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Conecsus Metals Mexico to Exhibit Waste Recycling Solutions at SMTA Querétaro Expo and Tech Forum
June 26, 2023 | Conecsus Metals MéxicoEstimated reading time: Less than a minute
Conecsus Metals México, an innovative environmental technology and recycling company, will exhibit at the SMTA Expo and Tech Forum in Queretaro, Mexico on July 13. The company recently exhibited at the SMTA Expo & Tech Forum in Aguascalientes, México, where Conecsus representatives Yessica Romero, Regional Sales Manager, and Carolina Renteria, Customer Services Manager, met with Conecsus customers, where they illustrated how the company processes wastes containing primarily Tin, Tin-Zinc, Lead, and Silver, and converts them into usable metal products, paying its customers back for their metals waste.
Conecsus is an ISO 14001 EMS certified recycling company and a refiner of SMT solder/solder paste wastes and residues.
The July 13, 2023 event, beginning at 8:00 a.m., will be held at the EXPO HALL Hotel Misión Juriquilla, Blvd. Villas del Mesón 56, Col. Juriquilla Querétaro, Querétaro 76230, Mexico.
With solder waste reprocessing facilities located in Terrell, TX, USA, Conecsus LLC is a sophisticated ‘green’ recycler and refiner of SMT solder/solder paste wastes and residues, as well as complex by-products that can be recovered from industries in North America and worldwide.
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BTU International Earns 2025 Step-by-Step Excellence Award for Its Aqua Scrub™ Flux Management System
10/29/2025 | BTU International, Inc.BTU International, Inc., a leading supplier of advanced thermal processing equipment for the electronics manufacturing market, has been recognized with a 2025 Step-by-Step Excellence Award (SbSEA) for its Aqua Scrub™ Flux Management Technology, featured on the company’s Pyramax™ and Aurora™ reflow ovens.
On the Line With… Ultra HDI Podcast—Episode 7: “Solder Mask: Beyond the Traces,” Now Available
10/31/2025 | I-Connect007I-Connect007 is excited to announce the release of the seventh episode of its 12-part podcast series, On the Line With… American Standard Circuits: Ultra HDI. In this episode, “Solder Mask: Beyond the Traces,” host Nolan Johnson sits down with John Johnson, Director of Quality and Advanced Technology at American Standard Circuits, to explore the essential role that solder mask plays in the Ultra HDI (UHDI) manufacturing process.
Rehm Wins Mexico Technology Award for CondensoXLine with Formic Acid
10/17/2025 | Rehm Thermal SystemsModern electronics manufacturing requires technologies with high reliability. By using formic acid in convection, condensation, and contact soldering, Rehm Thermal Systems’ equipment ensures reliable, void-free solder joints — even when using flux-free solder pastes.
Indium Experts to Deliver Technical Presentations at SMTA International
10/14/2025 | Indium CorporationAs one of the leading materials providers to the power electronics assembly industry, Indium Corporation experts will share their technical insight on a wide range of innovative solder solutions at SMTA International (SMTAI), to be held October 19-23 in Rosemont, Illinois.
Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
10/14/2025 | Nash Bell -- Column: Knocking Down the Bone PileBall grid array (BGA) components evolved from pin grid array (PGA) devices, carrying over many of the same electrical benefits while introducing a more compact and efficient interconnect format. Instead of discrete leads, BGAs rely on solder balls on the underside of the package to connect to the PCB. In some advanced designs, solder balls are on both the PCB and the BGA package. In stacked configurations, such as package-on-package (PoP), these solder balls also interconnect multiple packages, enabling higher functionality in a smaller footprint.