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The real cost to manufacture a PCB encompasses everything that goes into making the product: the materials and other value-added supplies, machine and personnel costs, and most importantly, your quality. A hard look at real costs seems wholly appropriate.
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Traditional electroless copper and electroless copper immersion gold have been primary PCB plating methods for decades. But alternative plating metals and processes have been introduced over the past few years as miniaturization and advanced packaging continue to develop.
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Nordson Electronics Solutions to Exhibit at SEMICON China 2023
June 28, 2023 | Nordson Electronics SolutionsEstimated reading time: Less than a minute
Nordson Electronics Solutions, a global leader in electronics manufacturing technologies, will demonstrate their latest solutions for semiconductor packaging and electronics manufacturing, with partner AMT at the SEMICON China tradeshow, booth E4617. At the booth, you will see these systems:
- The popular ASYMTEK Vantage® fluid dispensing system, Nordson’s most advanced dispensing platform, is designed for high-end semiconductor packaging and assembly. Fast and accurate, the Vantage, when configured with dual IntelliJet valves, can jet into gaps less than 200 um, and up to 90,000 dots per hour.
- The newest ASYMTEK Forte® fluid dispensing system offers exceptional dispensing productivity and accuracy for high-volume consumer electronics, flexible circuit, MEMs, and electromechanical assembly applications. Forte offers real-time skew correction (patented) for better wet dispense accuracy and yield, as well as fast, repeatable setup with automated calibration.
- Both systems offer fine-line dispensing capabilities to meet requirements for underfill, gap fill, sealing lines for fan-out/fan-in, strips, and module assembly.
Experts will be ready to discuss how Nordson can support your operations for reliable electronic products. SEMICON China will be held at the New International Expo Centre, Shanghai, China, June 29 – July 1, 2023.
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