MKS’ Atotech to Participate in Semicon West 2023

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MKS’ Atotech will participate at the upcoming SEMICON West – the show connects the extended electronics design and manufacturing supply chain and will take place from July 11 – 13, 2023 at the Moscone Center in San Francisco, USA.

This year we will join booth 565 of MKS’ Newport, Ophir, and Spectra-Physics to present the Atotech semiconductor products for next-generation advanced packaging technologies.

MKS’ Atotech provides leading ENEPIG and ENEPAG plating solutions for pad metallization for bonding, soldering applications, and RDL housing in power semiconductors, as well as electrolytic processes for pillars, micro vias, fine line RDL, and solder applications. A broad portfolio of adhesion promoters and post-treatments for lead frames completes the portfolio.

This year’s show highlights include:

Spherolyte Cu UF 3 – serves to deposit pure copper for RDL and via filling in advanced packaging applications such as in fan-out wafer level packaging (FOWLP). This process enables high reliability with higher via filling performance, stable plating uniformity, and higher copper purity compared to conventional copper processes.

Spherolyte Cu UF 5 – is designed for micro bump, standard pillars (flip chip) as well as mega pillar plating. This process satisfies the industry requirements with pure and uniform copper pillar deposits at high deposition speed. In addition, the pillar shape (flat, concave, or convex) is adjustable via additive settings. 

Spherolyte Cu DB is targeted towards next-generation Cu-to-Cu hybrid bonding applications with low annealing temperatures. Spherolyte Cu DB allows the deposition of metastable fine-grained copper leading to a grain growth across the copper interface during the bonding step.