Share on:

Share on LinkedIn Share on X Share on Facebook Share with email

Suggested Items

$134.3M DoD Contract Expands Micross Advanced Interconnect OSAT Capabilities in the US

11/27/2023 | PRNewswire
Micross Components, a leading provider of high-reliability microelectronic products and services for aerospace, defense, space, medical, energy, and other high-reliability applications, is pleased to announce that it has received an award under the IBAS Cornerstone RESHAPE program with a ceiling value of up to $134.3 million, with $45.6 million obligated at the time of the award.

Würth Elektronik Launches Research Project HyPerStripes

11/27/2023 | Wurth Elektronik
HyPerStripes project partners will create a technology platform including manufacturing techniques for roll-to-roll (R2R) processing as well as the integration of electronic components onto very long ("endless"), flexible and stretchable printed circuit boards.

AT&S Establishes the Cleanest Working Environment in Styria

11/24/2023 | AT&S
As a globally active high-tech group and a key driver of technological development in microelectronics, AT&S is currently completing its “lighthouse project” in Leoben-Hinterberg.

Shifting Camera Integration Trends Expected to Cause an 8.9% Decline in Smartphone Camera Module Shipments in 2023

11/22/2023 | TrendForce
TrendForce reports a significant 8.9% decrease in shipments of smartphone camera modules in 2023, totaling around 4.065 billion units.

SCHMID Group Pleased with productronica 2023

11/21/2023 | SCHMID Group
The SCHMID Group, a global solution provider for the high-tech electronics, photovoltaics, glass and energy systems industries, is very pleased with the course of productronica in Munich.
Copyright © 2023 I-Connect007 | IPC Publishing Group Inc. All rights reserved. Log in