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From the drilled hole to registration across multiple sequential lamination cycles, to the quality of your copper plating, via reliability in an HDI world is becoming an ever-greater challenge. This month we look at “The Hole Truth,” from creating the “perfect” via to how you can assure via quality and reliability, the first time, every time.
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The June 2023 Issue of PCB007 Magazine Is Now Available
June 15, 2023 | I-Connect007 Editorial TeamEstimated reading time: Less than a minute

You must have an effective hiring strategy if you want to attract—and retain—skilled workers. Does your company have such a strategy? If not, we have the information you need to get your hiring plans up and running.
In this issue of PCB007 Magazine we explain how to plant the seeds to grow your workforce. Our expert contributors discuss current trends in hiring, including what the next generation wants in a career. We also cover a variety of ways to ensure that you are hiring the best person for the job, as well as how to “sell” your company to recruits.
Subscribe here for delivery in your e-mailbox.
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It’s Only Common Sense: Selling to Today's Generation of Buyers
06/30/2025 | Dan Beaulieu -- Column: It's Only Common SenseMillennials and Gen Z hold significant purchasing power and influence in industries worldwide. Selling to them requires adapting to their unique preferences, behaviors, and values, and exploring their buying habits, embracing their emphasis on social values, and mastering digital communication. Unlike previous generations, they prioritize experiences, sustainability, and value.
Airbus-built MetOp-SG Weather and Climate Satellite Shipped to Kourou
06/06/2025 | AirbusReady for launch - the first of the Airbus-built MetOp-SG weather and climate monitoring satellites left Toulouse cleanrooms a few days ago and is now en-route for Kourou, French Guiana onboard the “Canopée” transport ship.
Strategic Materials Conference 2025 Spotlights Materials Innovation to Advance Semiconductor Manufacturing
06/02/2025 | SEMIWith materials innovation at the core of next-generation semiconductor technologies, the Strategic Materials Conference (SMC) 2025 brings together top executives and technology leaders from the semiconductor manufacturing industry for exclusive insights into the latest trends and advancements.
TI Teams with NVIDIA to Bring Efficient Power Distribution to AI Infrastructure
05/26/2025 | Texas InstrumentsTexas Instruments technologies will help enable NVIDIA's future 800V high-voltage DC power-distribution systems for next-generation AI data centers.
2025 COMPUTEX Compal Unveils 'The Race is On' Strategy During Forum Session
05/23/2025 | Compal Electronics Inc.As AI models and computing density continue to grow at an exponential rate, the data center industry is entering a new era where cooling capacity has become the next competitive threshold.