Cadence Digital, Custom/Analog Design Flows Certified for Samsung Foundry’s SF2 and SF3 Process Technologies
July 3, 2023 | Cadence Design Systems, Inc.Estimated reading time: 2 minutes

Cadence Design Systems, Inc. announced that its digital and custom/analog flows achieved certification for Samsung Foundry’s SF2 and SF3 process technologies. The two companies also worked together to create new process design kits (PDKs) that simplify mobile, automotive, AI and hyperscale IC design at these latest nodes. Joint customers are actively developing SF2- and SF3-based designs using the Cadence® flows.
Cadence Digital Tools Optimized for SF2 and SF3 Technologies
Cadence’s comprehensive Cadence RTL-to-GDS design flow that supports Samsung’s SF2 and SF3 technologies provides optimal power, performance and area (PPA). The flow includes the Genus™ Synthesis Solution, Modus DFT Software Solution, Innovus™ Implementation System, Quantus™ Extraction Solution and Quantus Field Solver, Tempus™ Timing Signoff Solution and Tempus ECO Option, Pegasus™ Verification System, Liberate™ Characterization Portfolio, Voltus™ IC Power Integrity Solution and the Cadence Cerebrus™ Intelligent Chip Explorer.
With the certified flow, customers have access to several features that ease IC design at advanced nodes, such as cell-swapping support, which helps designers align cell pins for direct connections to conserve routing resources; support for mixed-row solutions in various combinations to maximize area-based design rules; the ability to place and refine traces using mask-shifted cells and horizontal half-track shifted cells to reduce displacement; support for various rectilinear standard cells to achieve higher density; and reduced IR drop due to the insertion of enhanced, trim-aware via staples.
Cadence Custom/Analog Tools Optimized for SF2 and SF3 Technologies
Cadence custom and analog tools optimized for Samsung’s SF3 and SF2 nodes include the AI-based Virtuoso® Studio design tools—Virtuoso Schematic Editor, Virtuoso ADE Suite and Cadence Virtuoso Layout Suite—the Spectre® Simulation Platform—Spectre X Simulator, Spectre FX and Spectre RF—as well as the Voltus™-XFi Custom Power Integrity Solution.
The custom/analog design tools provide customers with several benefits, such as better corner simulation management, statistical analyses, design centering and circuit optimization; support for parallel operations on modern compute farms and private and public cloud configurations; better performance and scalability throughout the layout environment; mixed-signal OpenAccess design kits for seamless integration with the Innovus Implementation’s place-and-route engines for improved quality of results; summarized EM-IR information, which highlights violations and details on resistance value, metal layer, width, and length information; and feedback regarding circuit performance and reliability.
“Through our latest collaboration with Cadence, we’ve seen early customers improve productivity with the Cadence-certified design flows and our advanced SF2 and SF3 process technologies,” said Sangyun Kim, vice president of the Foundry Design Technology Team at Samsung Electronics. “With the new PDKs, we’re making it easier for developers of next-generation mobile, automotive, AI and hyperscale designs to adopt our technologies and deliver innovations to market faster.”
“The Cadence R&D team worked tirelessly with the Samsung Foundry team to fine-tune our digital and custom/analog flows for Samsung’s SF2 and SF3 process technologies, delivering a wide range of benefits that help customers design much more efficiently,” said Vivek Mishra, corporate vice president in the Digital & Signoff Group at Cadence. “Our digital flow provides PPA advantages, and our custom/analog flow, anchored by Virtuoso Studio, sets a new standard for custom IP creation, enabling our mutual customers to push the boundaries of innovation with Samsung’s SF2 and SF3 process technologies.”
The Cadence digital and custom/analog flows support the Cadence Intelligent System Design™ strategy, enabling system-on-chip (SoC) design excellence.
Testimonial
"In a year when every marketing dollar mattered, I chose to keep I-Connect007 in our 2025 plan. Their commitment to high-quality, insightful content aligns with Koh Young’s values and helps readers navigate a changing industry. "
Brent Fischthal - Koh YoungSuggested Items
Setting Design Constraints Effectively
07/31/2025 | Stephen V. Chavez, Siemens EDAPCB design requires controlling energy within the medium of a PCB. The manner in which we control the chaos of energy is by implementing and utilizing physical and electrical rules, known as constraints, along with a specific structure and material(s) that make up what is known as the foundation of the design. These rules govern everything within the PCB structure and generally fall into two camps: performance and manufacturability. Setting this foundation correctly is extremely important and the key to success.
MacDermid Alpha Electronics Solutions Unveils Unified Global Website to Deepen Customer, Talent, and Stakeholder Engagement
07/31/2025 | MacDermid Alpha Electronics SolutionsMacDermid Alpha Electronics Solutions, the electronics business of Elements Solutions Inc, today launched macdermidalpha.com - a unified global website built to deepen digital engagement. The launch marks a significant milestone in the business’ ongoing commitment to delivering more meaningful, interactive, and impactful experiences for its customers, talent, and stakeholders worldwide.
Ansys 2025 R2 Enables Next-Level Productivity by Leveraging AI, Smart Automation, and Broader On-Demand Capabilities
07/30/2025 | PRNewswireAnsys, now part of Synopsys, announced 2025 R2, featuring new AI-powered capabilities across the portfolio that accelerate simulation and expand accessibility.
Connect the Dots: Sequential Lamination in HDI PCB Manufacturing
07/31/2025 | Matt Stevenson -- Column: Connect the DotsAs HDI technology becomes mainstream in high-speed and miniaturized electronics, understanding the PCB manufacturing process can help PCB design engineers create successful, cost-effective designs using advanced technologies. Designs that incorporate blind and buried vias, boards with space constraints, sensitive signal integrity requirements, or internal heat dissipation concerns are often candidates for HDI technology and usually require sequential lamination to satisfy the requirements.
Target Condition: The 5 Ws of PCB Design Constraints
07/29/2025 | Kelly Dack -- Column: Target ConditionHave you ever sat down to define PCB design constraints and found yourself staring at a settings window with more checkboxes than a tax form? You’re not alone. For many designers—especially those newer to the layout world—the task of setting up design constraints can feel like trying to write a novel in a language you just started learning.