American Made Advocacy: Success in Washington Requires Patience, Persistence, and Sustained Focus
The Government Circuit: News on Defense Electronics, Europe, and Sustainability
Defense Speak Interpreted: SWaPing Nanosatellites for Defense Systems
Toyochem Develops Highly Flexible EMI Shielding Films for Smart Devices
June 9, 2023 | ToyochemEstimated reading time: 1 minute
Toyochem Co., Ltd., the polymer and coatings division of Japan’s Toyo Ink Group, has rolled out the new LIOTELAN line of highly flexible conductive and insulating sheet films for the protection of electrical and electronic equipment. The new sheet films exhibit high water-resistance and are highly flexible with a high elongation of 500 percent. LIOTELAN shielding films can be hot-press molded on to the electromagnetic interference (EMI) noise source on the printed circuit board (PCB), thus forming a lightweight multi-layer shield with a more compact format than a metal shielding can. The gives component engineers increased design freedom to create electronic devices of lower profiles and lighter weights – and without compromising shielding effectiveness. Potential applications are wearable devices, wireless communications and other smart devices.
Traditionally, metals are commonly adapted as EMI shields due to their shielding effectiveness. Looking to replace shielding metals, Toyochem engineers in Japan applied its own functional filler dispersion technology in the development of highly conductive fillers to improve EMI shielding performance. This development, and the application of Toyochem’s polymer sheet conversion technology, led to the creation of filler films that could be converted into flexible LIOTELAN sheet films with high shielding effect, water-resistance and mechanical durability.
Moreover, LIOTELAN sheets films are capable of fabricating multi-layer EMI shields by the hot-pressing method. “An insulating sheet layer can be hot-press molded directly over electronic components attached to the substrate. A conductive layer is formed over the insulating layer using the same method. With LIOTELAN shielding films, device engineers can easily and speedily create lightweight, durable and effective EMI shields, without the need for soldering or a bulky can cover,” explains Hidenobu Kobayashi, technical manager at Toyochem. “This new innovative product enables the formation of ultra-thin shielding laminates of high flexibility, conductivity and insulation properties required by next-generation PCBs. In line with rising demand for components of lighter weight, lower profiles, and more durable and flexible materials, we expect to see the trend towards metals being replaced by polymer composites to continue.”
The new LIOTELAN line of EMI shielding sheet films will be making its global debut at the Toyochem booth #1016 at the International Microwave Symposium in San Diego, California, from June 11–16, 2023. Toyochem will also feature its LIOELM™ TSS™ 500 series for next-generation high-speed communication devices among other high-performance materials designed to solve problems related to electromagnetic radiation and thermal conductivity.
Share on:
Suggested Items
Overview of Soldering Systems With Vacuum
12/18/2024 | Dr. Paul Wild, Rehm Thermal Systems GmbHWhen soldering electronic assemblies, the focus of the vacuum application is on the removal of volatile substances from the solder joints and the associated reduction of pore formation. Particularly in the thermal management of power electronics components, pores can cause so-called hotspots with higher temperatures due to their poor heat conduction. These hotspots can lead to overheating of the components on the one hand and to thermally induced destruction of the solder structure on the other.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
12/13/2024 | Andy Shaughnessy, I-Connect007This week, Peter Tranitz discusses the upcoming Pan-European Electronics Design Conference, set for Jan. 29-30 in Vienna, Austria. Pete Starkey brings us a review of the most recent EIPC Technical Snapshot webinar, which featured a global PCB maker update by Dr. Hayao Nakahara. Don't miss our interview with Manfred Huschka, who explains how companies can begin their own China Plus One plan. Stan Farnsworth breaks down photonic soldering and discusses its use in soldering materials that are not typically compatible. I also enjoyed Dan Beaulieu’s discussion on the value of consistency, and why just showing up for work is half the battle, especially in an inconsistent, evolving industry like ours.
Advancing Photonic Soldering
12/11/2024 | Nolan Johnson, SMT007 MagazineStan Farnsworth, director of customer satisfaction at PulseForge, discusses the advancements in photonic soldering that highlight its energy efficiency and versatility. Over the past two years, the company has refined its applications for flexible substrates and energy reduction, finding that photonic soldering allows the processing of materials that typically aren’t thermally compatible and offers significant energy savings compared to traditional methods.
Indium Introduces New ROL0 and Halogen-free Flux-cored Wire
12/11/2024 | Indium CorporationIndium Corporation announced the global availability of CW-807RS, a new high-reliability, halide- and halogen-free flux-cored wire that improves wetting speeds and cycle times for electronics assembly and robot soldering applications.
SolderKing Celebrates a Year of Expansion, Innovation, and Sustainability Achievements
12/09/2024 | SolderKing Assembly Materials Ltd,SolderKing Assembly Materials Ltd, a leading UK-based manufacturer of soldering materials and consumables, has wrapped up 2024 with a series of milestones that reflect its ongoing growth and commitment to innovation.