Brian O’Donnelly Appointed to Expanded Role, Strengthening Global Leadership to Drive Growth in the Fujifilm’s Electronic Materials Business
July 31, 2025 | FujifilmEstimated reading time: 2 minutes
FUJIFILM Corporation (President and CEO, Representative Director: Teiichi Goto) today announced that the company has appointed Brian O’Donnelly as its Corporate Vice President, strengthening global leadership to drive growth in the Electronic Materials Business. He will continue serving as the President and CEO of FUJIFILM Electronic Materials USA, Inc., Senior Deputy General Manager of the Electronic Materials Business Division, FUJIFILM Corporation and Global Vice President of FUJIFILM Electronic Materials.
Born and educated in Scotland, O’Donnelly has spent the majority of his 40-year career working in the Chemical and Semiconductor Materials industries, joining Fujifilm group in 2004. In 2014, he was appointed President and CEO of FUJIFILM Electronic Materials USA, where he has led significant growth of the business and its contributions to Fujifilm through new product development, customer and product portfolio expansions, and mergers and acquisitions.
“Brian is a strong leader who has long contributed to the development of the Fujifilm’s Electronic Materials business, not just in North America, but also globally through strategic acquisitions and integrations that have allowed us to expand our portfolio of products and services to meet the needs of the world’s top semiconductor manufacturers,” said Tetsuya Iwasaki, Director, Senior Vice President and General Manager of the Electronic Materials Business Division, who leads the global business.
Prior to joining Fujifilm, O’Donnelly worked for Olin Corporation’s Materials Metal Research Labs in R&D, as well as Arch Chemicals, where he held progressively more senior roles in finance, strategic planning, M&A and business management within its Chemicals and Electronic Materials Divisions.
“I am looking forward to continuing to help our global business realize its full growth potential and be the leading and most trusted Electronic Materials partner in the global semiconductor industry,” said O’Donnelly. “As Corporate Vice President at FUJIFILM Corporation, I am honored to contribute to the company’s commitment to global diversity and to be part of an inclusive leadership culture that reflects our expanding global business portfolio.”
O’Donnelly holds a PhD in Metallurgy from the University of Strathclyde in Glasgow, Scotland. He earned his MBA in Finance & Strategy Planning from the University of New Haven in Connecticut.
Subscribe
Stay ahead of the technologies shaping the future of electronics with our latest newsletter, Advanced Electronics Packaging Digest. Get expert insights on advanced packaging, materials, and system-level innovation, delivered straight to your inbox.
Subscribe now to stay informed, competitive, and connected.
Suggested Items
I-Connect007 Announces Upcoming Issue of Advanced Electronics Packaging Digest
05/13/2026 | I-Connect007The next issue of Advanced Electronics Packaging Digest examines the materials, architectures, and integration strategies shaping the next phase of electronics innovation, from reinforcement materials under thermal and frequency pressure to heterogeneous integration and advanced packaging as a system-level scaling factor.
Indium Experts to Address Data Center Thermal Management and Sintering Standards at SMTA Conference
05/13/2026 | Indium CorporationAs a leading materials provider for the advanced electronic packaging market, Indium Corporation® experts will share their technical insight and knowledge on two critical industry topics—data center thermal management and sintering protocols—at the SMTA Electronics in Harsh Environments Conference, May 19-21, in Amsterdam, Netherlands.
AI Demand Drives PCB Material Market Growth
05/08/2026 | TPCAAs AI computing continues to drive a comprehensive upgrade in hardware specifications, the global printed circuit board industry is undergoing a profound structural transformation.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
05/01/2026 | Michelle Te, I-Connect007If it feels like the PCB industry is accelerating faster than ever, you’re not imagining it. From advanced materials driven by AI applications to renewed investment in domestic manufacturing—and the next generation stepping into critical roles—there’s a lot shifting at once. My selections for this week highlight where the pressure points are forming, and where the opportunities are emerging.
Electronics Manufacturing Needs Your Voice: Global Sentiment Survey Now Live
04/30/2026 | Global Electronics AssociationThe latest monthly Global Sentiment Survey from the Global Electronics Association is now open. At a time when demand uncertainty, policy shifts, energy costs, and supply chain recalibration are pulling the industry in multiple directions, the survey captures something macroeconomic data often misses: how manufacturers are actually experiencing conditions on the ground.