Share on:

Share on LinkedIn Share on X Share on Facebook Share with email

Testimonial

"Our marketing partnership with I-Connect007 is already delivering. Just a day after our press release went live, we received a direct inquiry about our updated products!"

Rachael Temple - Alltemated

Suggested Items

A Mic, a Tiny Cam, and the Show Floor: The Story Behind 'Take the Mic!'

04/23/2026 | I-Connect007 Editorial Team
I-Connect007’s Take the Mic! program at APEX EXPO 2026 in Anaheim is proving to be a must-watch feature for this year’s event coverage, as we invited company representatives to participate in a sponsored conversation about their businesses and products in a whole new way: in front of a camera at their booths. While our managing editors and guest editors were conducting slightly longer Real Time With… APEX EXPO interviews in our booth, three staff members and guests acted as roaming reporters, conducting short, prearranged interviews with several companies exhibiting on the show floor.

PHOTO GALLERY: A Walk on the Lighter Side

04/23/2026 | I-Connect007
APEX EXPO isn’t all business! To wrap up our last photo gallery, we’re sharing some of our favorites from the show—a walk on the lighter side. We’re highlighting those in-between moments: quick selfies, familiar faces reconnecting, robot dogs, booth-side laughs, and the kind of candid snapshots you only get when people are genuinely enjoying themselves. At the end of the day, it’s not just about what we do, it’s about the people we do it with.

Koh Young Highlighting its Smart AI Solutions at the SMTA Monterrey Expo and Tech Forum

04/15/2026 | Koh Young
Koh Young, the industry leader in True 3D measurement-based inspection solutions, will exhibit at the upcoming SMTA Monterrey Expo & Tech Forum on Thursday, April 23, 2026, at Cintermex, located at Av. Fundidora 501, Colonia Obrera, Monterrey, Nuevo León, Mexico.

Meet Emerging Engineer Logan Bistodeau, IBM

04/09/2026 | Michelle Te, I-Connect007
When he was growing up, Logan Bistodeau was always interested in how heavy machinery worked, so it was natural that he earned a mechanical engineering degree at Iowa State University. He originally grew up near the Twin Cities in Minnesota, now works for IBM, and is in his first year of the Emerging Engineer Program through the Global Electronics Association. I got to know Logan a little better at APEX EXPO 2026.

Target Condition: An Exploration of Flooding PCB Layers

04/02/2026 | Kelly Dack -- Column: Target Condition
The concept of flooding PCB layers with copper has been around for so long, you’d think we’d have it mastered. We haven’t. (Oh, and by “we,” I mean design engineers and the software tools we depend on.) Years ago, PCB artwork was created by hand using light tables, with tape applied to Mylar. Signals were slow, traces were relatively wide, and high-current paths were simply “beefed up” with wider copper. Signal integrity wasn’t yet a driving concern. Today, solid return paths are fundamental to robust design. We understand the importance of continuous reference planes for signal integrity and EMI control.
Copyright © I-Connect007 | IPC Publishing Group Inc. All rights reserved. Log in