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Siemens Launches HEEDS AI Simulation Predictor and Simcenter Reduced Order Modeling

11/29/2023 | Siemens
Siemens Digital Industries Software set the benchmark for innovation in the field of engineering simulation with the launch of two groundbreaking solutions - HEEDS™ AI Simulation Predictor software and Simcenter™ Reduced Order Modeling software.

Tim’s Takeaways: Take It From Scotty, Simple Really is Better

11/30/2023 | Tim Haag -- Column: Tim's Takeaways
I am, at heart, a die-hard “Star Trek” fan. When I was a kid, I was all about phasers, warp drive, and cool stuff like that. However, these days, I tend to put a higher value on production and storytelling. But like any fan (I’m avoiding “Trekkie” because, frankly, it’s kind of embarrassing), I have certain moments from the hundreds (if not thousands) of hours filmed for the various TV shows and movies that are among my favorites. One of those moments is in “Star Trek III, The Search for Spock,” when our heroes steal the Starship Enterprise from space dock.

Standard of Excellence: The Perfect PCB Fab—A Vision for Five Years Ahead

11/29/2023 | Anaya Vardya -- Column: Standard of Excellence
To sustain a standard of excellence, it’s equally important to look at both what we’re doing today as well as what we’ll do in the future. In other words, plan ahead. In that spirit, I thought it would be prudent to peek into the future and talk about what a printed circuit board fabrication facility with a “standard of excellence” will look like five years from now.

iNEMI Packaging Tech Topic Series Webinar: LSI/PKG/PCB Co-Design

11/21/2023 | iNEMI
iNEMI Packaging Tech Topic Series Webinar, LSI/PKG/PCB Co-Design to Support 3D-IC/Chiplet Design will be held on November 28, 2023, by guest speaker Kazunari Koga, Zuken Inc.

Keysight EDA Strengthens Design and Simulation Support for Tower Semiconductor RF Process Technologies

11/16/2023 | Keysight Technologies, Inc.
Keysight Technologies, Inc. expanded the simulation capabilities in its Electronic Design Automation (EDA) software suite to include electro-thermal simulation for the Tower Semiconductor SiGe Power Amplifier (PA) process.
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