NI, Spirent Announce First Comprehensive Test Solution for OpenRAN O-RU Customers
June 5, 2023 | Business WireEstimated reading time: 2 minutes

NI and Spirent Communications announced the first and only O-RU (Radio Unit) test solution that uses application layer testing with any commercial device, providing comprehensive, real-time O-RU validation. This unique capability enables customers to validate their systems faster and in a real-world environment while reducing costs - all in one highly capable validation solution.
Traditional testing of O-RAN systems has been very time-intensive and cost-prohibitive due to its need for engineers to manually test their systems from beginning to end. Built on common technologies, the Spirent/NI joint solution combines Spirent’s software and emulation environment, including pre-built test cases, with NI’s high-performance instrumentation, providing a robust and integrated O-RU validation solution that improves time to market with full automation through a single, intuitive GUI while also minimizing instrument cost and footprint.
“Spirent and NI have a long history of providing joint solutions that enable our customers to accelerate the production of their products,” said Chen Chang, Senior Director, Strategic Business Development, NI. “Combining Spirent’s best-in-class methodology with NI’s versatile and powerful product lineup is a critical step in standardizing and accelerating O-RAN ORU development.”
“Major chipset developers, equipment manufacturers, and carriers around the world are already benefitting from NI and Spirent working together to provide innovative solutions,” said James Kimery, Vice President of Product Management, Lifecycle Service Assurance, Spirent. “This latest solution for the Open RAN space demonstrates how our continued collaboration is addressing critical testing gaps created by disaggregating the RAN that will expand the market by unambiguously validating true multivendor interoperability.”
The solution wraps the O-RU with a real-time O-DU emulator through a fully compliant O-RAN 7.2 interface, a CU emulator, a core network emulator, and a commercial UE emulator for real-world Interoperability Testing (IOT) to deliver a testbed capable of running real-world test scenarios in the lab. Customers can also use a commercial device in place of the UE emulator to validate all timing, full throughput including 4x4 MIMO, and any system-level test that an O-RU would experience in a real-world deployment scenario to test true performance and interoperability at a functional level rather than at the interface. On the production side, NI also has an O-RAN O-RU APT test system which uses the same O-DU emulation and combines this with NI’s PXIe-5841 VST for parametric measurements for best-in-class efficiency with unmatched measurement accuracy.
This test system is highly configurable, real-time, and ORAN FH compliant. It enables customers to configure the O-DU to emulate various timing profiles, test corner cases, and validate the system performance under real-time conditions. In addition, having the same test systems used in validation facilitates a streamlined O-RU development process that connects validation to production and drastically reduces test time, cost, and development effort.
Testimonial
"The I-Connect007 team is outstanding—kind, responsive, and a true marketing partner. Their design team created fresh, eye-catching ads, and their editorial support polished our content to let our brand shine. Thank you all! "
Sweeney Ng - CEE PCBSuggested Items
Light-curable Solutions for Reliable Electronics in Space Applications
10/15/2025 | Virginia Hogan, DymaxDesigning electronics for space environments, particularly those in low Earth orbit (LEO), requires careful consideration of materials that can withstand extreme conditions while supporting long-term reliability. Engineers designing satellite systems, aerospace instrumentation, and high-altitude platforms face a familiar set of challenges: contamination control, mechanical stress, thermal cycling, and manufacturability.
Analog Devices Launches ADI Power Studio™ and New Web-Based Tools
10/14/2025 | Analog Devices, Inc.Analog Devices, Inc., a global semiconductor leader, announced the launch of ADI Power Studio, a comprehensive family of products that offers advanced modeling, component recommendations and efficiency analysis with simulation. In addition, ADI is introducing early versions of two new web-based tools with a modernized user experience under the Power Studio umbrella:
Elementary, Mr. Watson: High Power: When Physics Becomes Real
10/15/2025 | John Watson -- Column: Elementary, Mr. WatsonHave you ever noticed how high-speed design and signal integrity classes are always packed to standing room only, but just down the hall, the session on power electronics has plenty of empty chairs? It's not just a coincidence; it's a trend I've observed over the years as both an attendee and instructor.
Beyond Thermal Conductivity: Exploring Polymer-based TIM Strategies for High-power-density Electronics
10/13/2025 | Padmanabha Shakthivelu and Nico Bruijnis, MacDermid Alpha Electronics SolutionsAs power density and thermal loads continue to increase, effective thermal management becomes increasingly important. Rapid and efficient heat transfer from power semiconductor chip packages is essential for achieving optimal performance and ensuring long-term reliability of temperature-sensitive components. This is particularly crucial in power systems that support advanced applications such as green energy generation, electric vehicles, aerospace, and defense, along with high-speed computing for data centers and artificial intelligence (AI).
Bluepath Robotics Optimizes AMR Fleets with Inductive Charging Solution from Wiferion
10/09/2025 | WiferionIn a dynamic and highly competitive industry such as logistics, efficient and uninterrupted material flows are of crucial importance. To ensure maximum uptime for its robots, Bluepath Robotics, which specializes in autonomous mobile robots (AMR), needed a reliable and powerful power supply.