Dan's Biz Bookshelf: 'Revenge of the Tipping Point'
Marcy's Musings: Engineering Economics
Punching Out: Should You Sell Your Company to a Private Equity Firm?
Cadence, Samsung Foundry Enter Multi-Year Agreement to Expand Design IP Portfolio
June 14, 2023 | Cadence Design Systems, Inc.Estimated reading time: 1 minute
Cadence Design Systems, Inc. announced ??that it has signed a multi-year agreement with Samsung Foundry to expand the availability of Cadence’s design IP portfolio on Samsung Foundry’s SF5A process technology, the latest 5nm process variant to support automotive applications. Through this agreement, joint customers can obtain a complete design IP solution from Cadence, a collaborative partner in the Samsung Advanced Foundry Ecosystem (SAFE™), including 112/56/25/10G PHY/MAC, PCI Express® (PCIe®) 6.0/5.0/4.0/3.1 PHY/Controller, Universal Chiplet Interconnect Express™ (UCIe™) PHY/Controller, USB3.x PHY/Controller and a complete PHY and controller offering for GDDR6 and DDR5/4.
The agreement also encompasses the enablement of the latest DDR5 8400+ and GDDR7 solutions on Samsung Foundry’s advanced SF3 technology, providing a future-proof migration path for leading customers seeking a high-performance, high-bandwidth memory interface solution for designing generative AI/ML, hyperscale, and high-performance computing (HPC) applications. The Cadence® design IP solution delivers optimal power, performance, and area (PPA) with rich feature sets to enable uncompromised differentiation, versatility, and innovation for large-scale SoC designs. In addition, Cadence provides full subsystem delivery with integrated PHY and controller IP to simplify integration, minimize risks, and enable faster time to market.
“Cadence and Samsung have been collaborating closely on Samsung EDA and IP ecosystem enablement for years. Through this new multi-year IP expansion plan, we further solidify our commitment to empowering joint customers with access to a complete design IP portfolio on SF5A technology as well as the leading DDR5 8400+ and GDDR7/6 solutions on SF3,” said Jongshin Shin, EVP of Samsung Foundry and Head of IP Ecosystem.
“Cadence is committed to expanding our IP portfolio to address our customers’ evolving design requirements,” said Rishi Chugh, vice president of product marketing in the IP Group at Cadence. “Through this collaboration with Samsung, we can deliver a rich set of high-performance IP with competitive PPA that meets the most demanding requirements for HPC, AI/ML, networking, storage, and automotive applications. Developing the latest GDDR7 IP on SF3 demonstrates our leadership in this market segment.”
Share on:
Suggested Items
Designing for Cost to Manufacture
11/21/2024 | Marcy LaRont, I-Connect007ICAPE's Richard Koensgen, a seasoned field application engineer with a rich background in PCB technology, shares his journey of working with customers and manufacturers through the intricacies of circuit board development and emphasizes the importance of early-stage collaboration with PCB designers. With a focus on tackling the most challenging aspects of PCB design and manufacturing, he discusses everything from layout considerations to the thermal challenges of today's technology when it comes to designing for cost.
OSI Systems Receives $11M Order for Electronic Assemblies
11/21/2024 | BUSINESS WIREOSI Systems, Inc announced that its Optoelectronics and Manufacturing division has received an order for approximately $11 million to provide critical electronic sub-assemblies for a leading-edge healthcare original equipment manufacturer (OEM), known for innovative and specialized medical solutions.
CHIPS for America Announces Up to $300M in Funding to Boost U.S. Semiconductor Packaging
11/21/2024 | U.S. Chamber of CommerceThe Biden-Harris Administration announced that the U.S. Department of Commerce (DOC) is entering negotiations to invest up to $300 million in advanced packaging research projects in Georgia, California, and Arizona to accelerate the development of cutting-edge technologies essential to the semiconductor industry.
NTT, Olympus Joint Demonstration Shows IOWN APN's Low-latency Capability
11/21/2024 | JCN NewswireNTT Corporation and Olympus Corporation announced that, following the start of their joint experiment in March of the world’s first cloud endoscope system which processes endoscopic videos on the cloud, they jointly established a cloud endoscopy system utilizing the IOWN APN technology.
Hon Hai Joins OpenUSD Alliance to Promote Standardized and Open Source Universal Scenario Description (USD) Technology
11/21/2024 | Hon Hai Technology GroupHon Hai Technology Group , the world’s largest technology manufacturing and service provider, announced that it has joined the Alliance for OpenUSD (AOUSD ) to support the construction of a 3D ecosystem and promote Cooperation among various industries around the world promotes the standardization of Universal Scene Description (USD ).