I-Connect007 Editor’s Choice: Five Must-Reads for the Week
June 30, 2023 | Nolan Johnson, I-Connect007Estimated reading time: 2 minutes

It’s a heady time here in the U.S. between the summer holidays of Memorial Day (last Monday in May) and Independence Day (July 4). This four-week period straddles the Northern solstice, boasts the longest days of the year in the Northern Hemisphere. This is the high season for outside activities, which may be pulling you away from the office. Am I right? Never fear, I-Connect007 is here to deliver the “must know” news stories.
I’m bending the rules (again) this week by adding some additional links to some of the news items, so as to provide a more comprehensive picture of the story. So, what do we have? A conversation with Omron, news from Isola and Insulectro, Pete Starkey’s EIPC Summer Conference coverage (keynote, Day 1 and Day 2 summaries), and IPC monthly sales reports for EMS and PCB fab.
If you’re in the U.S., have a wildly independent holiday weekend; for our global readers, we’ll still be here, watching the news for you. Stay tuned.
Omron Discusses SPI, AI and More
Published June 26
At the recent SMTA Oregon Tech Forum and Expo, Tim Anderson, a senior account manager at Omron, presented his insights on SPI, the latest trends in the industry, and some solutions to consider. Afterward, Barry Matties caught up with Anderson for a follow up discussion. As Anderson points out, the SPI, AOI, and AXI systems of today do far more than simply catch defects. This is a short and informative read for anyone following these machinery applications.
Isola Changing With the Times
Published June 29
Changing market conditions require changes in approach. I-Connect007’s Barry Matties and Nolan Johnson spoke with Isola’s Travis Kelly, Sean Mirshafiei, and Kirk Thompson about Isola’s recent responses to market conditions. In this interview, Kelly, Mirshafiei, and Thompson outline recent changes to Isola senior leadership, optimizing manufacturing to meet the needs of the global market, and the strategic importance of advanced packaging to the global economy, and to the U.S., in particular.
EIPC Summer Conference 2023: The Keynote Session
Published June 26
The EIPC technical sessions–whether the monthly snapshot sessions, or the semi-annual conferences– are eternally full of high-value technical updates. This year’s summer session follows that same tradition. Of course, Pete Starkey’s detailed narratives always bring an extra bit of humanity to the sessions. We’re leading with Mr. Starkey’s coverage of the keynote, but I’ve added links to the summaries for Day 1 and Day 2 here, as well.
Insulectro Announces New Partnership With Laminate Suppliers Arlon Electronics Materials and EMC
Published June 27
Insulectro announces its new status as exclusive distributor for North America of Arlon copper clad laminates beginning Sept. 4, 2023. In addition, Arlon is the master distributor for Elite Materials Company (EMC), based in Taiwan. This brings both product lines to the Insulectro line card. Read here to get the details.
North American EMS Industry Up 7.1% in May
Published June 22
Read the whole post here, but just to tease the content, “EMS bookings in May increased 0.8 percent year-over-year and increased 4.4 percent from the previous month.” Also linked to the EMS report is the PCB fabrication report: North American PCB Industry Sales Up 6.7% in May
Suggested Items
The Evolution of Picosecond Laser Drilling
06/19/2025 | Marcy LaRont, PCB007 MagazineIs it hard to imagine a single laser pulse reduced not only from nanoseconds to picoseconds in its pulse duration, but even to femtoseconds? Well, buckle up because it seems we are there. In this interview, Dr. Stefan Rung, technical director of laser machines at Schmoll Maschinen GmbH, traces the technology trajectory of the laser drill from the CO2 laser to cutting-edge picosecond and hybrid laser drilling systems, highlighting the benefits and limitations of each method, and demonstrating how laser innovations are shaping the future of PCB fabrication.
Day 2: More Cutting-edge Insights at the EIPC Summer Conference
06/18/2025 | Pete Starkey, I-Connect007The European Institute for the PCB Community (EIPC) summer conference took place this year in Edinburgh, Scotland, June 3-4. This is the third of three articles on the conference. The other two cover Day 1’s sessions and the opening keynote speech. Below is a recap of the second day’s sessions.
Day 1: Cutting Edge Insights at the EIPC Summer Conference
06/17/2025 | Pete Starkey, I-Connect007The European Institute for the PCB Community (EIPC) Summer Conference took place this year in Edinburgh, Scotland, June 3-4. This is the second of three articles on the conference. The other two cover the keynote speeches and Day 2 of the technical conference. Below is a recap of the first day’s sessions.
Preventing Surface Prep Defects and Ensuring Reliability
06/10/2025 | Marcy LaRont, PCB007 MagazineIn printed circuit board (PCB) fabrication, surface preparation is a critical process that ensures strong adhesion, reliable plating, and long-term product performance. Without proper surface treatment, manufacturers may encounter defects such as delamination, poor solder mask adhesion, and plating failures. This article examines key surface preparation techniques, common defects resulting from improper processes, and real-world case studies that illustrate best practices.
RF PCB Design Tips and Tricks
05/08/2025 | Cherie Litson, EPTAC MIT CID/CID+There are many great books, videos, and information online about designing PCBs for RF circuits. A few of my favorite RF sources are Hans Rosenberg, Stephen Chavez, and Rick Hartley, but there are many more. These PCB design engineers have a very good perspective on what it takes to take an RF design from schematic concept to PCB layout.