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Advanced Electronics Packaging Digest

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The Test Connection Inc. to Showcase Electronic Test Solutions at SMTA Guadalajara 2026

09/08/2026 | The Test Connection Inc.
TTCI will exhibit as part of the USM Reps booth 910, connecting with electronics manufacturing professionals from across Mexico and the international electronics industry.

Hanwha Aerospace Hosts U.S. Army's Senior Acquisition Leadership at Defense Production Sites

09/08/2026 | Hanwha Aerospace
The Honorable Brent G. Ingraham, Assistant Secretary of the Army for Acquisition, Logistics, and Technology (ASA(ALT)), and his delegation visited Hanwha Aerospace's defense production sites in Changwon, South Korea on August 26 to review the company's manufacturing capabilities across artillery, rocket systems, and other land defense platforms.

Everspin, Teledyne HiRel Partner to Accelerate MRAM Adoption in Aerospace and Defense

09/02/2026 | BUSINESS WIRE
Everspin Technologies, Inc., the world’s leading developer and manufacturer of MRAM solutions, and Teledyne HiRel Semiconductors, a business unit of Teledyne Technologies Incorporated and a leading supplier of high-reliability semiconductor solutions, announced a strategic partnership to accelerate adoption of Everspin’s MRAM in aerospace, defense and other demanding systems.

Murata Invests ¥6.2 Billion in New EMI Filter Production Facility in Thailand

09/01/2026 | Murata
Murata Electronics (Thailand), Ltd., a manufacturing subsidiary of Murata Manufacturing Co., Ltd., will invest approximately ¥6.2 billion to construct a new production building at its Thailand facility to meet growing demand for EMI suppression filters.

Indium to Explore the Critical Materials and Packaging Process Connection at CPRIM 2026

09/01/2026 | Indium Corporation
Indium Corporation® Senior Area Technical Manager Luis Pan will discuss how precisely matching materials and assembly processes can positively impact yield and reliability at the Conference on Advanced Packaging Reliability Technology and Interconnect Materials (CPRIM) 2026, September 4, in Guangzhou, China.
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