I-Connect007 Editor’s Choice: Five Must-Reads for the Week
June 30, 2023 | Nolan Johnson, I-Connect007Estimated reading time: 2 minutes

It’s a heady time here in the U.S. between the summer holidays of Memorial Day (last Monday in May) and Independence Day (July 4). This four-week period straddles the Northern solstice, boasts the longest days of the year in the Northern Hemisphere. This is the high season for outside activities, which may be pulling you away from the office. Am I right? Never fear, I-Connect007 is here to deliver the “must know” news stories.
I’m bending the rules (again) this week by adding some additional links to some of the news items, so as to provide a more comprehensive picture of the story. So, what do we have? A conversation with Omron, news from Isola and Insulectro, Pete Starkey’s EIPC Summer Conference coverage (keynote, Day 1 and Day 2 summaries), and IPC monthly sales reports for EMS and PCB fab.
If you’re in the U.S., have a wildly independent holiday weekend; for our global readers, we’ll still be here, watching the news for you. Stay tuned.
Omron Discusses SPI, AI and More
Published June 26
At the recent SMTA Oregon Tech Forum and Expo, Tim Anderson, a senior account manager at Omron, presented his insights on SPI, the latest trends in the industry, and some solutions to consider. Afterward, Barry Matties caught up with Anderson for a follow up discussion. As Anderson points out, the SPI, AOI, and AXI systems of today do far more than simply catch defects. This is a short and informative read for anyone following these machinery applications.
Isola Changing With the Times
Published June 29
Changing market conditions require changes in approach. I-Connect007’s Barry Matties and Nolan Johnson spoke with Isola’s Travis Kelly, Sean Mirshafiei, and Kirk Thompson about Isola’s recent responses to market conditions. In this interview, Kelly, Mirshafiei, and Thompson outline recent changes to Isola senior leadership, optimizing manufacturing to meet the needs of the global market, and the strategic importance of advanced packaging to the global economy, and to the U.S., in particular.
EIPC Summer Conference 2023: The Keynote Session
Published June 26
The EIPC technical sessions–whether the monthly snapshot sessions, or the semi-annual conferences– are eternally full of high-value technical updates. This year’s summer session follows that same tradition. Of course, Pete Starkey’s detailed narratives always bring an extra bit of humanity to the sessions. We’re leading with Mr. Starkey’s coverage of the keynote, but I’ve added links to the summaries for Day 1 and Day 2 here, as well.
Insulectro Announces New Partnership With Laminate Suppliers Arlon Electronics Materials and EMC
Published June 27
Insulectro announces its new status as exclusive distributor for North America of Arlon copper clad laminates beginning Sept. 4, 2023. In addition, Arlon is the master distributor for Elite Materials Company (EMC), based in Taiwan. This brings both product lines to the Insulectro line card. Read here to get the details.
North American EMS Industry Up 7.1% in May
Published June 22
Read the whole post here, but just to tease the content, “EMS bookings in May increased 0.8 percent year-over-year and increased 4.4 percent from the previous month.” Also linked to the EMS report is the PCB fabrication report: North American PCB Industry Sales Up 6.7% in May
Suggested Items
Elephantech: For a Greener Tomorrow
04/16/2025 | Marcy LaRont, PCB007 MagazineNobuhiko Okamoto is the global sales and marketing manager for Elephantech Inc., a Japanese startup with a vision to make electronics more sustainable. The company is developing a metal inkjet technology that can print directly on the substrate and then give it a copper thickness by plating. In this interview, he discusses this novel technology's environmental advantages, as well as its potential benefits for the PCB manufacturing and semiconductor packaging segments.
Trouble in Your Tank: Organic Addition Agents in Electrolytic Copper Plating
04/15/2025 | Michael Carano -- Column: Trouble in Your TankThere are numerous factors at play in the science of electroplating or, as most often called, electrolytic plating. One critical element is the use of organic addition agents and their role in copper plating. The function and use of these chemical compounds will be explored in more detail.
IDTechEx Highlights Recyclable Materials for PCBs
04/10/2025 | IDTechExConventional printed circuit board (PCB) manufacturing is wasteful, harmful to the environment and energy intensive. This can be mitigated by the implementation of new recyclable materials and technologies, which have the potential to revolutionize electronics manufacturing.
Connect the Dots: Stop Killing Your Yield—The Hidden Cost of Design Oversights
04/03/2025 | Matt Stevenson -- Column: Connect the DotsI’ve been in this industry long enough to recognize red flags in PCB designs. When designers send over PCBs that look great on the computer screen but have hidden flaws, it can lead to manufacturing problems. I have seen this happen too often: manufacturing delays, yield losses, and designers asking, “Why didn’t anyone tell me sooner?” Here’s the thing: Minor design improvements can greatly impact manufacturing yield, and design oversights can lead to expensive bottlenecks. Here’s how to find the hidden flaws in a design and avoid disaster.
Real Time with... IPC APEX EXPO 2025: Tariffs and Supply Chains in U.S. Electronics Manufacturing
04/01/2025 | Real Time with...IPC APEX EXPOChris Mitchell, VP of Global Government Relations for IPC, discusses IPC's concerns about tariffs on copper and their impact on U.S. electronics manufacturing. He emphasizes the complexity of supply chains and the need for policymakers to understand their effects.