Dan's Biz Bookshelf: 'Move Your Bus'
Driving Innovation: Direct Imaging vs. Conventional Exposure
It’s Only Common Sense: Selling to Today's Generation of Buyers
Flexible Circuits Acquires Third CBT/MLI DI System from Technica USA
June 27, 2023 | Technica USAEstimated reading time: 1 minute
Technica USA reported that Flexible Circuits purchased their third CBT/MLI direct imaging (DI) system for their plant expansion.
Frank Medina, President of Technica USA, said, “FCI has been a long-time customer of Technica through their purchases of the CBT/MLI DI technology. We are very pleased that the management team at FCI has continued to demonstrate their loyalty in the partnership we forged many years ago with the purchase of their third DI machine. We value their business and are very pleased to have witnessed their growth throughout our partnership.”
Dave M. Stollsteimer, President of Flexible Circuits Inc., added, “We at FCI are very excited about the purchase of our third CBT / MLI direct imager. The new TiTAN Series of direct imagers will enable FCI to continually align with our core customer’s technology roadmap of driving to finer lines and spacing (sub 2 mil). Besides the quality and efficiency in process, the CBT machines also offer the low cost of ownership of an LED platform versus laser based. This will allow Flexible Circuits, Inc. to continue to service our valued customers with cost effective solutions over the long term.”
Stollsteimer continued, “Technica continues to offer us their high level of service ensuring that the equipment is never down and always working optimally. Flexible Circuits, Inc. is very proud of the long-term partnership we have with Technica and look forward to continuing the relationship far into the future.”
Medina concluded, “CBT strives to move their direct imaging technology forward on a continuous basis. The new TiTAN Series range of machines provides the market with the fastest solder mask and dry film print capability and print resolution capability down to 10 microns.”
Share on:
Suggested Items
Driving Innovation: Direct Imaging vs. Conventional Exposure
07/01/2025 | Simon Khesin -- Column: Driving InnovationMy first camera used Kodak film. I even experimented with developing photos in the bathroom, though I usually dropped the film off at a Kodak center and received the prints two weeks later, only to discover that some images were out of focus or poorly framed. Today, every smartphone contains a high-quality camera capable of producing stunning images instantly.
Hands-On Demos Now Available for Apollo Seiko’s EF and AF Selective Soldering Lines
06/30/2025 | Apollo SeikoApollo Seiko, a leading innovator in soldering technology, is excited to spotlight its expanded lineup of EF and AF Series Selective Soldering Systems, now available for live demonstrations in its newly dedicated demo room.
Indium Corporation Expert to Present on Automotive and Industrial Solder Bonding Solutions at Global Electronics Association Workshop
06/26/2025 | IndiumIndium Corporation Principal Engineer, Advanced Materials, Andy Mackie, Ph.D., MSc, will deliver a technical presentation on innovative solder bonding solutions for automotive and industrial applications at the Global Electronics A
Fresh PCB Concepts: Assembly Challenges with Micro Components and Standard Solder Mask Practices
06/26/2025 | Team NCAB -- Column: Fresh PCB ConceptsMicro components have redefined what is possible in PCB design. With package sizes like 01005 and 0201 becoming more common in high-density layouts, designers are now expected to pack more performance into smaller spaces than ever before. While these advancements support miniaturization and functionality, they introduce new assembly challenges, particularly with traditional solder mask and legend application processes.
Knocking Down the Bone Pile: Tin Whisker Mitigation in Aerospace Applications, Part 3
06/25/2025 | Nash Bell -- Column: Knocking Down the Bone PileTin whiskers are slender, hair-like metallic growths that can develop on the surface of tin-plated electronic components. Typically measuring a few micrometers in diameter and growing several millimeters in length, they form through an electrochemical process influenced by environmental factors such as temperature variations, mechanical or compressive stress, and the aging of solder alloys.