Dan's Biz Bookshelf: 'Revenge of the Tipping Point'
Marcy's Musings: Engineering Economics
Punching Out: Should You Sell Your Company to a Private Equity Firm?
Summit Interconnect Welcomes Brian Kamradt as New Chief Financial Officer
June 28, 2023 | Summit Interconnect, Inc.Estimated reading time: 1 minute
Summit Interconnect today announced the appointment of Brian Kamradt as chief financial officer. Kamradt brings over 20 years of finance, accounting, merger and acquisition, and IT experience to Summit’s leadership team. He will succeed Tom Caldwell, Summit’s initial CFO, who will be retiring after leading the company’s expansion for the past four years.
“Tom played a critical role in Summit’s development, and I wish to sincerely thank him for the significant contributions he’s made to our company,” said Shane Whiteside, CEO of Summit Interconnect. “He is a highly valued and respected colleague.”
Kamradt is a solutions-focused finance leader with proven success in leveraging technology to create scalable service operations. Most recently, as CFO and Head of IT at Jonathan Engineered Solutions, he was directly involved in multiple strategic acquisitions and expanding the use of technology in decision-making. Kamradt also gained significant manufacturing and international finance experience while serving as CFO for Nortek Security, VP of Finance at Curtiss-Wright Corporation, and VP of Finance for Meggitt/Parker.
“Brian clearly has extensive experience managing global financial operations,” said Whiteside. “He also has a track record of implementing transformative business processes that will help accelerate our business initiatives and advance Summit’s industry leadership position. We are pleased to have him on our team.”
Kamradt joins Summit Interconnect at a pivotal time in the printed circuit board (PCB) industry’s evolution. Challenges to supply chains, a tight labor market, and a renewed focus on regional manufacturing has prompted the introduction of government legislation aimed at increasing the production of PCBs in North America.
“I am honored to be joining Summit and am inspired by the company’s vision and purpose,” said Brian Kamradt, CFO at Summit. “Summit’s powerful combination of people, products, and technology is unmatched in the industry. I look forward to working with all the teams to further accelerate growth and create even greater value for our customers and stakeholders.”
Kamradt holds a Master’s in Business Administration from ESADE in Barcelona, Spain, and a Bachelor of Arts in Economics and International Management from Hamline University, St. Paul, Minnesota. He is fluent in English, Spanish, and Catalan.
Share on:
Suggested Items
NTT, Olympus Joint Demonstration Shows IOWN APN's Low-latency Capability
11/21/2024 | JCN NewswireNTT Corporation and Olympus Corporation announced that, following the start of their joint experiment in March of the world’s first cloud endoscope system which processes endoscopic videos on the cloud, they jointly established a cloud endoscopy system utilizing the IOWN APN technology.
Hon Hai Joins OpenUSD Alliance to Promote Standardized and Open Source Universal Scenario Description (USD) Technology
11/21/2024 | Hon Hai Technology GroupHon Hai Technology Group , the world’s largest technology manufacturing and service provider, announced that it has joined the Alliance for OpenUSD (AOUSD ) to support the construction of a 3D ecosystem and promote Cooperation among various industries around the world promotes the standardization of Universal Scene Description (USD ).
PI's New Expansion for Higher Electronics Manufacturing Capacities and Shorter Lead Times
11/20/2024 | PRNewswirePI, the market and technology leader for high-precision motion control, positioning technology, and piezo applications, has completed the construction of additional electronics production space at its Rosenheim, Germany site.
Advanced Packaging: Preparation is Now
11/20/2024 | Nolan Johnson, SMT007 MagazineA new IPC white paper, “Advanced Packaging to Board Level Integration—Needs and Challenges,” authored by Devan Iyer, chief strategist of advanced packaging, and Matt Kelly, chief technology officer, shares expertise on and advocacy for advanced packaging. In this conversation, they share details from the paper about the complexities of advanced packaging technology and provide additional insight into how next-generation packaging will change how printed circuit boards will be designed, fabricated, and assembled, including final system assembly implications.
Cadence Unveils Arm-Based System Chiplet
11/20/2024 | Cadence Design SystemsCadence has announced a groundbreaking achievement with the development and successful tapeout of its first Arm-based system chiplet. This innovation marks a pivotal advancement in chiplet technology, showcasing Cadence's commitment to driving industry-leading solutions through its chiplet architecture and framework.