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Beyond the Rulebook
What happens when the rule book is no longer useful, or worse, was never written in the first place? In today’s fast-moving electronics landscape, we’re increasingly asked to design and build what has no precedent, no proven path, and no tidy checklist to follow. This is where “Design for Invention” begins.
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From the growing role of AI in design tools to the challenge of managing cumulative tolerances, these articles in this issue examine the technical details, design choices, and manufacturing considerations that determine whether a board works as intended.
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MKS’ Atotech to Participate in JPCA Show
May 22, 2023 | AtotechEstimated reading time: 1 minute
MKS Instruments is excited to join the upcoming JPCA Show at Tokyo Big Sight held from May 31 to June 2, 2023. The team will represent our strategic brands, Atotech and ESI, and will introduce our latest products and manufacturing solutions for PCB and package substrate manufacturing.
MKS Atotech and ESI teams are represented by a select group of industry and technology experts from across various business sectors and can be found at booth 6B-11. We are looking forward to learn about your latest requirements and explain what we can do for you with our new combined product offering.
MKS is highly committed to driving next-level technological developments within its industries and key installations at our local TechCenter in Yokohama to support next generation package substrate development working towards meeting 5/5µm L/S targets. By combining leading capabilities in lasers, optics, motion, process chemistry and equipment, we are positioned to Optimize the InterconnectSM, a significant enabling point of next-generation advanced electronics that represents the next frontier for miniaturization and complexity.
Our show highlights include:
G-Plate: Vertical desmear and electroless HVM plating tool for next-generation high-end package substrates with well-organized particle control
Cuprapulse XP7-IN: Vertical pulse plating with inert process to improve thickness distribution, especially high and low TH density area and very suitable for inner layer of next-generation package substrates
NovaBond® EX-S2: Adhesion Promoter for the latest ABFs with zero-line width reduction and minimized surface nano-roughness. Very suitable for ultra-fine lines and high frequency applications due to its nearly impeccable signal integrity
Stanna-CAT: New autocatalytic tin bath with no thickness limitation and no selectivity of plated metal
Geode A: CO2 laser system for high precision and high-speed ABF build-up laminate processing
Capstone: Flex PCB UV drilling tool for high-performance breakthrough productivity
Conference: JPCA Show 2023
Date: May 31, to June 2, 2023
Booth: 6B-11
Venue: Tokyo Big Sight (East Exhibition Halls)
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Klaus Koziol - atgSuggested Items
I-Connect007 Releases Episode 4 of ‘PCB Materials: The Backbone and Future of Electronics’ Podcast Series
04/09/2026 | I-Connect007I-Connect007 is excited to announce the release of Episode 4 in its six-part podcast series with Isola experts, PCB Materials: The Backbone and Future of Electronics. Titled “Reliability Under Pressure—PCBs in Harsh Environments,” this episode explores the challenges of maintaining long-term performance in demanding applications like aerospace, automotive, and defense. Host Marcy LaRont speaks with Laura Martin, director of strategic markets at Isola, about what reliability truly means when printed circuit boards are pushed to their limits.
EIPC Winter Conference Review: From Innovation to Qualification
02/13/2026 | Pete Starkey, I-Connect007Refreshed after a reasonably early night and a restful sleep, delegates dutifully re-assembled for Day 2 and Session 4 of EIPC’s Winter Conference in Aix-en-Provence on Feb. 4, “Driving the Future: Innovation, Energy, and Sustainability in PCB Technology.” The theme of this session, moderated by EIPC board member Martyn Gaudion, CEO of Polar Instruments, was “From innovation to qualification: New materials, processes and applications.” His first speaker was Steve Driver, whose presentation was entitled “Ideation > Certification > Qualification > Integration” and subtitled “The journey of a disruptor.”
Fresh PCB Concepts: Cost Stability in a Period of Copper and Gold Volatility
02/12/2026 | Team NCAB -- Column: Fresh PCB ConceptsAnyone who works with PCBs in any capacity right now can feel that copper and laminate prices are not stagnant, gold price is increasing even faster, and the impact shows up quickly on PCB quotations. For many design teams, this feels like a force outside their control. Raw materials go up, and the board cost goes with it. I want to highlight that many of these swings are manageable.
Flex Circuit Connectors Standard and Custom Parts Offered
02/04/2026 | PRNewswireETCO Incorporated has introduced a line of connectors for attaching wires to laminates and other flexible circuits that must bend, fold, or fit into tight, moving, or weight-sensitive spaces in consumer, medical, aerospace, and military applications.
DuPont to Outline Value Creation Strategy and Financial Framework
09/18/2025 | PRNewswireDuPont is hosting its 2025 Investor Day with members of its senior leadership team to introduce the new DuPont portfolio following the intended spin-off of its electronics business, Qnity Electronics, Inc. on November 1, 2025..