J.A.M.E.S, Fuji Corporation Join Forces to Drive Innovation in 3D Manufacturing
June 1, 2023 | J.A.M.E.SEstimated reading time: 2 minutes

J.A.M.E.S, the collaborative community for additively manufactured electronics (AME) development, is pleased to announce its partnership with Fuji Corporation, a leading manufacturing company known for its innovative technologies. This partnership aims to drive innovation in the 3D manufacturing industry by combining the expertise and resources of both companies.
J.A.M.E.S is establishing a collaborative community that brings together professionals and enthusiasts from various fields to drive AME development in 3D printed electronics. This community aims to provide a platform for technical knowledge sharing, design enablement, and real-time communication with experts from different manufacturing industries.
Fuji Corporation will have access to and contact J.A.M.E.S community members to gain knowledge of the latest market trends, demands, and insights. Additionally, members of the J.A.M.E.S community will benefit from access to Fuji’s innovative technologies and expertise in pick-and-place machines. This collaboration will allow both companies to work together on upcoming projects, share insights, and develop new ideas and solutions to meet the needs of the 3D manufacturing industry.
Fuji Corporation is a manufacturing company known for its innovative technologies. The company has a long history of developing first-in-the-world technologies. It is best known for developing, manufacturing, and selling its Surface Mount Technology (SMT) electronics assembly pick and place machines and industry-leading Computer Numerical Control (CNC) automatic lathes. In addition, Fuji has expanded its business into the medical, nursing care, and logistics fields, utilizing its vast technological expertise.
Fuji has developed a unique electronics 3D printer—FPM-Trinity—that combines resin substrate printing, circuit printing, and component mounting to enable complete additive manufacturing of electronic devices in a single machine.
Andreas Müller, the CEO of J.A.M.E.S, expressed, ?We are excited to partner with Fuji Corporation and gain access to their innovative technologies and insights. This collaboration will allow J.A.M.E.S to expand our network of expertise and resources while also sharing our knowledge and market knowledge with Fuji. Together, we aim to develop further ideas and solutions to drive innovation in the 3D printed electronics industry. We believe this partnership is a significant step towards achieving our shared goal of advancing the AME technology into the 3D manufacturing industry through collaboration.”
J.A.M.E.S and Fuji Corporation are committed to advancing the 3D manufacturing industry through collaboration and innovation. Both companies aim to develop innovative solutions and ideas that meet the ever-evolving needs of the 3D printing industry by leveraging their expertise and resources.
Testimonial
"Advertising in PCB007 Magazine has been a great way to showcase our bare board testers to the right audience. The I-Connect007 team makes the process smooth and professional. We’re proud to be featured in such a trusted publication."
Klaus Koziol - atgSuggested Items
Foxconn's Rotating CEO, Yang Qiujin, Named One of Asia's Most Influential Women
10/15/2025 | Foxconn ElectronicsHon Hai Precision Industry Co., Ltd.'s management team has once again received recognition! Rotating CEO Kathy Yang has been named to Fortune magazine's " Most Powerful Women Asia 2025 " list of the 100 most influential women in Asia , achieving a remarkable fifth place in her debut.
Light-curable Solutions for Reliable Electronics in Space Applications
10/15/2025 | Virginia Hogan, DymaxDesigning electronics for space environments, particularly those in low Earth orbit (LEO), requires careful consideration of materials that can withstand extreme conditions while supporting long-term reliability. Engineers designing satellite systems, aerospace instrumentation, and high-altitude platforms face a familiar set of challenges: contamination control, mechanical stress, thermal cycling, and manufacturability.
Advanced Semiconductor Packaging Market Sees Rising Adoption Across Automotive and Industrial Sectors
10/14/2025 | openPRThe semiconductor packaging market size is estimated to reach at a CAGR of 7.2% during the forecast period (2024-2031).
Imec Launches 300mm GaN Program to Develop Advanced Power Devices and Reduce Manufacturing Costs
10/13/2025 | ImecImec, a world-leading research and innovation hub in nanoelectronics and digital technologies, welcomes AIXTRON, GlobalFoundries, KLA Corporation, Synopsys, and Veeco as first partners in its 300mm gallium-nitride (GaN) open innovation program track for low- and high-voltage power electronics applications.
NEDME Returns October 22 — The Northwest’s Premier Design & Manufacturing Expo
10/13/2025 | NEDMEThe Northwest Electronics Design & Manufacturing Expo (NEDME) returns on Wednesday, October 22, 2025, at Wingspan Event & Conference Center, Hillsboro. The event brings together engineers, product designers, manufacturers, educators, and community partners for a full day of industry connection, learning, and networking.