Qualcomm, Microsoft Align Efforts to Scale On-Device AI at Build
May 26, 2023 | Qualcomm Technologies, Inc.Estimated reading time: 1 minute

During Microsoft Build 2023, Qualcomm Technologies, Inc. displayed its latest innovations in on-device AI, including showing generative AI running on Snapdragon® compute platforms, as well as new pathways for developers building applications for Windows 11 PCs powered by Snapdragon.
"For generative AI to become truly mainstream, much of the inferencing will need to be executed on edge devices," said Ziad Asghar, senior vice president of product management, Qualcomm Technologies, Inc. "Our best-in-class AI hardware and software empowers developers to make full use of our powerful AI capabilities, delivering incredible new user experiences on laptops, phones and other devices powered by Snapdragon."
The future of AI needs to include both on-device and cloud AI. Running AI applications on device improves cost effectiveness, privacy, personalization, and latency. Snapdragon platforms include a dedicated Qualcomm® AI Engine to process AI workloads more efficiently than when processed purely on CPU or GPU, making on-device AI possible even in small, thin, and light devices.
At Microsoft Build, Qualcomm Technologies will show demos and offer tools to help develop generative AI on the next generation of Windows 11 PCs. Stable Diffusion, a text-to-image generative AI model with more than 1 billion parameters, now runs entirely on the device, and the Company says it sees a clear path to running models with up to 10 billion parameters on devices in the coming months, including large language models (LLMs). To enhance the Qualcomm® AI Stack and help developers create the next generation of on-device AI experiences, the Qualcomm AI Engine Direct SDK will be made available to the public for the first time at Build. With the ONNX Runtime and Qualcomm AI Stack, you can run your AI workloads today on the Snapdragon 8cx Gen 3 AI Engine on both the Surface Pro 9 5G and Lenovo ThinkPad x13s.
“Both cloud and device processing are needed to extend AI across the vast universe of devices and applications,” said Pavan Davuluri, Corporate VP, Windows Silicon and System Integration at Microsoft. “By bringing together Microsoft’s cloud AI leadership and the capabilities of the Windows platform with Qualcomm Technologies’ on-device AI expertise, we will accelerate the opportunities for generative AI experiences.”
Qualcomm Technologies will also show at Build the dramatic performance improvements available when popular applications are compiled natively for Snapdragon, as well as debut a new developer portal which collects critical tools, resources and support for Windows on Snapdragon development in one easy-to-use location.
Suggested Items
DuPont Unveils Brand Identity for Qnity, Future Electronics Spin-Off
05/15/2025 | PRNewswireDuPont unveiled the branding of Qnity, the planned independent Electronics public company that will be created through the intended spin-off of its Electronics business*.
SMC Korea 2025 to Spotlight Next-Generation Memory and Materials Innovation amid AI Boom
05/13/2025 | SEMIThe Strategic Materials Conference (SMC) Korea 2025 is set to convene on May 14 at the Suwon Convention Center in Gyeonggi-do, South Korea, bringing together leading experts and innovators to highlight the critical role of materials innovation in addressing the performance, efficiency, and scalability requirements of AI-enabled semiconductor devices.
AI Chips for the Data Center and Cloud Market Will Exceed US$400 Billion by 2030
05/09/2025 | IDTechExBy 2030, the new report "AI Chips for Data Centers and Cloud 2025-2035: Technologies, Market, Forecasts" from market intelligence firm IDTechEx forecasts that the deployment of AI data centers, commercialization of AI, and the increasing performance requirements from large AI models will perpetuate the already soaring market size of AI chips to over US$400 billion.
Koh Young Invites You to the 2025 IEEE Electronic Components and Technology Conference
05/06/2025 | Koh YoungKoh Young, the industry leader in True3D™ measurement-based inspection solutions, invites you to join us at the 2025 IEEE Electronic Components and Technology Conference (ECTC), taking place May 27–30, 2025, at the Gaylord Texan Resort & Convention Center in Grapevine, Texas
SEMI 3D & Systems Summit to Spotlight Trends in Hybrid Bonding, Chiplet Architecture and Geopolitical Dynamics
05/01/2025 | SEMILeading experts in 3D integration and systems for semiconductor manufacturing applications will gather at the annual SEMI 3D & Systems Summit, June 25-27, 2025, in Dresden.