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CIL Improves its RAPID PCB Assembly Service with a Dedicated SMT Line

06/27/2024 | CIL
In recent months much of CIL’s activities have been concentrated on its Semiconductor packaging and volume PCB assembly capability from its BP2 facility.

Telespazio Joins Viasat’s ELEVATE Program to Provide Satellite Solutions for Remote IoT Connectivity

06/27/2024 | Viasat, Inc.
Viasat, Inc. announced Telespazio, a joint venture between Leonardo (67%) and Thales (33%), has joined its ELEVATE program.

ViTrox Americas Opens New State-of-the-Art Demo Lab in Hutto, Texas

06/27/2024 | ViTrox
ViTrox Americas Inc. is proud to announce the opening of its new demo lab in Hutto, Texas. This cutting-edge facility is now ready for demonstrations and evaluations, showcasing ViTrox's latest innovations in 3D inspection technology.

Ansys Multiphysics Signoff Solutions Certified for Samsung’s 2nm Power Backside Delivery Technology

06/26/2024 | ANSYS
Ansys power integrity solutions have been certified by Samsung Foundry for use with Samsung’s new SF2Z 2nm gate-all-around manufacturing technology.

Scanfil Helps with KIS Evo Booth Visualization

06/26/2024 | Scanfil
Together with KIS (part of the ME Group), one of Scanfil’s key customers in Myslowice Poland, we wanted to bring the product to life and show how complex a photo booth can be.
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