MKS Introduces ESI Geode A CO2 Laser System for High Precision and High-Speed ABF IC Substrate Manufacturing
May 31, 2023 | MKS Instruments, Inc.Estimated reading time: 1 minute

MKS Instruments, Inc., a global provider of technologies that transform our world, announced the official launch of the ESI Geode® A laser drill system today, a new configuration of the Geode® platform designed explicitly for drilling vias in the non-copper-clad ABF substrate market.
The Geode® A laser drilling system provides processing and application solutions for the FCBGA package substrate market, components which provide critical building blocks for everyday electronic devices and, in particular, high-performance computing. FCBGA substrates help enable supercomputing, artificial intelligence processing, autonomous cars, and other highly complex semiconductor modules.
“Manufacturers are under increased market pressure to deliver components that meet the precise demands of miniaturization and complexity required for advanced substrate manufacturing. At MKS, we are keenly focused on delivering the advanced technology needed for our customers to deliver next-generation productivity and quality,” said John Williams, MKS Vice President and General Manager of the ESI business. “In addition, the Geode® A laser drill is engineered as an integral component to the MKS Optimize the Interconnect SM solution, combining ESI laser drilling technologies with Atotech chemistry and plating equipment to provide customers with a full package of via formation technologies required to deliver optimal quality with the highest productivity for PCB and package substrate products.”
The Geode® A laser drilling system combines an innovative laser and optics configuration with precision pulse-shaping and beam-steering designed for ABF materials. These engineering innovations deliver the lowest cost of ownership and a greener manufacturing solution through 21% less floor space utilization, 72% less weight, and up to 65% less power consumption than the competition.
The Geode® A laser drilling system is available for purchase. More details can be found at www.esi.com, and system experts will be available at the JPCA 2023, Tokyo, Japan, May 31-June 2 in booth 6B-11.
Testimonial
"Our marketing partnership with I-Connect007 is already delivering. Just a day after our press release went live, we received a direct inquiry about our updated products!"
Rachael Temple - AlltematedSuggested Items
Trouble in Your Tank: Implementing Direct Metallization in Advanced Substrate Packaging
09/15/2025 | Michael Carano -- Column: Trouble in Your TankDirect metallization systems based on conductive graphite are gaining popularity throughout the world. The environmental and productivity gains achievable with this process are outstanding. Direct metallization reduces the costs of compliance, waste treatment, and legal issues related to chemical exposure. A graphite-based direct plate system has been devised to address these needs.
Closing the Loop on PCB Etching Waste
09/09/2025 | Shawn Stone, IECAs the PCB industry continues its push toward greener, more cost-efficient operations, Sigma Engineering’s Mecer System offers a comprehensive solution to two of the industry’s most persistent pain points: etchant consumption and rinse water waste. Designed as a modular, fully automated platform, the Mecer System regenerates spent copper etchants—both alkaline and acidic—and simultaneously recycles rinse water, transforming a traditionally linear chemical process into a closed-loop system.
Driving Innovation: Depth Routing Processes—Achieving Unparalleled Precision in Complex PCBs
09/08/2025 | Kurt Palmer -- Column: Driving InnovationIn PCB manufacturing, the demand for increasingly complex and miniaturized designs continually pushes the boundaries of traditional fabrication methods, including depth routing. Success in these applications demands not only on robust machinery but also sophisticated control functions. PCB manufacturers rely on advanced machine features and process methodologies to meet their precise depth routing goals. Here, I’ll explore some crucial functions that empower manufacturers to master complex depth routing challenges.
Trouble in Your Tank: Minimizing Small-via Defects for High-reliability PCBs
08/27/2025 | Michael Carano -- Column: Trouble in Your TankTo quote the comedian Stephen Wright, “If at first you don’t succeed, then skydiving is not for you.” That can be the battle cry when you find that only small-diameter vias are exhibiting voids. Why are small holes more prone to voids than larger vias when processed through electroless copper? There are several reasons.
The Government Circuit: Navigating New Trade Headwinds and New Partnerships
08/25/2025 | Chris Mitchell -- Column: The Government CircuitAs global trade winds continue to howl, the electronics manufacturing industry finds itself at a critical juncture. After months of warnings, the U.S. Government has implemented a broad array of tariff increases, with fresh duties hitting copper-based products, semiconductors, and imports from many nations. On the positive side, tentative trade agreements with Europe, China, Japan, and other nations are providing at least some clarity and counterbalance.