stanna-CAT: New autocatalytic tin bath with no thickness limitation and no selectivity of plated metal
Geode A: CO2 laser system for high precision and high-speed ABF build-up laminate processing
Capstone: Flex PCB UV drilling tool for high-performance breakthrough productivity
Conference: JPCA Show 2023
Date: May 31, to June 2, 2023
Booth: 6B-11
Venue: Tokyo Big Sight (East Exhibition Halls)
Suggested Items
Real Time with... IPC APEX EXPO 2025: Benmayor Group—Resistance is Futile: Automation Is the Future
04/11/2025 | Real Time with...IPC APEX EXPOJeff Brandman, president of Aismalibar North America, and Eduardo Benmayor, CEO of Benmayor Group, discuss Benmayor Group's role in electronics and automation, focusing on how automation addresses labor shortages. Jeff, notes that many businesses struggle to find workers for manual tasks, emphasizing the need for various automation solutions to boost productivity. North America lags in automation compared to other regions, which impacts efficiency. Jeff recommends a step-by-step approach to scaling automation, and there's growing acceptance of robots in the workforce, leading to a positive outlook for the future.
Real Time with... IPC APEX EXPO 2025: Exploring Ventec's Innovations
04/09/2025 | Real Time with...IPC APEX EXPOMark Goodwin highlights Ventec's global distribution network and recent expansions in service and equipment offerings. He emphasizes the company's expertise in coating technology for thermal management, specialized materials, and its agility in creating customized solutions for customers.
INEMI Sessions at IPC APEX EXPO Focus is on Board Assembly and PCB & Laminates
03/12/2025 | iNEMIIf you plan to attend the upcoming IPC APEX EXPO in Anaheim, California, be sure to add the INEMI sessions to your calendar. We will have two forward-looking sessions — one on PCB and Laminates and the other on Board Assembly.
Rogers Corporation Launches New Thermoset Laminates for Automotive Radar Sensor Applications
03/03/2025 | Rogers CorporationRogers Corporation (NYSE:ROG) announced its latest innovation in dielectric materials: RO4830™ Plus Circuit Materials, which are well suited for cost-sensitive millimeter wave PCB applications, such as 76-81 GHz automotive corner radar sensors.
Unveiling the Future: Insights on Next-Gen Megtron Materials
02/13/2025 | Marcy LaRont, I-Connect007In this interview from DesignCon, Jim Kenny, OEM business development manager at Panasonic, touches on next-generation Megtron materials and delves into the industry's growing demand for high-speed, low-loss laminate systems, particularly in light of the anticipated 224 gigabits per second technology. With a focus on material development and production timelines, Jim highlights the challenges and opportunities in meeting customer needs while also maintaining quality and supply chain stability. As Panasonic prepares for the evolving landscape, they remain committed to innovating in this competitive market.