Brian O’Donnelly Appointed to Expanded Role, Strengthening Global Leadership to Drive Growth in the Fujifilm’s Electronic Materials Business
July 31, 2025 | FujifilmEstimated reading time: 1 minute
FUJIFILM Corporation (President and CEO, Representative Director: Teiichi Goto) today announced that the company has appointed Brian O’Donnelly as its Corporate Vice President, strengthening global leadership to drive growth in the Electronic Materials Business. He will continue serving as the President and CEO of FUJIFILM Electronic Materials USA, Inc., Senior Deputy General Manager of the Electronic Materials Business Division, FUJIFILM Corporation and Global Vice President of FUJIFILM Electronic Materials.
Born and educated in Scotland, O’Donnelly has spent the majority of his 40-year career working in the Chemical and Semiconductor Materials industries, joining Fujifilm group in 2004. In 2014, he was appointed President and CEO of FUJIFILM Electronic Materials USA, where he has led significant growth of the business and its contributions to Fujifilm through new product development, customer and product portfolio expansions, and mergers and acquisitions.
“Brian is a strong leader who has long contributed to the development of the Fujifilm’s Electronic Materials business, not just in North America, but also globally through strategic acquisitions and integrations that have allowed us to expand our portfolio of products and services to meet the needs of the world’s top semiconductor manufacturers,” said Tetsuya Iwasaki, Director, Senior Vice President and General Manager of the Electronic Materials Business Division, who leads the global business.
Prior to joining Fujifilm, O’Donnelly worked for Olin Corporation’s Materials Metal Research Labs in R&D, as well as Arch Chemicals, where he held progressively more senior roles in finance, strategic planning, M&A and business management within its Chemicals and Electronic Materials Divisions.
“I am looking forward to continuing to help our global business realize its full growth potential and be the leading and most trusted Electronic Materials partner in the global semiconductor industry,” said O’Donnelly. “As Corporate Vice President at FUJIFILM Corporation, I am honored to contribute to the company’s commitment to global diversity and to be part of an inclusive leadership culture that reflects our expanding global business portfolio.”
O’Donnelly holds a PhD in Metallurgy from the University of Strathclyde in Glasgow, Scotland. He earned his MBA in Finance & Strategy Planning from the University of New Haven in Connecticut.
Testimonial
"Our marketing partnership with I-Connect007 is already delivering. Just a day after our press release went live, we received a direct inquiry about our updated products!"
Rachael Temple - AlltematedSuggested Items
Sealed for Survival: Potting Electronics for the Toughest Environments
10/29/2025 | Beth Massey, MacDermid Alpha Electronics SolutionsElectronics deployed in harsh conditions face relentless threats from vibration, impact, chemical contaminants, airborne pollutants, and moisture, conditions that can quickly lead to failure without robust protection. Potting, the process of encapsulating electronics in a protective polymer, is a widely used strategy to safeguard devices from both environmental and mechanical hazards.
Driving Innovation: Mechanical and Optical Processes During Rigid-flex Production
10/28/2025 | Kurt Palmer -- Column: Driving InnovationRigid-flex printed circuit boards are a highly effective solution for placing complex circuitry in tight, three-dimensional spaces. They are now indispensable across a range of industries, from medical devices and aerospace to advanced consumer electronics, helping designers make the most efficient use of available space. However, their unique construction—combining rigid and flexible materials—presents a fundamental challenge for PCB manufacturers.
SMTAI 2025 Review: Reflecting on a Pragmatic and Forward-looking Industry
10/27/2025 | Marcy LaRont, I-Connect007Leaving the show floor on the final afternoon of SMTA International last week in Rosemont, Illinois, it was clear that the show remains a grounded, technically driven event that delivers a solid program, good networking, and an easy space to commune with industry colleagues and meet with customers.
ITW EAE Despatch Ovens Now Support ASTM 5423 Testing
10/15/2025 | ITW EAEAs the demand for high-performance electrical insulation materials continues to grow—driven by the rapid expansion of electric vehicles (EVs) and energy storage systems—thermal processing has become a critical step in material development.
Beyond Thermal Conductivity: Exploring Polymer-based TIM Strategies for High-power-density Electronics
10/13/2025 | Padmanabha Shakthivelu and Nico Bruijnis, MacDermid Alpha Electronics SolutionsAs power density and thermal loads continue to increase, effective thermal management becomes increasingly important. Rapid and efficient heat transfer from power semiconductor chip packages is essential for achieving optimal performance and ensuring long-term reliability of temperature-sensitive components. This is particularly crucial in power systems that support advanced applications such as green energy generation, electric vehicles, aerospace, and defense, along with high-speed computing for data centers and artificial intelligence (AI).