MacDermid Alpha Electronics Solutions to Showcase Board Level Reliability Solutions at FIEE Brazil 2023
July 11, 2023 | MacDermid Alpha Electronics SolutionsEstimated reading time: 1 minute
MacDermid Alpha Electronics Solutions, a leader in integrated materials and technologies for the electronics industry, will showcase its integrated solutions of high-reliability solder pastes, alloys, reinforcement, and protective polymers engineered to deliver best-in-class board level reliability. The FIEE Brazil Electronics Tradeshow is taking place July 18-21, 2023, in São Paulo, Brazil. The MacDermid Alpha team looks forward to meeting show visitors at booth L81.
Ensuring board level reliability is critical, as the demands for performance and longevity increase, especially for harsh end-use environments, such as automotive and telecommunications infrastructure. MacDermid Alpha will feature their portfolio of integrated solutions including the high-reliability Innolot™ alloy, innovative ALPHA® CVP-390V and OM-565 solder pastes, ALPHA® HiTech, and Electrolube reinforcement and protective polymers. When used in an optimum combination, they provide exponentially improved device performance and reliability. These material sets have been rigorously tested in combination to provide optimized solutions for customers’ reliability requirements, and to deliver the lowest total cost of ownership.
"Reliability performance is a constant concern for our customers," said Eduardo Carqueijo, MacDermid Alpha’s South America Marketing and Sales Manager. "With the integrated solutions material set combinations, we provide customers and their supply chains, with the reassurance that these material pairings will produce the greatest reliability that they require."
MacDermid Alpha has long maintained a strong presence of sales and manufacturing expertise in Brazil, supporting customers throughout South America. In addition to offering a full suite of high-performing materials for surface mount and wave soldering applications, including solder pastes and alloys, solder preforms, underfills and edgebonds, liquid soldering flux, cored wire, and surface mount adhesives, they also offer electronics assemblers safe and efficient solder recycling services to support their efforts to meet expanding environmental and sustainability goals.
Established brands aligned under MacDermid Alpha Electronics Solutions include Alpha®, Compugraphics, Electrolube®, Kester®, and MacDermid Enthone®, bringing manufacturers a fully integrated ‘start-to-finish’ roadmap featuring some of the most advanced technologies on the market.
Suggested Items
Connect the Dots: Designing for Reality—The Pre-Manufacturing Process
05/08/2024 | Matt Stevenson -- Column: Connect the DotsI have been working with Nolan Johnson on a podcast series about designing PCBs for the reality of manufacturing. By sharing lessons learned over a long career in the PCB industry, we hope to shorten learning curves and help designers produce better boards with less hassle and rework. Episode 2 deals with the electronic pre-manufacturing process. Moving from CAD (computer-aided design) to CAM (computer-aided manufacturing) is a key step in PCB manufacturing. CAM turns digital designs into instructions that machines can use to actually build the PCB.
AIM Solder Signs Shinil Fl Ltd. as New Distributor for Korea
05/08/2024 | AIM SolderAIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce a new distribution partnership with Shinil Fl Ltd., a prominent supplier of technological solutions in the SMT and semiconductor sectors.
Indium Corporation to Showcase HIA Materials at ECTC
05/07/2024 | Indium CorporationAs an industry leader in innovative materials solutions for semiconductor packaging and assembly, Indium Corporation® will feature its advanced products designed to meet the evolving challenges of heterogeneous integration and assembly (HIA) and fine-pitch system-in-package (SiP) applications at the 74th Electronic Components and Technology Conference (ECTC), May 28‒31, in Denver, Colorado.
Indium Corporation Expert to Present on Pb-Free Solder for Die-Attach in Discrete Power Applications
04/30/2024 | Indium CorporationIndium Corporation Product Manager – Semiconductor Dean Payne will present at the Advanced Packaging for Power Electronics conference, hosted by IMAPS, held May 8-9 in Woburn, Massachusetts, USA.
Taiyo Circuit Automation Installs New DP3500 into Fuba Printed Circuits, Tunisia
04/25/2024 | Taiyo Circuit AutomationTaiyo Circuit Automation is proud to be partnered with Fuba Printed Circuits, Tunisia part of the OneTech Group of companies, a leading printed circuit board manufacturer based out of Bizerte, Tunisia, on their first installation of Taiyo Circuit Automation DP3500 coater.