-
- News
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current IssueAdvancing the Advanced Materials Discussion
Moore’s Law is no more, and the advanced material solutions to grapple with this reality are surprising, stunning, and perhaps a bit daunting. Buckle up for a dive into advanced materials and a glimpse into the next chapters of electronics manufacturing.
Inventing the Future With SEL
Two years after launching its state-of-the-art PCB facility, SEL shares lessons in vision, execution, and innovation, plus insights from industry icons and technology leaders shaping the future of PCB fabrication.
Sales: From Pitch to PO
From the first cold call to finally receiving that first purchase order, the July PCB007 Magazine breaks down some critical parts of the sales stack. To up your sales game, read on!
- Articles
- Columns
- Links
- Media kit
||| MENU - pcb007 Magazine
Nordson Electronics Solutions to Exhibit at SEMICON China 2023
June 28, 2023 | Nordson Electronics SolutionsEstimated reading time: Less than a minute

Nordson Electronics Solutions, a global leader in electronics manufacturing technologies, will demonstrate their latest solutions for semiconductor packaging and electronics manufacturing, with partner AMT at the SEMICON China tradeshow, booth E4617. At the booth, you will see these systems:
- The popular ASYMTEK Vantage® fluid dispensing system, Nordson’s most advanced dispensing platform, is designed for high-end semiconductor packaging and assembly. Fast and accurate, the Vantage, when configured with dual IntelliJet valves, can jet into gaps less than 200 um, and up to 90,000 dots per hour.
- The newest ASYMTEK Forte® fluid dispensing system offers exceptional dispensing productivity and accuracy for high-volume consumer electronics, flexible circuit, MEMs, and electromechanical assembly applications. Forte offers real-time skew correction (patented) for better wet dispense accuracy and yield, as well as fast, repeatable setup with automated calibration.
- Both systems offer fine-line dispensing capabilities to meet requirements for underfill, gap fill, sealing lines for fan-out/fan-in, strips, and module assembly.
Experts will be ready to discuss how Nordson can support your operations for reliable electronic products. SEMICON China will be held at the New International Expo Centre, Shanghai, China, June 29 – July 1, 2023.
Testimonial
"In a year when every marketing dollar mattered, I chose to keep I-Connect007 in our 2025 plan. Their commitment to high-quality, insightful content aligns with Koh Young’s values and helps readers navigate a changing industry. "
Brent Fischthal - Koh YoungSuggested Items
A.R.T. Invests in Latest Equipment to Further Enhance Electronics Training Facilities
09/17/2025 | A.R.T. Ltd.Advanced Rework Technology Ltd. (A.R.T.), a leading independent IPC-accredited training provider, has announced a series of new equipment investments at its state-of-the-art training centre.
Richardson Electronics Appoints Daniel Albers to Drive Made-in-USA Contract Manufacturing Expansion
09/17/2025 | Globe NewswireRichardson Electronics, Ltd., a global provider of engineered solutions for the green energy, power management, and custom display markets, announced the appointment of Daniel Albers to spearhead business development for its expanded, Made-in-USA contract manufacturing efforts.
STMicroelectronics to Advance Next-generation Chip Manufacturing Technology with New PLP Pilot Line in Tours, France
09/17/2025 | STMicroelectronicsSTMicroelectronics, a global semiconductor leader serving customers across the spectrum of electronics applications, today announced new details regarding the development of the next generations of Panel-Level Packaging (PLP) technology through a pilot line in its Tours site, France, which is expected to be operational in Q3 2026.
Indium President and CEO to Deliver ELCINA CEO Forum Keynote at Productronica India
09/17/2025 | Indium CorporationIndium Corporation President and CEO Ross Berntson will deliver the Electronic Industries Association of India (ELCINA) CEO Forum keynote at Productronica India, to be held September 17-19 in Bengaluru, India.
TTCI and The Training Connection Strengthen Electronics Manufacturing with Test Services and Training at PCB West 2025
09/16/2025 | The Test Connection Inc.The Test Connection Inc. (TTCI), a trusted provider of electronic test and manufacturing solutions, and The Training Connection LLC (TTC-LLC) will exhibit at PCB West 2025, taking place Wednesday, October 1, 2025, at the Santa Clara Convention Center in California. Visitors are invited to Booth 113 to explore the companies’ complementary expertise in test engineering services and workforce development for the electronics industry.