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Advanced Electronics Packaging Digest

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It’s Only Common Sense: Win the Sale Before the RFQ Arrives

10/18/2026 | Dan Beaulieu -- Column: It's Only Common Sense
There is an old belief in sales that the real competition begins when the request for quotation (RFQ) arrives. That may have been true once, but it is certainly not true today. By the time purchasing sends out an RFQ for a board or electronic assembly, many of the most important decisions about design, materials, production, delivery, and suppliers have already been made. At that point, the salesperson is simply pricing someone else’s solution.

Omega EMS Expands Advanced Inspection Capabilities with New 3D AOI and X-Ray Systems

10/16/2026 | Omega EMS
Investment delivers inline 3D optical inspection across all San Jose SMT production lines and doubles 3D X-ray inspection capacity.

Green Circuits Joins PCBAA to Support U.S. Electronics Manufacturing

10/16/2026 | Green Circuits
Green Circuits, an electronics manufacturing services (EMS) provider serving OEMs across aerospace and defense, medical, industrial, semiconductor and AI hardware markets, has joined the Printed Circuit Board Association of America (PCBAA), strengthening its commitment to supporting a resilient U.S. electronics manufacturing ecosystem and domestic supply chain.

Nordson Test & Inspection Wins 2026 Mexico Technology Award

10/14/2026 | Nordson Test & Inspection
Nordson Test & Inspection, a global leader in inspection, metrology, and testing solutions, announced that its Nordson Sight™ Software Process Control Platform received a 2026 Mexico Technology Award in the Software Process Control category.

U.S AEP Success Rides on Navigating Three Key Market Trends

10/16/2026 | Nolan Johnson, I-Connect007
The U.S. advanced semiconductor packaging strategy is beginning to take a more recognizable shape. Recent developments point to three interconnected trends: advanced packaging is moving closer to traditional electronics assembly, high-bandwidth memory (HBM) packaging is becoming part of U.S. industrial policy, and photonics is emerging as another important layer of heterogeneous integration. These trends could strengthen the U.S. position in the global advanced packaging economy. They also illustrate that much of the underlying supply chain remains incomplete.
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