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Designers Notebook: Impact of Advanced Semiconductor Packaging on PCB Stackup

01/07/2025 | Vern Solberg -- Column: Designer's Notebook
To accommodate new generations of high I/O semiconductor packaging, printed circuit board fabrication technology has had to undergo significant changes in both the process methods and the criteria for base material selection and construction sequence (stackup). Many of the new high-function multi-core semiconductor package families require more terminals than their predecessors, requiring a significantly narrower terminal pitch. Interconnecting these very fine-pitch, high I/O semiconductors to the PCB is made possible by an intermediate element referred to as an interposer.

Focus on electronica: Standards and the Factory of the Future

01/08/2025 | I-Connect007 Editorial Team
Dr. Thomas Marktscheffel, director of product management software solutions for ASMPT, gave a presentation at electronica 2024 titled Standards Driving the Factory of the Future. We asked Thomas to share his thoughts about the class, why this topic is so important, and what he hoped attendees would take away from his class.

Altus Highlights Heller Industries Advances in Void Reduction Under 1%

01/06/2025 | Altus Group
Altus Group, a leading distributor of capital equipment in the UK and Ireland, emphasises the importance of reducing voids in reflow soldering to improve manufacturing efficiency and product reliability

BOOK EXCERPT: The Printed Circuit Designer’s Guide to... High Performance Materials, Chapter 4

01/02/2025 | I-Connect007
In Chapter 4, Michael Gay discusses the two main types of copper foil used for PCB boards today: electrodeposited (ED) foil and rolled annealed (RA) foil. He also explains the pros and cons of each, and provides an update of the latest innovations in copper foil technology.

Laser Photonics Propels R&D Efforts in PCB Depaneling

01/01/2025 | BUSINESS WIRE
Laser Photonics Corporation, a leading global developer of industrial laser systems for cleaning and other material processing applications, and its subsidiary, Control Micro Systems (CMS Laser), announced the expansion of their Printed Circuit Board (PCB) Depaneling technology development project for the electronics market.
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