Altus Introduces New High-Resolution Quins Inspection Solution
June 13, 2023 | Altus GroupEstimated reading time: 2 minutes
Altus Group, a leading supplier and service provider of capital equipment for the electronics industry, is pleased to introduce the innovative new Quins HR inspection solutions to its customers in the UK and Ireland. Developed by Quins with customer feedback in mind, these new high-resolution units are designed to effectively address the increasing challenges faced by manufacturers due to the shrinking size of components and the growing demands of inspection requirements.
With the widespread adoption of 01005 components, the need for the highest level of accuracy in inspection has become crucial to ensure fault detection and traceability for production support. The Quins LC20HR and LC20HR/UV units offer unparalleled image quality and resolution and is equipped with the LS30 Quins box boasting an impressive 4800 dpi capability. The system is accompanied by an upgraded SL300 computer, delivering enhanced data processing capabilities to handle the increased demands of modern inspection applications.
The enhanced resolution of the Quins LC20HR and LC20HR/UV units ensures that even the smallest components can be accurately inspected, meeting the stringent quality standards of the industry. The higher computing power also supports the enhanced processing required to maintain efficient production operations. Additionally, the modular software employed in all Quins variants makes inspection easy and stress-free for new product introduction (NPI) and small-scale production runs.
Anthony Oh, Operations Manager- Inspection Products at Altus Group, said: "We have had a great run since we partnered exclusively with Quins to support the UK and Irish market with their processes. Their products are really enjoyable to support, our customers find their products very interesting and valuable to use throughout the production process.
“What is ideal about Quins is that a single unit can be used for so many inspection processes to generate returns. This latest variant catering for 01005 components will only ensure that the offering of Quins remains complete and future proofed for many sites."
"We are always listening to customers and trying to stay ahead of their needs,” said Quins CEO Klaus Kornhaas. “We are seeing more and more applications with 01005 components stretching inspection apparatus at production facilities.”
“With Altus, we have significantly grown our market presence over the last years due to their extensive network in the industry. This high-spec machine will certainly be needed and do well within the UK, which has such a large market of Contract Electronics Manufacturers (CEMs) with brand new high-value electronics."
The new Quins LC20HR and LC20HR/UV inspection solution offers a significant improvement in resolution compared to previous units, with a maximum of 4,800 dpi and 2,400 dpi for an image size of approximately A4. reaching 4,800 dpi for images of A5. The HR system's computer features 32GB RAM and a 1TB SSD drive, along with an external 2TB USB SSD backup drive.
The Quins LC20HR and LC20HR/UV units provide the same versatile functionality as the standard solutions but with optional double or even quadruple magnification capabilities to meet the demands of intricate inspections.
Testimonial
"The I-Connect007 team is outstanding—kind, responsive, and a true marketing partner. Their design team created fresh, eye-catching ads, and their editorial support polished our content to let our brand shine. Thank you all! "
Sweeney Ng - CEE PCBSuggested Items
PCBA Market Poised to Reach $147.5 Billion by 2035
10/20/2025 | Globe NewswireGlobal printed circuit board assembly market is projected to reach $147.5 billion by 2035, at a CAGR of 4.7% during the forecast period 2025-2035
Würth Elektronik Participates in EU Initiative PROACTIF for Cutting-edge Drone and Robotics Solutions
10/14/2025 | Wurth ElektronikWürth Elektronik is a partner in the visionary EU project PROACTIF, funded under the Chips Joint Undertaking (Chips JU). The international consortium of 42 partners from 13 countries aims to strengthen Europe’s technological sovereignty i
Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
10/14/2025 | Nash Bell -- Column: Knocking Down the Bone PileBall grid array (BGA) components evolved from pin grid array (PGA) devices, carrying over many of the same electrical benefits while introducing a more compact and efficient interconnect format. Instead of discrete leads, BGAs rely on solder balls on the underside of the package to connect to the PCB. In some advanced designs, solder balls are on both the PCB and the BGA package. In stacked configurations, such as package-on-package (PoP), these solder balls also interconnect multiple packages, enabling higher functionality in a smaller footprint.
Sumitomo Riko Boosts Automotive Design Efficiency 10x with Ansys AI Simulation Technology
10/13/2025 | SynopsysSumitomo Riko is implementing Ansys, part of Synopsys, Inc. AI technology to accelerate time-to-solution and improve efficiency during the design and manufacturing of automotive components.
productronica: Increasing Demand for Tamper-proof Electronics
10/08/2025 | productronicaThe electronics industry will get together at productronica in Munich from November 18 to 21, 2025. One of the three key topics this year will be secure microelectronics.